DATA TRANSMISSION APPARATUS AND DATA TRANSMISSION SYSTEM

    公开(公告)号:US20220261371A1

    公开(公告)日:2022-08-18

    申请号:US17651763

    申请日:2022-02-18

    Inventor: Yu ZHANG Jianan HAO

    Abstract: The present disclosure provides a data transmission apparatus and a data transmission system. The data transmission apparatus comprises a first transmission unit and a second transmission unit. The first transmission unit comprises a plurality of sensor interfaces and is configured to receive sensor data from a plurality of sensors through the plurality of sensor interfaces, and the second transmission unit comprises a computing system interface and is configured to receive the sensor data from the first transmission unit and to send the sensor data to a computing system through the computing system interface.

    CONTROL DEVICE
    2.
    发明公开
    CONTROL DEVICE 审中-公开

    公开(公告)号:US20240090174A1

    公开(公告)日:2024-03-14

    申请号:US18514206

    申请日:2023-11-20

    CPC classification number: H05K7/20409 H05K1/0209 H05K7/20727

    Abstract: The present disclosure discloses a control device, which comprises: a circuit board; a heat dissipation cover comprising a heat dissipation cover plate and a plurality of heat dissipation fins arranged on the heat dissipation cover plate, wherein the heat dissipation cover plate covers the circuit board, and a groove is formed between the plurality of heat dissipation fins; a thermally conductive strip disposed between the circuit board and the heat dissipation cover plate; and a fan arranged in the groove. The heat dissipation cover disclosed herein covers the circuit board as a holistic upper cover, the heat of the circuit board is conducted to the heat dissipation cover through the thermally conductive strip, and the fan in the through groove generate an airflow to dissipate heat, thereby realizing sealing, dustproof and heat dissipation of the circuit board simultaneously.

    DATA DISTRIBUTION DEVICE, DATA DISTRIBUTION METHOD AND RELATED COMPUTING SYSTEM

    公开(公告)号:US20230205721A1

    公开(公告)日:2023-06-29

    申请号:US18145013

    申请日:2022-12-21

    Inventor: Yu ZHANG Jianan HAO

    CPC classification number: G06F13/4221 G06F2213/0026

    Abstract: The present disclosure provides a data distribution device, a computing system and a data distribution method. The data distribution device comprises: a plurality of interfaces at least comprising a first interface, a second interface and a third interface, wherein the first interface is configured for receiving first data comprising sensor data, the second interface is configured for outputting the first data, and the third interface is configured for communicating with a first computing unit; and a data transmission unit configured for providing the sensor data from the first interface to the second interface and providing a subset of the sensor data meeting a predetermined condition to the third interface. According to the above technical solution, efficiency and flexibility of data processing can be improved by utilizing the plurality of interfaces and the data transmission unit of the data distribution device.

    CONTROL DEVICE
    4.
    发明申请

    公开(公告)号:US20220256741A1

    公开(公告)日:2022-08-11

    申请号:US17650074

    申请日:2022-02-04

    Abstract: The present disclosure discloses a control device, which comprises: a circuit board; a heat dissipation cover comprising a heat dissipation cover plate and a plurality of heat dissipation fins arranged on the heat dissipation cover plate, wherein the heat dissipation cover plate covers the circuit board, and a groove is formed between the plurality of heat dissipation fins; a thermally conductive strip disposed between the circuit board and the heat dissipation cover plate; and a fan arranged in the groove. The heat dissipation cover disclosed herein covers the circuit board as a holistic upper cover, the heat of the circuit board is conducted to the heat dissipation cover through the thermally conductive strip, and the fan in the through groove generate an airflow to dissipate heat, thereby realizing sealing, dustproof and heat dissipation of the circuit board simultaneously.

Patent Agency Ranking