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公开(公告)号：US20190069842A1
公开(公告)日：2019-03-07
申请号：US16122956
申请日：2018-09-06
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Gregg Fergus , Keith G. Fife , Tyler S. Ralston , Nevada J. Sanchez , Jaime Scott Zahorian , Kailiang Chen , Christopher Thomas McNulty
Abstract: Aspects of the technology described herein relate to an apparatus including an ultrasound-on-a-chip device configured to be bound to a user's wrist. The ultrasound-on-a-chip device may include a two-dimensional array of ultrasonic transducers. The transducers may be capacitive micromachined ultrasonic transducers (CMUTs) and may be configured to emit ultrasound waves having a frequency between approximately 5-20 MHz. A coupling strip may be coupled to the ultrasound-on-a-chip device to reduce the air gap between the ultrasound-on-a-chip device and the user's wrist. The ultrasound-on-a-chip device may be waterproof and may be able to perform both transverse and longitudinal ultrasound scanning without being rotated. The ultrasound-on-a-chip device may be configured to calculate pulse wave velocity through a blood vessel in a user's wrist.
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公开(公告)号：US10196261B2
公开(公告)日：2019-02-05
申请号：US15453846
申请日：2017-03-08
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston , Jaime Scott Zahorian
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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公开(公告)号：US20190000418A1
公开(公告)日：2019-01-03
申请号：US16112436
申请日：2018-08-24
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Nevada J. Sanchez , Tyler S. Ralston , Christopher Thomas McNulty , Jaime Scott Zahorian , Paul Francis Cristman , Matthew de Jonge , Keith G. Fife
Abstract: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.
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公开(公告)号：US20180364201A1
公开(公告)日：2018-12-20
申请号：US16109703
申请日：2018-08-22
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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公开(公告)号：US20180321365A1
公开(公告)日：2018-11-08
申请号：US16035552
申请日：2018-07-13
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Tyler S. Ralston , Keith G. Fife
IPC: G01S7/521 , G01S7/52 , G01S15/89 , H03K17/687
CPC classification number: G01S7/521 , G01S7/52017 , G01S7/5202 , G01S7/52047 , G01S7/5208 , G01S15/8915 , H03K17/6874
Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.
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Patent Agency Ranking
公开(公告)号：US10082565B2
公开(公告)日：2018-09-25
申请号：US15087914
申请日：2016-03-31
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Tyler S. Ralston , Keith G. Fife
CPC classification number: G01S7/52022 , A61B7/04 , G01S7/52017 , G01S7/5202 , G01S7/52047 , G01S7/5208 , G01S7/521 , G01S15/8915 , G01S15/8977
Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.
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公开(公告)号：US20180133756A1
公开(公告)日：2018-05-17
申请号：US15868989
申请日：2018-01-11
Applicant: Butterfly Network, Inc.
Inventor： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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18.发明申请公开(公告)号：US20180070925A1
公开(公告)日：2018-03-15
申请号：US15263939
申请日：2016-09-13
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Keith G. Fife
CPC classification number: A61B8/56 , A61B8/5207 , A61B8/54 , G01S7/52033 , H03M1/0617 , H03M1/1245 , H03M1/129
Abstract: A time gain compensation (TGC) circuit for an ultrasound device includes a first amplifier having an integrating capacitor and a control circuit configured to generate a TGC control signal that controls an integration time of the integrating capacitor, thereby controlling a gain of the first amplifier. The integration time is an amount of time an input signal is coupled to the first amplifier before the input signal is isolated from the first amplifier.
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公开(公告)号：US20170322293A1
公开(公告)日：2017-11-09
申请号：US15659134
申请日：2017-07-25
Applicant: Butterfly Network, Inc.
Inventor： Kailiang Chen , Tyler S. Ralston , Keith G. Fife
IPC: G01S7/521 , H03K17/687
CPC classification number: G01S7/521 , G01S7/52017 , G01S7/5202 , G01S7/52047 , G01S7/5208 , G01S15/8915 , H03K17/6874
Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.
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公开(公告)号：US20170315099A1
公开(公告)日：2017-11-02
申请号：US15648187
申请日：2017-07-12
Applicant: Butterfly Network Inc.
Inventor： Jonathan M. Rothberg , Susan A. Alie , Keith G. Fife , Nevada J. Sanchez , Tyler S. Ralston
CPC classification number: G01N29/2406 , A61B8/4483 , B06B1/0292 , B81B7/007 , B81B2201/0271 , B81C1/00238 , B81C1/00301 , B81C2201/019 , B81C2203/036 , B81C2203/0792 , H01L2224/4813 , H01L2924/0002 , H01L2924/146 , H01L2924/1461
Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
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