公开(公告)号：US10266401B2

公开(公告)日：2019-04-23

申请号：US15910776

申请日：2018-03-02

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: H01L29/84 ,  B81C1/00 ,  B06B1/02 ,  G01N29/24 ,  H04R19/00 ,  B81B7/00

Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.

公开(公告)号：US20190069842A1

公开(公告)日：2019-03-07

申请号：US16122956

申请日：2018-09-06

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Gregg Fergus ,  Keith G. Fife ,  Tyler S. Ralston ,  Nevada J. Sanchez ,  Jaime Scott Zahorian ,  Kailiang Chen ,  Christopher Thomas McNulty

IPC: A61B5/00 ,  A61B8/00 ,  A61B8/02 ,  A61B8/04 ,  A61B5/021

Abstract: Aspects of the technology described herein relate to an apparatus including an ultrasound-on-a-chip device configured to be bound to a user's wrist. The ultrasound-on-a-chip device may include a two-dimensional array of ultrasonic transducers. The transducers may be capacitive micromachined ultrasonic transducers (CMUTs) and may be configured to emit ultrasound waves having a frequency between approximately 5-20 MHz. A coupling strip may be coupled to the ultrasound-on-a-chip device to reduce the air gap between the ultrasound-on-a-chip device and the user's wrist. The ultrasound-on-a-chip device may be waterproof and may be able to perform both transverse and longitudinal ultrasound scanning without being rotated. The ultrasound-on-a-chip device may be configured to calculate pulse wave velocity through a blood vessel in a user's wrist.

公开(公告)号：US10196261B2

公开(公告)日：2019-02-05

申请号：US15453846

申请日：2017-03-08

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Jaime Scott Zahorian

IPC: B81B3/00 ,  B81C3/00 ,  H04R1/00 ,  B81C1/00 ,  B81B7/00 ,  B06B1/06 ,  B06B1/02

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US20190000418A1

公开(公告)日：2019-01-03

申请号：US16112436

申请日：2018-08-24

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Nevada J. Sanchez ,  Tyler S. Ralston ,  Christopher Thomas McNulty ,  Jaime Scott Zahorian ,  Paul Francis Cristman ,  Matthew de Jonge ,  Keith G. Fife

IPC: A61B8/00 ,  B06B1/06 ,  A61B8/08 ,  A61B8/12 ,  B06B1/02

Abstract: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.

公开(公告)号：US20180364201A1

公开(公告)日：2018-12-20

申请号：US16109703

申请日：2018-08-22

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Susan A. Alie ,  Keith G. Fife ,  Nevada J. Sanchez ,  Tyler S. Ralston

IPC: G01N29/24 ,  B81C1/00 ,  B81B7/00 ,  A61B8/00 ,  B06B1/02

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

公开(公告)号：US20180321365A1

公开(公告)日：2018-11-08

申请号：US16035552

申请日：2018-07-13

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston ,  Keith G. Fife

IPC: G01S7/521 ,  G01S7/52 ,  G01S15/89 ,  H03K17/687

CPC classification number: G01S7/521 ,  G01S7/52017 ,  G01S7/5202 ,  G01S7/52047 ,  G01S7/5208 ,  G01S15/8915 ,  H03K17/6874

Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.

公开(公告)号：US10082565B2

公开(公告)日：2018-09-25

申请号：US15087914

申请日：2016-03-31

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston ,  Keith G. Fife

IPC: G01S7/52 ,  G01S7/521 ,  G01S15/89 ,  A61B7/04

CPC classification number: G01S7/52022 ,  A61B7/04 ,  G01S7/52017 ,  G01S7/5202 ,  G01S7/52047 ,  G01S7/5208 ,  G01S7/521 ,  G01S15/8915 ,  G01S15/8977

Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.

公开(公告)号：US10082488B2

公开(公告)日：2018-09-25

申请号：US14957443

申请日：2015-12-02

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston

IPC: G01N29/11 ,  G01N29/06 ,  G01N29/44

CPC classification number: G01N29/11 ,  G01N29/0654 ,  G01N29/44 ,  G01N2291/015 ,  G01N2291/02475 ,  H03H7/25

Abstract: An ultrasound device, including a profile generator, an encoder configured to receive a profile signal from the profile generator, and an attenuator configured to receive a signal representing an output of an ultrasound sensor and coupled to the encoder to receive a control signal from the encoder, the attenuator including a plurality of attenuator stages, the attenuator configured to produce an output signal that is an attenuated version of the input signal.

公开(公告)号：US20180133756A1

公开(公告)日：2018-05-17

申请号：US15868989

申请日：2018-01-11

Applicant: Butterfly Network, Inc.

Inventor： Jonathan M. Rothberg ,  Keith G. Fife ,  Tyler S. Ralston ,  Gregory L. Charvat ,  Nevada J. Sanchez

IPC: B06B1/02 ,  B81B3/00 ,  G10K11/18 ,  G10K9/12 ,  B81C1/00

Abstract: CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.

公开(公告)号：US20170322293A1

公开(公告)日：2017-11-09

申请号：US15659134

申请日：2017-07-25

Applicant: Butterfly Network, Inc.

Inventor： Kailiang Chen ,  Tyler S. Ralston ,  Keith G. Fife

IPC: G01S7/521 ,  H03K17/687

CPC classification number: G01S7/521 ,  G01S7/52017 ,  G01S7/5202 ,  G01S7/52047 ,  G01S7/5208 ,  G01S15/8915 ,  H03K17/6874

Abstract: Circuitry for ultrasound devices is described. A multilevel pulser is described, which can provide bipolar pulses of multiple levels. The multilevel pulser includes a pulsing circuit and pulser and feedback circuit. Symmetric switches are also described. The symmetric switches can be positioned as inputs to ultrasound receiving circuitry to block signals from the receiving circuitry.