公开(公告)号：US20220239198A1

公开(公告)日：2022-07-28

申请号：US17156085

申请日：2021-01-22

Applicant: CISCO TECHNOLOGY, INC.

Inventor： M. Baris Dogruoz ,  Mark Nowell ,  Yi Tang ,  Rakesh Chopra ,  Mandy Hin Lam

IPC: H02K9/22 ,  H02K9/10 ,  H02K9/26

Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.

公开(公告)号：US20210282301A1

公开(公告)日：2021-09-09

申请号：US16928279

申请日：2020-07-14

Applicant: Cisco Technology, Inc.

Inventor： M. Baris Dogruoz ,  Mandy Hin Lam ,  Mark Nowell ,  Rakesh Chopra

IPC: H05K7/20 ,  F28F13/00

Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.

公开(公告)号：US20210235597A1

公开(公告)日：2021-07-29

申请号：US16922177

申请日：2020-07-07

Applicant: Cisco Technology, Inc.

Inventor： Rakesh Chopra ,  M. Baris Dogruoz ,  Mark Nowell ,  Mandy Hin Lam

IPC: H05K7/20 ,  H05K7/14

Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.