System and method for vapor deposition coating of extrusion dies using impedance disks

    公开(公告)号:US11697873B2

    公开(公告)日:2023-07-11

    申请号:US17414569

    申请日:2019-12-13

    Abstract: Methods of depositing an inorganic material on an extrusion die including positioning an extrusion die within a vapor deposition chamber, positioning an impedance disk over a face of the extrusion die, the impedance disk having a plurality of through holes and the face of the extrusion die having a plurality of slots defined by a plurality of extrusion die pins, and flowing one or more deposition gases through the plurality of through holes and into the plurality of slots to deposit inorganic particles on side walls of the plurality of pins. The total impedance to the flow of the deposition gases across the impedance disk and the extrusion die may be equal to a disk impedance of the impedance disk plus a die impedance of the extrusion die, and the disk impedance may be at least 40% of the total impedance to the flow of the deposition gases.

    SEGMENTED HONEYCOMB HEATER
    12.
    发明申请

    公开(公告)号:US20220389851A1

    公开(公告)日:2022-12-08

    申请号:US17752353

    申请日:2022-05-24

    Inventor: Min Shen

    Abstract: An exhaust gas heating system is provided, comprising a first end face, a second end face, a plurality of honeycomb segments, and a plurality of electrically nonconductive layers. Each honeycomb segment comprises an array of intersecting walls forming channels extending axially between the first end face and the second end face. The intersecting walls comprise an electrically conductive material. The heater further comprises a plurality of electrically nonconductive layers arranged between adjacent segments of the honeycomb segments. The arrays of intersecting walls of the honeycomb segments are electrically isolated from each other by the nonconductive layers. The exhaust gas heating system further comprises a coil wrapped around an external surface of the heater arranged between the first end face and the second end face. The exhaust gas heating system further comprises a DC to AC converter configured to supply the coil with an AC current.

    EXTRUSION COMPONENTS FOR HONEYCOMB BODIES
    14.
    发明申请

    公开(公告)号:US20190030753A1

    公开(公告)日:2019-01-31

    申请号:US16077122

    申请日:2017-02-13

    Abstract: A honeycomb extrusion die assembly (10) comprising a honeycomb extrusion die (701) and a forming plate (800) to block batch flow to at least a portion of a skin forming region. The honeycomb extrusion die (701) comprising a step cut discharge surface (758, 760) in the skin forming region and at least some slots (722) each with a divot (312) spaced toward a discharge surface (710) from a feedhole-slot intersection and a wide portion at the discharge surface (710) extending into the die body to the divot (312) to strengthen a peripheral region of a honeycomb extrudate in a reinforcement region, and a bulk nominal section corresponding to a bulk region of the honeycomb body.

    Honeycomb extrusion dies and forming methods

    公开(公告)号:US12109727B2

    公开(公告)日:2024-10-08

    申请号:US17608765

    申请日:2020-05-13

    CPC classification number: B28B3/269

    Abstract: A honeycomb extrusion die (120) includes a die body (342) including an inlet face (315) and an outlet face (341). A plurality of pins (330) extend from the die body (342), wherein the pins (330) are arranged to define primary (312P) and secondary slots (312S). Primary slots (312P) include primary slot inlets (320P) and primary slot outlets (3120) and the secondary slots (312S) include secondary slot inlets (312SI) and secondary slot outlets (312SO). Feedholes (317) extend within the die body (342), the feedholes (317) including feedhole outlets (319), wherein the feedhole outlets (319) intersect only with the primary slot inlets (320P). First surface indentation features (345) extend into side surfaces (332) of the plurality of pins (330) defining the primary slots (312P). The first surface indentation features (345) are spaced from the primary slot outlets (3120). The secondary slots (312S) are devoid of surface indentation features. Other die bodies, extruders, and methods are disclosed.

    REUSABLE FIXTURE ASSEMBLY FOR SLITTING A WORKPIECE INTO A SERPENTINE BODY

    公开(公告)号:US20240123647A1

    公开(公告)日:2024-04-18

    申请号:US18376620

    申请日:2023-10-04

    Inventor: Song Lyu Min Shen

    CPC classification number: B26F3/004

    Abstract: A fixture assembly for slitting a workpiece into a serpentine body, a cutting system having a fixture assembly, and a method of forming a serpentine body. The fixture assembly includes a patterned support section that has a plurality of support slats interspaced with gaps. A holder plate has an opening configured to receive the workpiece and positioned atop the patterned support section such that intended cutting locations in the workpiece are positioned directly above the gaps in the patterned support section and the slats are positioned directly below uncut portions of the serpentine body after cutting the workpiece.

    Honeycomb extrusion dies and forming methods

    公开(公告)号:US11752679B2

    公开(公告)日:2023-09-12

    申请号:US17058397

    申请日:2019-05-30

    Abstract: A honeycomb extrusion die (120) includes a die body (302) including an inlet face (306) and an exit face. The die body (302) has slot inlets (309) and a plurality of pins (320, 500) disposed between the slot inlets (309) and the exit face. The plurality of pins (320, 500) include side surfaces (322, 500B) configured to define a matrix of intersecting slots (324), wherein the matrix of intersecting slots (324) has slot exit (509) widths at the exit face. Divots (526) extend into a plurality of the side surfaces (322, 500B) between the slot inlets (309) and the exit face. Each individual divot (526) has a divot depth (D55) extending into a side surface (500A, 500B, 502A, 502B) of the side surfaces (322, 500B). A ratio between a slot exit width (W53) W53 of an individual slot (324) and the divot depth (D55) of an individual divot (526) extending into a side surface (500A, 500B, 502A, 502B) of the individual slot (324) is greater than 1.2. Methods of forming honeycomb bodies with honeycomb structures are provided, as are other aspects.

    ELECTRICALLY HEATED FLUID TREATMENT SYSTEM FOR LOW AND HIGH VOLTAGE APPLICATIONS

    公开(公告)号:US20230151750A1

    公开(公告)日:2023-05-18

    申请号:US17962850

    申请日:2022-10-10

    CPC classification number: F01N3/2026 F01N3/2803

    Abstract: A heater for treatment of a fluid flow, a method of manufacturing a heater, and method of treating an exhaust gas with a heater. The heater includes a honeycomb structure including an array of intersecting walls defining channels extending axially between a first face and a second face. The intersecting walls comprise a thermally conductive material. A resistive heating element is engaged against the first face of the honeycomb structure. The heating element comprises an electrically conductive element coated with a thermally-conductive electrical insulator. The thermally-conductive insulator electrically insulates the electrically conductive element from the honeycomb structure.

    SYSTEM AND METHOD FOR VAPOR DEPOSITION COATING OF EXTRUSION DIES USING IMPEDANCE DISKS

    公开(公告)号:US20220056579A1

    公开(公告)日:2022-02-24

    申请号:US17414569

    申请日:2019-12-13

    Abstract: Methods of depositing an inorganic material on an extrusion die including positioning an extrusion die within a vapor deposition chamber, positioning an impedance disk over a face of the extrusion die, the impedance disk having a plurality of through holes and the face of the extrusion die having a plurality of slots defined by a plurality of extrusion die pins, and flowing one or more deposition gases through the plurality of through holes and into the plurality of slots to deposit inorganic particles on side walls of the plurality of pins. The total impedance to the flow of the deposition gases across the impedance disk and the extrusion die may be equal to a disk impedance of the impedance disk plus a die impedance of the extrusion die, and the disk impedance may be at least 40% of the total impedance to the flow of the deposition gases.

Patent Agency Ranking