公开(公告)号：US20190311837A1

公开(公告)日：2019-10-10

申请号：US16451035

申请日：2019-06-25

Applicant: CYNTEC CO., LTD.

Inventor： Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

IPC: H01F27/255 ,  H01F5/00 ,  H01F27/24 ,  H01F27/32 ,  B22F3/16 ,  H01F1/22 ,  B22F7/08 ,  H01F17/04 ,  B22F3/12 ,  H05K1/18 ,  H01F27/28 ,  H01F41/02 ,  B22F5/00

Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is greater than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

公开(公告)号：US20150023829A1

公开(公告)日：2015-01-22

申请号：US14507849

申请日：2014-10-07

Applicant: CYNTEC CO., LTD.

Inventor： Wen-Hsiung Liao ,  Roger Hsieh ,  Hideo Ikuta ,  Yueh-Lang Chen

IPC: B22F3/12 ,  B22F7/08 ,  H01F1/22 ,  B22F5/00

CPC classification number: H01F27/255 ,  B22F3/12 ,  B22F3/16 ,  B22F5/00 ,  B22F7/08 ,  H01F1/22 ,  H01F17/04 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/292 ,  H01F27/32 ,  H01F41/0246 ,  H01F2017/048 ,  H05K1/18

Abstract: A method for manufacturing an electronic device, the method comprising: providing a conducting wire; forming a mixture with the conducting wire buried therein, wherein the mixture comprises: a first magnetic powder and a second magnetic powder, wherein the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder by a first hardness difference; and performing a molding process on the conducting wire and the mixture, wherein by means of the first hardness difference of the first magnetic powder and the second magnetic powder, the mixture and the conducting wire buried therein are combined to form an integral magnetic body at a temperature lower than the melting point of the conducting wire.

Abstract translation: 一种电子设备的制造方法，所述方法包括：提供导线; 与埋入其中的导线形成混合物，其中所述混合物包括：第一磁粉和第二磁粉，其中所述第一磁粉的平均粒径大于所述第二磁粉的平均粒径， 第一磁粉的维克氏硬度大于第二磁粉的维氏硬度第一硬度差; 对所述导线和所述混合物进行成型处理，其中，通过所述第一磁性粉末和所述第二磁性粉末的所述第一硬度差，将所述混合物和埋入其中的所述导线组合在一起形成一体磁性体 温度低于导线的熔点。