公开(公告)号：US4622108A

公开(公告)日：1986-11-11

申请号：US859671

申请日：1986-05-05

申请人： Frank Polakovic ,  Anthony M. Piano

发明人： Frank Polakovic ,  Anthony M. Piano

IPC分类号： C25D5/56 ,  H05K3/18 ,  H05K3/42 ,  C25D5/02 ,  C25D5/54

CPC分类号： H05K3/188 ,  C25D5/56 ,  H05K3/424 ,  H05K2201/0323 ,  H05K2203/122 ,  H05K3/427 ,  Y10S205/917

摘要： An improvement to the process for electroplating a conductive metal layer to the surface of a non-conductive material which comprises:(a) contacting said printed wiring board having said through holes with an alkaline dispersion of carbon black comprised of:(1) carbon black particles having an average particle diameter of less than about 3.0 microns in said dispersion;(2) an effective dispersing amount of a surfactant which is compatible with said carbon black; and(3) liquid dispersing medium, wherein the amount of carbon black is sufficient to coat substantially all of said non-conducting surfaces and is less than about 4% by weight of said liquid dispersion;(b) separating substantially all of said liquid dispersing medium from said carbon black particles, whereby said particles are deposited on said non-conductive surface in a substantially continuous layer; and(c) electroplating a substantially continuous conductive metal layer over the deposited carbon black layer and said non-conductive surface, thereby electrically connecting said metal layer of said printed wiring board;the improvement which comprises:contacting the non-conducting portions of said through holes immediately before step (a) with a pre-conditioning solution comprising an aqueous solution of an alkaline hydroxide wherein the alkaline hydroxide is present in a sufficient amount to wet said non-conductive portions of said through holes.

摘要翻译： 将导电金属层电镀到非导电材料的表面的方法的改进包括：（a）使具有所述通孔的所述印刷线路板与炭黑的碱性分散体接触，所述碱性分散体包括：（1）炭黑 所述分散体中平均粒径小于约3.0微米的颗粒; （2）与所述炭黑相容的表面活性剂的有效分散量; 和（3）液体分散介质，其中炭黑的量足以涂覆基本上所有的所述非导电表面，并且小于所述液体分散体的约4重量％; （b）将基本上所有的所述液体分散介质与所述炭黑颗粒分离，由此所述颗粒以基本上连续的层沉积在所述非导电表面上; 以及（c）在沉积的炭黑层和所述非导电表面上电镀基本上连续的导电金属层，从而电连接所述印刷线路板的所述金属层; 其改进包括：将步骤（a）之前的所述通孔的非导电部分与包含碱性氢氧化物的水溶液的预处理溶液接触，其中碱性氢氧化物以足够的量存在， 所述通孔的导电部分。

公开(公告)号：US06454868B1

公开(公告)日：2002-09-24

申请号：US09550881

申请日：2000-04-17

申请人： Frank Polakovic ,  William Yang ,  Charles Edwin Thorn ,  Michael Val Carano ,  Beth Ann LaFayette

发明人： Frank Polakovic ,  William Yang ,  Charles Edwin Thorn ,  Michael Val Carano ,  Beth Ann LaFayette

IPC分类号： C03C2300

CPC分类号： H05K3/0055 ,  H05K2203/0783 ,  H05K2203/0796

摘要： A desmear process for removing resin smeared on an interior wall of a through hole drilled in a resinous substrate, especially resinous substrates made from epoxy, polyimide, cyanate ester resins or bis-maleimide triazine epoxy resins. The process involves contacting the resin smear with a mixture of gamma-butyrolactone and water to soften the resin smear, followed by treatment with an alkaline permanganate solution to remove the softened resin, and treatment with an aqueous acidic neutralizer to neutralize and remove the permanganate residues. The gamma-butyrolactone is effective as a single solvent for softening and swelling resin smears from substrates made from epoxy, polyimide, cyanate ester resins, bis-maleimide triazine epoxy resins, and polyimide resins.

摘要翻译： 用于去除在树脂基材中钻孔的通孔的内壁上涂抹的树脂的去污工艺，特别是由环氧树脂，聚酰亚胺，氰酸酯树脂或双马来酰亚胺三嗪环氧树脂制成的树脂基材。 该方法包括使树脂涂片与γ-丁内酯和水的混合物接触以软化树脂涂片，然后用碱性高锰酸盐溶液处理以除去软化树脂，并用酸性中和剂水溶液处理以中和除去高锰酸盐残留物 。 γ-丁内酯作为用于使由环氧树脂，聚酰亚胺，氰酸酯树脂，双马来酰亚胺三嗪环氧树脂和聚酰亚胺树脂制成的基材的树脂涂片软化和溶胀的单一溶剂是有效的。

公开(公告)号：US06440331B1

公开(公告)日：2002-08-27

申请号：US09325072

申请日：1999-06-03

申请人： Michael V. Carano ,  Frank Polakovic

发明人： Michael V. Carano ,  Frank Polakovic

IPC分类号： H01B106

CPC分类号： H01B1/20 ,  C25D5/56 ,  H01B1/22 ,  H01B1/24 ,  H05K1/095 ,  H05K3/424

摘要： A composition and method for applying an electrically conductive coating to an initially electrically nonconductive surface, such as a printed wiring board having through holes is disclosed. The method is carried out by applying a composition of electrically conductive carbon particles, a second conductive material, a water dispersible binding agent, and an aqueous dispersing medium to a nonconductive substrate to form a substantially continuous, electrically conductive coating. Enough of the carbon particles are present to provide an electrically conductive coating when the composition is applied to the substrate. Enough of the second conductive material is present to provide an improved electrically conductive coating when the composition is applied to the substrate. The resulting coating carbon coating has an improved conductivity over prior through hole coating compositions and processes and is capable of being exposed to molten solder without resulting in the formation of blowholes.

摘要翻译： 公开了一种用于将导电涂层施加到初始不导电表面的组合物和方法，例如具有通孔的印刷线路板。 该方法通过将导电碳颗粒，第二导电材料，水分散性结合剂和水性分散介质的组合物施加到非导电基材上以形成基本上连续的导电涂层来进行。 存在足够的碳颗粒以在组合物施加到基底上时提供导电涂层。 存在足够的第二导电材料以在将组合物施加到基底时提供改进的导电涂层。 所得涂层碳涂层具有比以前的通孔涂层组合物和工艺更好的导电性，并且能够暴露于熔融焊料而不会形成气孔。

公开(公告)号：US06375731B1

公开(公告)日：2002-04-23

申请号：US09478587

申请日：2000-01-06

申请人： Michael V. Carano ,  Frank Polakovic

发明人： Michael V. Carano ,  Frank Polakovic

IPC分类号： C09D500

CPC分类号： H05K3/424

摘要： A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and conditioned surface. The clean and conditioned surface is coated with conductive carbon particles (usually graphite) to provide a carbon-coated surface. The carbon-coated surface is electro plated and then soldered using hot solder. Those surfaces that have been soldered and also treated with the composition of the invention exhibit fewer blow hole problems. The composition of the invention comprises a cationic conditioning agent and one of a binder or an anionic dispersant that improve the adhesion and coverage of a coating containing graphite to a surface defined by a through hole bore or other substrate. (“Through holes” as used herein refers both to through holes and to vias.)

摘要翻译： 公开了一种用于清洁和调节由印刷电路板（PCB）中的通孔限定的非导电表面的组合物和方法。 通孔表面与本发明的组合物接触以提供清洁和调理的表面。 清洁和调理表面涂覆有导电碳颗粒（通常为石墨），以提供碳涂层表面。 碳涂层表面电镀，然后使用热焊料焊接。 已经焊接并且用本发明的组合物处理的那些表面表现出较少的孔洞问题。 本发明的组合物包含阳离子调理剂和粘合剂或阴离子分散剂之一，其改善了包含石墨的涂层对由通孔或其它基材限定的表面的粘附和覆盖。 （本文所用的“通孔”是指通孔和通孔）。

公开(公告)号：US5985040A

公开(公告)日：1999-11-16

申请号：US157909

申请日：1998-09-21

申请人： Michael V. Carano ,  Frank Polakovic ,  Beth Ann LaFayette

发明人： Michael V. Carano ,  Frank Polakovic ,  Beth Ann LaFayette

IPC分类号： H05K3/00 ,  C03C23/00 ,  C11D9/04 ,  C23G1/02

CPC分类号： H05K3/0055 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K2203/0796

摘要： An improved desmear process for removing resin smeared on an interior wall of a through hole drilled in a resinous substrate, especially resinous substrates made from epoxy, polyimide, cyanate ester resins and bis-maleimide triazine epoxy resins. The process involves contacting the resin smear with a solvent solution to soften the resin smear, followed by treatment with an alkaline permanganate solution to remove the softened resin, and treatment with a neutralizer to neutralize and remove the permanganate residues. The solvent solution comprises a mixture of at least two solvent components, with at least one solvent component being selected from the group consisting of gamma-butyrolactone, ethyl-3-ethoxypropionate, N-ethyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-(2-hydroxyethyl)-2-pyrrolidone, and N-octyl-2-pyrrolidone. The solvent solution is selective for the softening and removal of epoxy, polyimide, cyanate ester resins and bis-maleimide triazine epoxy resins.

摘要翻译： 用于去除在树脂基材中钻出的通孔的内壁上涂抹的树脂的改进的去污工艺，特别是由环氧树脂，聚酰亚胺，氰酸酯树脂和双马来酰亚胺三嗪环氧树脂制成的树脂基材。 该方法包括使树脂涂片与溶剂溶液接触以软化树脂涂片，然后用碱性高锰酸盐溶液处理以除去软化树脂，并用中和剂处理以中和除去高锰酸盐残留物。 溶剂溶液包含至少两种溶剂组分的混合物，至少一种溶剂组分选自γ-丁内酯，3-乙氧基丙酸乙酯，N-乙基-2-吡咯烷酮，N-环己基-2- 吡咯烷酮，N-（2-羟乙基）-2-吡咯烷酮和N-辛基-2-吡咯烷酮。 溶剂溶液对于环氧树脂，聚酰亚胺，氰酸酯树脂和双马来酰亚胺三嗪环氧树脂的软化和除去是选择性的。