公开(公告)号：US06691912B2

公开(公告)日：2004-02-17

申请号：US10087051

申请日：2002-03-01

申请人： Michael V. Carano ,  Frank Polakovic

发明人： Michael V. Carano ,  Frank Polakovic

IPC分类号： B23K3102

CPC分类号： H05K3/424

摘要： A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and conditioned surface. The clean and conditioned surface is coated with conductive carbon particles (usually graphite) to provide a carbon-coated surface. The carbon-coated surface is electro plated and then soldered using hot solder. Those surfaces that have been soldered and also treated with the composition of the invention exhibit fewer blow hole problems. The composition of the invention comprises carbonates, binders, and resins, and combinations thereof, that improve the adhesion and coverage of a coating containing graphite to a surface defined by a through hole bore or other substrate. (“Through holes” as used herein refers both to through holes and to vias.)

摘要翻译： 公开了一种用于清洁和调节由印刷电路板（PCB）中的通孔限定的非导电表面的组合物和方法。 通孔表面与本发明的组合物接触以提供清洁和调理的表面。 清洁和调理表面涂覆有导电碳颗粒（通常为石墨），以提供碳涂层表面。 碳涂层表面电镀，然后使用热焊料焊接。 已经焊接并且用本发明的组合物处理的那些表面表现出较少的孔洞问题。 本发明的组合物包括碳酸盐，粘合剂和树脂及其组合，其改善了包含石墨的涂层在由通孔或其它基底限定的表面上的粘合性和覆盖性。 （本文所用的“通孔”是指通孔和通孔）。

公开(公告)号：US06440331B1

公开(公告)日：2002-08-27

申请号：US09325072

申请日：1999-06-03

申请人： Michael V. Carano ,  Frank Polakovic

发明人： Michael V. Carano ,  Frank Polakovic

IPC分类号： H01B106

CPC分类号： H01B1/20 ,  C25D5/56 ,  H01B1/22 ,  H01B1/24 ,  H05K1/095 ,  H05K3/424

摘要： A composition and method for applying an electrically conductive coating to an initially electrically nonconductive surface, such as a printed wiring board having through holes is disclosed. The method is carried out by applying a composition of electrically conductive carbon particles, a second conductive material, a water dispersible binding agent, and an aqueous dispersing medium to a nonconductive substrate to form a substantially continuous, electrically conductive coating. Enough of the carbon particles are present to provide an electrically conductive coating when the composition is applied to the substrate. Enough of the second conductive material is present to provide an improved electrically conductive coating when the composition is applied to the substrate. The resulting coating carbon coating has an improved conductivity over prior through hole coating compositions and processes and is capable of being exposed to molten solder without resulting in the formation of blowholes.

摘要翻译： 公开了一种用于将导电涂层施加到初始不导电表面的组合物和方法，例如具有通孔的印刷线路板。 该方法通过将导电碳颗粒，第二导电材料，水分散性结合剂和水性分散介质的组合物施加到非导电基材上以形成基本上连续的导电涂层来进行。 存在足够的碳颗粒以在组合物施加到基底上时提供导电涂层。 存在足够的第二导电材料以在将组合物施加到基底时提供改进的导电涂层。 所得涂层碳涂层具有比以前的通孔涂层组合物和工艺更好的导电性，并且能够暴露于熔融焊料而不会形成气孔。

公开(公告)号：US06375731B1

公开(公告)日：2002-04-23

申请号：US09478587

申请日：2000-01-06

申请人： Michael V. Carano ,  Frank Polakovic

发明人： Michael V. Carano ,  Frank Polakovic

IPC分类号： C09D500

CPC分类号： H05K3/424

摘要： A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and conditioned surface. The clean and conditioned surface is coated with conductive carbon particles (usually graphite) to provide a carbon-coated surface. The carbon-coated surface is electro plated and then soldered using hot solder. Those surfaces that have been soldered and also treated with the composition of the invention exhibit fewer blow hole problems. The composition of the invention comprises a cationic conditioning agent and one of a binder or an anionic dispersant that improve the adhesion and coverage of a coating containing graphite to a surface defined by a through hole bore or other substrate. (“Through holes” as used herein refers both to through holes and to vias.)

摘要翻译： 公开了一种用于清洁和调节由印刷电路板（PCB）中的通孔限定的非导电表面的组合物和方法。 通孔表面与本发明的组合物接触以提供清洁和调理的表面。 清洁和调理表面涂覆有导电碳颗粒（通常为石墨），以提供碳涂层表面。 碳涂层表面电镀，然后使用热焊料焊接。 已经焊接并且用本发明的组合物处理的那些表面表现出较少的孔洞问题。 本发明的组合物包含阳离子调理剂和粘合剂或阴离子分散剂之一，其改善了包含石墨的涂层对由通孔或其它基材限定的表面的粘附和覆盖。 （本文所用的“通孔”是指通孔和通孔）。

公开(公告)号：US5985040A

公开(公告)日：1999-11-16

申请号：US157909

申请日：1998-09-21

申请人： Michael V. Carano ,  Frank Polakovic ,  Beth Ann LaFayette

发明人： Michael V. Carano ,  Frank Polakovic ,  Beth Ann LaFayette

IPC分类号： H05K3/00 ,  C03C23/00 ,  C11D9/04 ,  C23G1/02

CPC分类号： H05K3/0055 ,  H05K2203/0783 ,  H05K2203/0793 ,  H05K2203/0796

摘要： An improved desmear process for removing resin smeared on an interior wall of a through hole drilled in a resinous substrate, especially resinous substrates made from epoxy, polyimide, cyanate ester resins and bis-maleimide triazine epoxy resins. The process involves contacting the resin smear with a solvent solution to soften the resin smear, followed by treatment with an alkaline permanganate solution to remove the softened resin, and treatment with a neutralizer to neutralize and remove the permanganate residues. The solvent solution comprises a mixture of at least two solvent components, with at least one solvent component being selected from the group consisting of gamma-butyrolactone, ethyl-3-ethoxypropionate, N-ethyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-(2-hydroxyethyl)-2-pyrrolidone, and N-octyl-2-pyrrolidone. The solvent solution is selective for the softening and removal of epoxy, polyimide, cyanate ester resins and bis-maleimide triazine epoxy resins.

摘要翻译： 用于去除在树脂基材中钻出的通孔的内壁上涂抹的树脂的改进的去污工艺，特别是由环氧树脂，聚酰亚胺，氰酸酯树脂和双马来酰亚胺三嗪环氧树脂制成的树脂基材。 该方法包括使树脂涂片与溶剂溶液接触以软化树脂涂片，然后用碱性高锰酸盐溶液处理以除去软化树脂，并用中和剂处理以中和除去高锰酸盐残留物。 溶剂溶液包含至少两种溶剂组分的混合物，至少一种溶剂组分选自γ-丁内酯，3-乙氧基丙酸乙酯，N-乙基-2-吡咯烷酮，N-环己基-2- 吡咯烷酮，N-（2-羟乙基）-2-吡咯烷酮和N-辛基-2-吡咯烷酮。 溶剂溶液对于环氧树脂，聚酰亚胺，氰酸酯树脂和双马来酰亚胺三嗪环氧树脂的软化和除去是选择性的。

公开(公告)号：US5492595A

公开(公告)日：1996-02-20

申请号：US226017

申请日：1994-04-11

申请人： Michael V. Carano ,  Therese M. Harryhill

发明人： Michael V. Carano ,  Therese M. Harryhill

IPC分类号： C23C22/63 ,  C23C22/83 ,  H05K3/38 ,  H05K3/46 ,  B44C1/22 ,  C23F1/00

CPC分类号： C23C22/83 ,  C23C22/63 ,  H05K3/385 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/0723 ,  H05K2203/1157 ,  H05K3/4611 ,  Y10T428/24917

摘要： The present invention is directed to an improved method for treating an oxidized surface of a copper film for bonding to a resinous layer such as in the formation of a single-sided, double-sided, or multi-layered circuit board and to a layered product produced by the method. In particular, the method of the present invention comprises the steps of: contacting the oxidized surface of a copper film, having cupric oxide whiskers protruding therefrom, with an acidic reducing solution having a pH of 1 to 6.5 and having an effective amount of a water soluble thiosulfate reducing agent dissolved therein to provide a reduced copper surface; and rinsing the reduced copper surface with an acidic solution to produce a rinsed and reduced copper surface having reduced whiskers protruding therefrom, said reduced whiskers each being a mix of cuprous oxide and metallic copper. Preferably, the reduced surface is treated with a passivating agent to minimize any reoxidation prior to laminate formation.

摘要翻译： 本发明涉及用于处理例如形成单面，双面或多层电路板的树脂层的铜膜的氧化表面的改进方法和层叠体 由该方法生产。 具体而言，本发明的方法包括以下步骤：将具有从其突出的具有氧化铜晶须的铜膜的氧化表面与pH为1至6.5的酸性还原溶液接触并具有有效量的水 可溶性硫代硫酸盐还原剂溶解在其中以提供还原铜表面; 并用酸性溶液冲洗还原的铜表面，以产生漂白和还原的铜表面，其中从其中突出的晶须减少，所述还原晶须各自是氧化亚铜和金属铜的混合物。 优选地，还原表面用钝化剂处理以最小化层压体形成之前的任何再氧化。