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11.发明授权公开(公告)号：US08035409B2
公开(公告)日：2011-10-11
申请号：US12432082
申请日：2009-04-29
申请人： Alina Deutsch , George A. Katopis , Gerard V. Kopcsay , Roger S. Krabbenhoft , Christopher W. Surovic
发明人： Alina Deutsch , George A. Katopis , Gerard V. Kopcsay , Roger S. Krabbenhoft , Christopher W. Surovic
IPC分类号： G01R31/304 , G01R31/306 , G01R31/309 , G06F11/30
CPC分类号： G01R31/2818 , G01R31/2822
摘要： A system and method for performing a test for characterizing high frequency operation of PCB boards. More particularly, a system and methodology is provided to implement a time-domain short pulse propagation (SPP) technique on the production line, on large, multi-layer, product-level PCB boards, for large volume testing, by people who are not familiar with advanced, delicate, measurement techniques, who need robust test facilities, and cannot afford the time or expense of other lab-type approaches.
摘要翻译： 一种执行PCB板高频运行特性测试的系统和方法。 更具体地，提供了一种系统和方法，用于在生产线上，在大型，多层，产品级PCB板上实施时域短脉冲传播（SPP）技术，用于大容量测试，由不是 熟悉先进，精细，测量技术，需要强大的测试设施，无法承担其他实验室方法的时间或费用。
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公开(公告)号：US07193318B2
公开(公告)日：2007-03-20
申请号：US10711023
申请日：2004-08-18
IPC分类号： H01L23/495
CPC分类号： H01L25/0655 , H01L23/36 , H01L23/3732 , H01L23/3735 , H01L23/3738 , H01L23/42 , H01L2224/16 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： A multiple power density packaging structure with two or more semiconductor chips on a common wiring substrate having a common thermal spreader with a planar surface in thermal contact with the non-active surfaces of the chips. The semiconductor chips have different cooling requirements and some of the chips are thinned to insure that the chips requiring the lowest thermal resistance has the thinnest layer of a thermal adhesive or metal or solder interface between the chip and thermal spreader.
摘要翻译： 一种具有两个或更多个半导体芯片的多功率密度封装结构，其具有公共布线基板，其具有与所述芯片的非有源表面热接触的平坦表面的公共散热器。 半导体芯片具有不同的冷却要求，并且一些芯片被薄化以确保需要最低热阻的芯片具有在芯片和散热器之间的热粘合剂或金属或焊料界面的最薄层。
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