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    Universal surface finish for DCA, SMT and pad on pad interconnections
    3.
    发明授权
    Universal surface finish for DCA, SMT and pad on pad interconnections 失效
    DCA，SMT和焊盘互连焊盘的通用表面光洁度

    公开(公告)号：US5910644A

    公开(公告)日：1999-06-08

    申请号：US873060

    申请日：1997-06-11

    申请人： Dale E. Goodman ,  Mark K. Hoffmeyer ,  Roger S. Krabbenhoft

    发明人： Dale E. Goodman ,  Mark K. Hoffmeyer ,  Roger S. Krabbenhoft

    IPC分类号： H05K3/24 ,  H05K1/16

    CPC分类号： H05K3/244 ,  H01L2224/45147 ,  H01L2224/49171 ,  H01L2924/19105

    摘要： A printed circuit connector terminal pad coating technique is disclosed which functions as a single universal pad surface which supports multiple electrical connection practices including wirebonding, soldering, and wear resistant, pad on pad mechanical connection. The tri-plate surface treatment includes an initial diffusion resistant coating of nickel; an intermediate layer of hard, wear resistant noble or semi-noble metal that provides pad on pad connector reliability and affords a metallurgically stable solder joints and wirebond interfaces; and a final coating of soft gold. The intermediate layer may be pure palladium having a nominal thickness of 35 microinches or a layer of gold, hardened by cobalt, nickel, iron or a combination of these dopants to effect a hardness of 200 to 250 (Knoop scale). The use of a common surface treatment for the multiple attachment processes is implemented with a single masking step, rather than a sequence of selective masking, plating and stripping operations. In the printed circuit environment, the masking is provided by the final covering that encloses, seals, and electrically insulates the conductors in a circuit board application or in the instance of a flexcable, the adhesive coated flexible coverlay the covers and seals the copper conductor elements while exposing the conductor terminal pads.

    摘要翻译： 公开了一种印刷电路连接器端子焊盘涂覆技术，其作为单个通用焊盘表面，其支持多种电连接实践，包括引线键合，焊接和耐磨，焊盘机械连接。 三板表面处理包括镍的初始扩散涂层; 硬质耐磨贵金属或半贵金属的中间层，提供衬垫连接器可靠性的焊盘，并提供冶金稳定的焊点和引线接口; 和最后的软金涂层。 中间层可以是公称厚度为35微英寸的纯钯或由钴，镍，铁或这些掺杂剂的组合硬化的金层，以实现200至250（Knoop量程）的硬度。 通过单个掩蔽步骤而不是选择性掩蔽，电镀和剥离操作的顺序来实现对多个附接过程的常见表面处理的使用。 在印刷电路环境中，掩模由最终的覆盖物提供，封装，密封和电绝缘在电路板应用中，或者在柔性的情况下，粘合剂涂覆的柔性覆盖物覆盖并密封铜导体元件 同时暴露导体端子焊盘。

    Implementing connection of two large electronic boards utilizing LGA interconnect
    4.
    发明授权
    Implementing connection of two large electronic boards utilizing LGA interconnect 失效
    实现利用LGA互连的两个大型电子板的连接

    公开(公告)号：US08747122B2

    公开(公告)日：2014-06-10

    申请号：US12821312

    申请日：2010-06-23

    申请人： Terry F. Banitt ,  John L. Colbert ,  Jason R. Eagle ,  Roger S. Krabbenhoft

    发明人： Terry F. Banitt ,  John L. Colbert ,  Jason R. Eagle ,  Roger S. Krabbenhoft

    IPC分类号： H01R12/00

    CPC分类号： H05K3/36 ,  H01R43/205 ,  H05K1/141 ,  H05K3/301 ,  H05K3/368 ,  Y10T29/49126

    摘要： A method and apparatus are provided for implementing electrical connection of two large circuit cards through multiple discrete land grid array (LGA) sites. Each of the circuit cards includes a plurality of LGA sites. A first circuit card includes a plurality of LGA interposers locally aligned at the respective LGA sites of the first circuit card. A board-to-board connection hardware assembly connecting a second circuit card to the first circuit card includes a elongated carrier defining a cavity receiving a plurality of load springs coupled to an associated bearing block for loading and maintaining flatness of the LGA sites.

    摘要翻译： 提供一种方法和装置，用于通过多个离散的陆地网格阵列（LGA）实现两个大电路卡的电连接。 每个电路卡包括多个LGA位置。 第一电路卡包括在第一电路卡的相应LGA位置局部排列的多个LGA插入器。 将第二电路卡连接到第一电路卡的板对板连接硬件组件包括细长载体，其限定了容纳耦合到相关联的轴承座的多个负载弹簧的空腔，用于加载和保持LGA位置的平坦度。

    IMPLEMENTING CONNECTION OF TWO LARGE ELECTRONIC BOARDS UTILIZING LGA INTERCONNECT
    5.
    发明申请
    IMPLEMENTING CONNECTION OF TWO LARGE ELECTRONIC BOARDS UTILIZING LGA INTERCONNECT 失效
    利用LGA互连实现两大电子板的连接

    公开(公告)号：US20140127915A1

    公开(公告)日：2014-05-08

    申请号：US12821312

    申请日：2010-06-23

    申请人： Terry F. Banitt ,  John L. Colbert ,  Jason R. Eagle ,  Roger S. Krabbenhoft

    发明人： Terry F. Banitt ,  John L. Colbert ,  Jason R. Eagle ,  Roger S. Krabbenhoft

    IPC分类号： H01R12/52 ,  H05K3/36 ,  H01R43/20

    CPC分类号： H05K3/36 ,  H01R43/205 ,  H05K1/141 ,  H05K3/301 ,  H05K3/368 ,  Y10T29/49126

    摘要： A method and apparatus are provided for implementing electrical connection of two large circuit cards through multiple discrete land grid array (LGA) sites. Each of the circuit cards includes a plurality of LGA sites. A first circuit card includes a plurality of LGA interposers locally aligned at the respective LGA sites of the first circuit card. A board-to-board connection hardware assembly connecting a second circuit card to the first circuit card includes a elongated carrier defining a cavity receiving a plurality of load springs coupled to an associated bearing block for loading and maintaining flatness of the LGA sites.

    摘要翻译： 提供一种方法和装置，用于通过多个离散的陆地网格阵列（LGA）实现两个大电路卡的电连接。 每个电路卡包括多个LGA位置。 第一电路卡包括在第一电路卡的相应LGA位置局部排列的多个LGA插入器。 将第二电路卡连接到第一电路卡的板对板连接硬件组件包括细长载体，其限定了容纳耦合到相关联的轴承座的多个负载弹簧的空腔，用于加载和保持LGA位置的平坦度。