公开(公告)号：US20130069242A1

公开(公告)日：2013-03-21

申请号：US13237387

申请日：2011-09-20

Applicant: Ping-Yung YUH ,  Cheng-I Huang ,  Chung-Hsing Wang

Inventor： Ping-Yung YUH ,  Cheng-I Huang ,  Chung-Hsing Wang

IPC: H01L23/48

CPC classification number: H01L23/481 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/0001

Abstract: A semiconductor device structure for a three-dimensional integrated circuit has a semiconductor substrate having a plurality of through-substrate vias provided in the substrate, wherein three or more of the plurality of through-substrate vias are arranged in a hexagonal packing array with respect to their design-rule circle.

Abstract translation: 用于三维集成电路的半导体器件结构具有半导体衬底，其具有设置在衬底中的多个贯通衬底通孔，其中多个贯通衬底通孔中的三个或更多个相对于 他们的设计规则圈。

公开(公告)号：US06872091B2

公开(公告)日：2005-03-29

申请号：US10746027

申请日：2003-12-23

Applicant: Cheng-I Huang

Inventor： Cheng-I Huang

IPC: H01R13/646 ,  H01R29/00

CPC classification number: H01R24/46 ,  H01R2103/00

Abstract: A coaxial electrical connector includes a tubular body, first, second and third insulator members, a contact piece, and a central conductor unit. The tubular body defines a through hole, and is formed with a radial hole. The first and second insulator members are mounted in the through hole and are spaced apart from each other. The third insulator member is mounted in the radial hole. The contact piece extends into the third insulator member. The central conductor unit is supported in the through hole by the first and second insulator members, and includes a first conductor component coupled telescopically to a second conductor component. The first conductor component is movable to make or break contact with the contact piece.

Abstract translation: 同轴电连接器包括管状体，第一，第二和第三绝缘体构件，接触片和中心导体单元。 管状体限定了通孔，并且形成有径向孔。 第一和第二绝缘体构件安装在通孔中并且彼此间隔开。 第三绝缘体构件安装在径向孔中。 接触件延伸到第三绝缘体构件中。 中心导体单元由第一和第二绝缘体构件支撑在通孔中，并且包括可伸缩地连接到第二导体部件的第一导体部件。 第一导体部件可移动以与接触件断开接触。

公开(公告)号：US08728915B2

公开(公告)日：2014-05-20

申请号：US13225756

申请日：2011-09-06

Applicant: Yu-Pin Tsai ,  Cheng-I Huang ,  Yao-Hui Hu

Inventor： Yu-Pin Tsai ,  Cheng-I Huang ,  Yao-Hui Hu

IPC: H01L21/268 ,  H01L29/06 ,  H01L21/683 ,  H01L23/544 ,  H01L23/00

CPC classification number: H01L21/6836 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/13 ,  H01L2221/68327 ,  H01L2223/54433 ,  H01L2224/16 ,  H01L2924/01025 ,  H01L2924/01084 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/00

Abstract: A wafer laser-marking method is provided. First, a wafer having a first surface (an active surface) and a second surface (a back surface) opposite to each other is provided. Next, the wafer is thinned. Then, the thinned wafer is fixed on a non-UV tape such that the second surface of the wafer is attached to the tape. Finally, the laser marking step is performed, such that a laser light penetrates the non-UV tape and marks a pattern on the second surface of the wafer. According to the laser-marking method of the embodiment, the pattern is formed by the non-UV residuals left on the second surface of the wafer, and the components of the glue residuals at least include elements of silicon and carbon.

Abstract translation: 提供了晶片激光打标方法。 首先，提供具有彼此相对的第一表面（活性表面）和第二表面（背面）的晶片。 接下来，晶片变薄。 然后，将薄的晶片固定在非UV带上，使得晶片的第二表面附接到带上。 最后，执行激光标记步骤，使得激光穿透非UV带并且在晶片的第二表面上标记图案。 根据本实施例的激光标记方法，图案由残留在晶片的第二表面上的非UV残余物形成，并且胶合残余物的成分至少包括硅和碳的元素。

公开(公告)号：US20060237834A1

公开(公告)日：2006-10-26

申请号：US10907957

申请日：2005-04-22

Applicant: Yu-Wen Tsai ,  Cheng-I Huang

Inventor： Yu-Wen Tsai ,  Cheng-I Huang

IPC: H01L23/535

CPC classification number: H01L27/0207 ,  H01L27/11898 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for forming an electric device having power switches around a logic circuit including: forming a logic circuit on a substrate; forming a plurality of power switches around the logic circuit; and coupling first ends of the power switches to a voltage end, and coupling second ends of the power switches to a power receiver of the logic circuit.

Abstract translation: 一种用于形成具有围绕逻辑电路的电源开关的电气装置的方法，包括：在基板上形成逻辑电路; 在逻辑电路周围形成多个电源开关; 并且将所述功率开关的第一端耦合到电压端，以及将所述功率开关的第二端耦合到所述逻辑电路的功率接收器。