公开(公告)号：US20070174035A1

公开(公告)日：2007-07-26

申请号：US11490115

申请日：2006-07-21

申请人： Shih-Fang Chuang

发明人： Shih-Fang Chuang

IPC分类号： G06F9/455

CPC分类号： G06F8/20

摘要： The present invention provides a picture transfer protocol (PTP) interface of an open architecture, which can be used on an operation interface of a digital device to enable vendors to develop vendor-defined commands by themselves. The open architecture of the picture transfer protocol includes a command interpreter which is used to execute standard commands and/or the vendor-defined commands, a command manager which is used to add or remove the standard commands and/or the vendor-defined commands, and a command set classification which is used to classify the standard commands and/or the vendor-defined commands.

摘要翻译： 本发明提供了一种开放架构的图像传输协议（PTP）接口，其可以在数字设备的操作界面上使用，以使供应商自己开发供应商定义的命令。 图像传输协议的开放架构包括用于执行标准命令和/或供应商定义的命令的命令解释器，用于添加或删除标准命令和/或供应商定义的命令的命令管理器， 以及用于对标准命令和/或供应商定义的命令进行分类的命令集分类。

公开(公告)号：US20060043586A1

公开(公告)日：2006-03-02

申请号：US10924500

申请日：2004-08-24

申请人： Tz-Cheng Chiu ,  Shih-Fang Chuang

发明人： Tz-Cheng Chiu ,  Shih-Fang Chuang

IPC分类号： H01L23/48

CPC分类号： H05K3/3452 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/09909 ,  H05K2201/10734 ,  H05K2203/0182 ,  H05K2203/0191 ,  Y02P70/613 ,  H01L2924/00

摘要： A system comprising a ball grid array (“BGA”) substrate adapted to electrically couple to an application board using a plurality of solder balls, and a film adapted to abut the application board and the BGA substrate, the film comprising a plurality of perforations, the solder balls adapted to couple to the application board through the perforations.

摘要翻译： 一种包括适于使用多个焊球电耦合到应用板的球栅阵列（“BGA”）衬底的系统，以及适于邻接所述应用板和所述BGA衬底的膜，所述膜包括多个穿孔， 焊球适于通过穿孔连接到应用板。