公开(公告)号：USD642998S1

公开(公告)日：2011-08-09

申请号：US29380580

申请日：2010-12-08

Applicant: Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Lung-Hsin Chen ,  Wen-Liang Tseng

Designer： Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Lung-Hsin Chen ,  Wen-Liang Tseng

公开(公告)号：USD642995S1

公开(公告)日：2011-08-09

申请号：US29375808

申请日：2010-09-28

Applicant: Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Lung-Hsin Chen ,  Wen-Liang Tseng

Designer： Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Lung-Hsin Chen ,  Wen-Liang Tseng

公开(公告)号：US20080115881A1

公开(公告)日：2008-05-22

申请号：US11985497

申请日：2007-11-15

Applicant: Chih-Yung Lin ,  Po-Yu Chiang

Inventor： Chih-Yung Lin ,  Po-Yu Chiang

IPC: B32B37/02 ,  B29C65/02 ,  C09J5/06

CPC classification number: B29C66/342 ,  B29C65/18 ,  B29C65/4815 ,  B29C65/5021 ,  B29C65/5057 ,  B29C65/78 ,  B29C66/1122 ,  B29C66/348 ,  B29C66/47 ,  B29C66/4722 ,  B29C66/8322 ,  B29C66/91411 ,  B29C66/919 ,  B29C2793/0081 ,  Y10T156/1062

Abstract: A process for heat-pressing a tape on a plastic carrier for a chip primarily comprises heating the plastic carrier to a predetermined temperature ranging from about 60 degrees centigrade to about 150 degrees centigrade so that an adhesive provided on the tape for adhering to the plastic carrier is melted such that the adhesive is in an optimum melted state and provides preferable adhesion force.

Abstract translation: 用于对用于芯片的塑料载体上的热压的方法主要包括将塑料载体加热到约60摄氏度至约150摄氏度的预定温度，使得设置在带上的粘合剂粘附到塑料载体上 熔化，使得粘合剂处于最佳熔融状态并提供优选的粘附力。

公开(公告)号：US06455913B2

公开(公告)日：2002-09-24

申请号：US09495625

申请日：2000-01-31

Applicant: Wen-Kuan Yeh ,  Chih-Yung Lin

Inventor： Wen-Kuan Yeh ,  Chih-Yung Lin

IPC: H01L2900

CPC classification number: H01L23/5256 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A copper fuse structure for integrated circuit employs two copper pads formed over a semiconductor substrate. The two copper pads are electrically insulated by dielectrics. An aluminum line is utilized to cover and electrically connect the two copper pads.

Abstract translation: 用于集成电路的铜熔丝结构采用在半导体衬底上形成的两个铜焊盘。 两个铜焊盘由电介质电绝缘。 铝线用于覆盖和电连接两个铜焊盘。

公开(公告)号：US08554276B2

公开(公告)日：2013-10-08

申请号：US12472075

申请日：2009-05-26

Applicant: Chih-Yung Lin ,  Cheng-Yuan Lo ,  Yi-Wei Wang ,  Jui-Hsiang Chang

Inventor： Chih-Yung Lin ,  Cheng-Yuan Lo ,  Yi-Wei Wang ,  Jui-Hsiang Chang

IPC: H04M1/00

CPC classification number: H04B1/401 ,  H04B1/3816 ,  H04W92/08

Abstract: A Subscriber Identity Module (SIM) card control apparatus applied to a mobile communication device is provided. The mobile communication device has a first SIM card and a second SIM card. The SIM card control apparatus includes a judgment unit, a SIM card controller and a switch device. The judgment unit is used to generate a selection signal according to a to-be-accessed SIM card among the first and the second SIM cards. The SIM card controller transmits signals via a group of signal lines. The switch device is used to selectively connect the group of signal lines to the first SIM card or the second SIM card according to the selection signal.

Abstract translation: 提供了一种应用于移动通信设备的用户识别模块（SIM）卡控制设备。 移动通信设备具有第一SIM卡和第二SIM卡。 SIM卡控制装置包括判断单元，SIM卡控制器和开关装置。 判断单元用于根据第一和第二SIM卡中的要被访问的SIM卡生成选择信号。 SIM卡控制器通过一组信号线发送信号。 开关装置用于根据选择信号将信号线组选择性地连接到第一SIM卡或第二SIM卡。

公开(公告)号：USD642994S1

公开(公告)日：2011-08-09

申请号：US29375804

申请日：2010-09-28

Applicant: Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Lung-Hsin Chen ,  Wen-Liang Tseng

Designer： Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Lung-Hsin Chen ,  Wen-Liang Tseng

公开(公告)号：USD642545S1

公开(公告)日：2011-08-02

申请号：US29375806

申请日：2010-09-28

Applicant: Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Lung-Hsin Chen ,  Wen-Liang Tseng

Designer： Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Lung-Hsin Chen ,  Wen-Liang Tseng

公开(公告)号：USD640212S1

公开(公告)日：2011-06-21

申请号：US29375807

申请日：2010-09-28

Applicant: Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Lung-Hsin Chen ,  Wen-Liang Tseng

Designer： Chih-Yung Lin ,  Min-Tsun Hsieh ,  Ching-Lien Yeh ,  Chi-Wei Liao ,  Lung-Hsin Chen ,  Wen-Liang Tseng

公开(公告)号：US06797457B2

公开(公告)日：2004-09-28

申请号：US10119688

申请日：2002-04-11

Applicant: Chih-Yung Lin

Inventor： Chih-Yung Lin

IPC: G03F700

CPC classification number: G03F7/0042 ,  G03F7/265

Abstract: A method for improving the resolution of optic lithographic is disclosed. The method includes a step of forming an etched layer on the substrate, an inorganic photoresist layer is spun-on the etched layer, and an atomic layer on the inorganic photoresist layer. Then, a deep ultraviolet light is illuminated to the inorganic photoresist layer such that the acid molecular is formed from inorganic photoresist layer. Next, the atomic layer is catalyzed by acid molecular and converted to metallic oxide by active oxygen atom. After oxidation, the oxide pattern can be obtained and it is easy by etching process.

Abstract translation: 公开了一种用于提高光学光刻的分辨率的方法。 该方法包括在基板上形成蚀刻层的步骤，在蚀刻层上旋转无机光致抗蚀剂层，在无机光致抗蚀剂层上形成原子层。 然后，对无机光致抗蚀剂层照射深紫外光，使得酸分子由无机光致抗蚀剂层形成。 接下来，原子层由酸分子催化并通过活性氧原子转化为金属氧化物。 氧化后，可以获得氧化物图案，并且通过蚀刻工艺容易。

公开(公告)号：US06627387B2

公开(公告)日：2003-09-30

申请号：US09827827

申请日：2001-04-05

Applicant: Kevin Hsieh ,  Chih-Yung Lin ,  Chih-Hsiang Hsiao ,  Juan-Yuan Wu ,  Water Lur

Inventor： Kevin Hsieh ,  Chih-Yung Lin ,  Chih-Hsiang Hsiao ,  Juan-Yuan Wu ,  Water Lur

IPC: G03F726

CPC classification number: G03F7/091 ,  Y10S430/151

Abstract: A method of photolithography. An anti-reflective coating is formed on the conductive layer. An nitrogen plasma treatment is performed. A photo-resist layer is formed and patterned on the anti-reflective coating. The conductive layer is defined. The photo-resist layer is removed. The anti-reflective layer is removed by using phosphoric acid.