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公开(公告)号：US08384276B2
公开(公告)日：2013-02-26
申请号：US13167704
申请日：2011-06-24
Applicant: Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin , Ching-Lien Yeh
Inventor： Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin , Ching-Lien Yeh
IPC: H01J1/02
CPC classification number: F21V29/004 , F21K9/233 , F21V7/0083 , F21V13/04 , F21V17/102 , F21V29/773 , F21Y2105/10 , F21Y2115/10
Abstract: An LED lamp structure includes a heat sink and a base. The heat sink includes a first receiving cavity, a second receiving cavity opposite to the first receiving cavity and a partition. A light board having LED modules is mounted on the partition. The partition defines two first threaded through holes therein. The base has two positioning protrusions engaging in two positioning grooves of the heat sink. Thus, second screw holes of two screw pillars of the base are aligned at the first screw holes of the partition of the heat sink. Screws are used to threadedly engage in the first screw holes, the second screw holes and third screw holes in the light board to thereby assemble the heat sink, the base and the light board together.
Abstract translation: LED灯结构包括散热器和基座。 散热器包括第一接收腔，与第一接收腔相对的第二接收腔和隔板。 具有LED模块的灯板安装在隔板上。 隔板在其中限定了两个第一螺纹通孔。 基座具有两个定位突起，该突起与散热器的两个定位槽啮合。 因此，基座的两个螺柱的第二螺钉孔在散热器的隔板的第一螺钉孔处对准。 螺丝用于螺纹接合灯板中的第一螺钉孔，第二螺钉孔和第三螺钉孔，从而将散热器，基座和灯板组装在一起。
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公开(公告)号：US20120043576A1
公开(公告)日：2012-02-23
申请号：US13043473
申请日：2011-03-09
Applicant: MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHI-WEI LIAO , JIAN-SHIHN TSANG
Inventor： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHI-WEI LIAO , JIAN-SHIHN TSANG
IPC: H01L33/64
CPC classification number: H01L33/642 , H01L33/486 , H01L33/62 , H01L33/647 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01322 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
Abstract: An LED package structure includes a substrate with a concave groove therein, an LED die received in the concave groove, a heat conductive pillar, two electrically conductive pillars, a heat conductive plate, and two contact pads. The heat conductive pillar extends through the substrate and thermally connects with the LED die and the heat conductive plate. The electrically conductive pillars extend through substrate and electrically connect with the LED die, respectively. The electrically conductive pillars and the heat conductive pillar are spaced from each other. The contact pads respectively and electrically connect with the electrically conductive pillars. The contact pads are spaced from each other.
Abstract translation: LED封装结构包括其中具有凹槽的衬底，容纳在凹槽中的LED裸片，导热柱，两个导电柱，导热板和两个接触垫。 导热柱延伸穿过衬底并与LED管芯和导热板热连接。 导电柱分别延伸穿过衬底并与LED管芯电连接。 导电柱和导热柱彼此间隔开。 接触垫分别与导电支柱电连接。 接触垫彼此间隔开。
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公开(公告)号：USD654444S1
公开(公告)日：2012-02-21
申请号：US29380581
申请日：2010-12-08
Applicant: Chih-Yung Lin , Min-Tsun Hsieh , Ching-Lien Yeh , Lung-Hsin Chen , Wen-Liang Tseng
Designer： Chih-Yung Lin , Min-Tsun Hsieh , Ching-Lien Yeh , Lung-Hsin Chen , Wen-Liang Tseng
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公开(公告)号：US20110031513A1
公开(公告)日：2011-02-10
申请号：US12835727
申请日：2010-07-13
Applicant: MIN-TSUN HSIEH , LUNG-HSIN CHEN , SHEN-BO LIN , CHING-LIEN YEH , CHIH-YUNG LIN
Inventor： MIN-TSUN HSIEH , LUNG-HSIN CHEN , SHEN-BO LIN , CHING-LIEN YEH , CHIH-YUNG LIN
CPC classification number: H01L33/44 , H01L25/167 , H01L33/56 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2924/00014
Abstract: A surface-mount device (SMD) light emitting diode (LED) module includes a leadframe, an LED chip, a waterproof protective film and a sealing material. The leadframe includes a plurality of leads and the LED chip is fixed on one of the leads. The waterproof protective film covers the LED chip and a portion of the leadframe, and exposes a portion of the leadframe for connecting to a circuit board. The sealing material is also formed on the leadframe to cover the LED chip. In addition, a method of manufacturing the SMD LED module is provided.
Abstract translation: 表面贴装器件（SMD）发光二极管（LED）模块包括引线框架，LED芯片，防水保护膜和密封材料。 引线框架包括多个引线，并且LED芯片固定在一个引线上。 防水保护膜覆盖LED芯片和引线框架的一部分，并且暴露引线框架的一部分以连接到电路板。 密封材料也形成在引线框架上以覆盖LED芯片。 另外，提供了制造SMD LED模块的方法。
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公开(公告)号：US08541799B2
公开(公告)日：2013-09-24
申请号：US13113081
申请日：2011-05-23
Applicant: Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin , Ching-Lien Yeh , Chi-Wei Liao
Inventor： Min-Tsun Hsieh , Wen-Liang Tseng , Lung-Hsin Chen , Chih-Yung Lin , Ching-Lien Yeh , Chi-Wei Liao
IPC: H01L33/00
CPC classification number: H01L33/58 , H01L33/54 , H01L2933/005 , H01L2933/0083
Abstract: A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.
Abstract translation: 发光元件封装包括用于封装发光元件的封装构件。 在封装构件上形成多个光子晶体图案。 光子晶体图案的分布密度对应于发光元件的光分布。 每个光子晶体图案由多个光子晶体组成。
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Patent Agency Ranking
公开(公告)号：US08459838B2
公开(公告)日：2013-06-11
申请号：US12900502
申请日：2010-10-08
Applicant: Chi-Wei Liao , Wen-Liang Tseng , Min-Tsun Hsieh , Chih-Yung Lin , Ching-Lien Yeh
Inventor： Chi-Wei Liao , Wen-Liang Tseng , Min-Tsun Hsieh , Chih-Yung Lin , Ching-Lien Yeh
IPC: F21V33/00
Abstract: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a transparent housing located in front of the at least one lens, and a cleaning device. The cleaning device includes a wiper located on an outer surface of the transparent housing, and a driver which drives the wiper to brush the transparent housing.
Abstract translation: 交通灯组件包括至少一个灯模块，位于所述至少一个灯模块前面的至少一个透镜，位于所述至少一个透镜前面的透明壳体和清洁装置。 清洁装置包括位于透明壳体的外表面上的擦拭器和驱动刮水器以刷透透明壳体的驱动器。
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公开(公告)号：US20120074827A1
公开(公告)日：2012-03-29
申请号：US13167704
申请日：2011-06-24
Applicant: MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH
Inventor： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH
IPC: H01J7/24
CPC classification number: F21V29/004 , F21K9/233 , F21V7/0083 , F21V13/04 , F21V17/102 , F21V29/773 , F21Y2105/10 , F21Y2115/10
Abstract: An LED lamp structure includes a heat sink and a base. The heat sink includes a first receiving cavity, a second receiving cavity opposite to the first receiving cavity and a partition. A light board having LED modules is mounted on the partition. The partition defines two first threaded through holes therein. The base has two positioning protrusions engaging in two positioning grooves of the heat sink. Thus, second screw holes of two screw pillars of the base are aligned at the first screw holes of the partition of the heat sink. Screws are used to threadedly engage in the first screw holes, the second screw holes and third screw holes in the light board to thereby assemble the heat sink, the base and the light board together.
Abstract translation: LED灯结构包括散热器和基座。 散热器包括第一接收腔，与第一接收腔相对的第二接收腔和隔板。 具有LED模块的灯板安装在隔板上。 隔板在其中限定了两个第一螺纹通孔。 基座具有两个定位突起，该突起与散热器的两个定位槽啮合。 因此，基座的两个螺柱的第二螺钉孔在散热器的隔板的第一螺钉孔处对准。 螺丝用于螺纹接合灯板中的第一螺钉孔，第二螺钉孔和第三螺钉孔，从而将散热器，基座和灯板组装在一起。
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公开(公告)号：US20110266574A1
公开(公告)日：2011-11-03
申请号：US13007677
申请日：2011-01-17
Applicant: CHI-WEI LIAO , WEN-LIANG TSENG , CHIH-YUNG LIN , MIN-TSUN HSIEH , CHING-LIEN YEH
Inventor： CHI-WEI LIAO , WEN-LIANG TSENG , CHIH-YUNG LIN , MIN-TSUN HSIEH , CHING-LIEN YEH
IPC: H01L33/54
CPC classification number: H01L33/508 , H01L33/507 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
Abstract: An LED package includes a substrate, an LED die, and an encapsulating layer. The LED die is arranged on the substrate. The encapsulating layer covers the LED die and at least a part of the substrate. The encapsulating layer includes a light dispersing element. A light scattering intensity of the light dispersing element is proportional to the light intensity of light generated by the LED die and illuminated at the encapsulating layer. A luminance at a center of the LED package is substantially identical to that at a circumference of the LED package.
Abstract translation: LED封装包括基板，LED管芯和封装层。 LED芯片设置在基板上。 封装层覆盖LED管芯和至少一部分衬底。 封装层包括光分散元件。 光散射元件的光散射强度与由LED管芯产生的光的光强度成比例，并在封装层处照射。 LED封装的中心处的亮度基本上与LED封装的周边相同。
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公开(公告)号：US20120020089A1
公开(公告)日：2012-01-26
申请号：US13074016
申请日：2011-03-29
Applicant: MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHI-WEI LIAO
Inventor： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHI-WEI LIAO
IPC: F21S4/00
CPC classification number: F21V29/70 , F21S2/005 , F21S4/20 , F21Y2103/10 , F21Y2115/10
Abstract: An LED light bar includes an elongated circuit board, a first lighting module formed in the middle of the circuit board and two second light modules formed at two opposite ends of the circuit board. Each of first lighting module and the two second lighting module includes a plurality of LEDs arranged linearly on a surface of the circuit board. A density of the LEDs in the first lighting module is smaller than that in the second lighting modules.
Abstract translation: LED灯条包括细长电路板，形成在电路板的中间的第一照明模块和形成在电路板的两个相对端的两个第二光模块。 第一照明模块和第二照明模块中的每一个包括在电路板的表面上直线布置的多个LED。 第一照明模块中的LED的密度小于第二照明模块中的LED的密度。
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公开(公告)号：US20110291138A1
公开(公告)日：2011-12-01
申请号：US13113081
申请日：2011-05-23
Applicant: MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHI-WEI LIAO
Inventor： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN , CHING-LIEN YEH , CHI-WEI LIAO
CPC classification number: H01L33/58 , H01L33/54 , H01L2933/005 , H01L2933/0083
Abstract: A light-emitting element package includes a package member for encapsulating a light-emitting element. A plurality of photonic crystal patterns is formed on the package member. A distribution density of the photonic crystal patterns corresponds to light distribution of the light-emitting element. Each photonic crystal pattern consists of a plurality of photonic crystals.
Abstract translation: 发光元件封装包括用于封装发光元件的封装构件。 在封装构件上形成多个光子晶体图案。 光子晶体图案的分布密度对应于发光元件的光分布。 每个光子晶体图案由多个光子晶体组成。
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