公开(公告)号：US07637311B2

公开(公告)日：2009-12-29

申请号：US11769664

申请日：2007-06-27

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device for at least two heat-generating electronic components, includes a base for contacting with the heat-generating electronic components, a first fin set arranged on one part of the base, a second fin set arranged on another part of the base and at least a heat pipe sandwiched between the base and the first and second fin sets. The first fin set includes a plurality of fins defining a plurality of air passages therebetween. The second fin set includes a plurality of fins. Every two neighboring fins define therebetween an air passage communicating with a corresponding air passage of the first fin set. A channel which is parallel to and has a width larger than that of the air passages of the first and second fin sets is defined in a middle of the second fin set.

摘要翻译： 一种用于至少两个发热电子部件的散热装置，包括用于与发热电子部件接触的基座，布置在基座的一部分上的第一翅片组，布置在基座的另一部分上的第二翅片组 以及至少夹在基座与第一和第二翅片组之间的热管。 第一翅片组包括在其间限定多个空气通道的多个翅片。 第二翅片组包括多个翅片。 每两个相邻的翅片在其间限定有与第一翅片组的相应空气通道连通的空气通道。 与第一和第二翅片组的空气通道平行并具有宽度的通道限定在第二翅片组的中间。

公开(公告)号：US20090314465A1

公开(公告)日：2009-12-24

申请号：US12202404

申请日：2008-09-01

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： F28F13/00

CPC分类号： H01L23/38 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base, a fin group mounted on a top of the base, a fan mounted on a top of the fin group, a hollow fan duct mounted on the fan and a thermoelectric cooler secured on the fan duct. The thermoelectric cooler includes a cooling module having the Peltier effect and extending through a sidewall of the fan duct, and a heat sink enclosed by the fan duct and thermally contacting with the cooling module. The cooling module has a cold surface located at an inner side of the fan duct, and the heat sink thermally contacts with the cold surface of the cooling module. An airflow generated by the fan first flows through the heat sink and then reaches the fin group via the fan.

摘要翻译： 散热装置包括基座，安装在基座顶部的翅片组，安装在翼片组顶部的风扇，安装在风扇上的中空风扇导管和固定在风扇导管上的热电冷却器。 热电冷却器包括具有珀尔帖效应并延伸通过风扇管道的侧壁的冷却模块和由风扇管道封闭并与冷却模块热接触的散热器。 冷却模块具有位于风扇管道内侧的冷表面，并且散热器与冷却模块的冷表面热接触。 风扇产生的气流首先流过散热器，然后通过风扇到达散热片组。

公开(公告)号：US20090303718A1

公开(公告)日：2009-12-10

申请号：US12134163

申请日：2008-06-05

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： F21V21/14

CPC分类号： F21V14/02 ,  F21K9/00 ,  F21K9/65 ,  F21V14/04 ,  F21V29/505 ,  F21V29/74 ,  F21V29/77 ,  F21V29/83 ,  F21Y2107/10 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED lamp includes a lamp cover consisting of a plurality of sector-shaped connecting bodies, a plurality of fins attached to the lamp cover and a plurality of LED modules attached to the lamp cover and opposing the fins. A locking device is pivotably mounted to the lamp cover and comprises a supporting pole extending in the lamp cover, a plurality of branches pivotably mounted to the lamp cover and the supporting pole. The branches are movable along the supporting pole to be locked at a desired position, whereby an illumination angle of the LED modules of the lamp cover relative to the supporting pole is changeable via movement of the branches along the supporting pole of the locking device. Thus, an illumination area and an illumination intensity of the LED lamp are adjustable.

摘要翻译： LED灯包括由多个扇形连接体组成的灯罩，附接到灯罩的多个灯片和附接到灯罩并与散热片相对的多个LED组件。 锁定装置可枢转地安装到灯罩，并且包括在灯罩中延伸的支撑杆，可枢转地安装到灯罩和支撑杆的多个分支。 分支可沿着支撑杆移动以被锁定在期望的位置，由此灯罩的LED模块相对于支撑杆的照明角度可以通过分支沿着锁定装置的支撑杆的移动而改变。 因此，LED灯的照明区域和照明强度是可调节的。

公开(公告)号：US07643300B1

公开(公告)日：2010-01-05

申请号：US12336482

申请日：2008-12-16

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： G06F1/20 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device used for removing heat from a plurality of memory module cards, includes a first bracket, a second bracket placed on the first bracket and a fin set arranged on the second bracket. The first bracket has a plurality of first sheets extending downwardly from a bottom thereof and defines a plurality of slots therein. The second bracket has a plurality of second sheets extending downwardly from a bottom thereof. The first sheets are respectively attached to sides of the memory module cards. The second sheets are respectively extended through the slots of the first bracket and attached to opposite sides of the memory module cards and opposite to the first sheets.

摘要翻译： 用于从多个存储模块卡移除热量的散热装置包括第一支架，设置在第一支架上的第二支架和布置在第二支架上的散热片组。 第一支架具有从底部向下延伸并在其中限定多个槽的多个第一片。 第二支架具有从底部向下延伸的多个第二片。 第一张纸分别安装在存储模块卡的两侧。 第二片分别延伸穿过第一托架的狭槽并且附接到存储模块卡的相对侧并与第一片相对。

公开(公告)号：US07391615B2

公开(公告)日：2008-06-24

申请号：US11309839

申请日：2006-10-10

申请人： Meng Fu ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Meng Fu ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L2224/16 ,  Y10T24/44427 ,  Y10T24/4447

摘要： A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The actuating member includes a curving slot and is pivotally coupled to the movable fastener via a pivot. The sliding axle extends through the second leg of the body and the elongated slot of the movable fastener to couple them together, and the sliding axle has one portion inserted into the curving slot of the actuating member. When the actuating member is rotated about the pivot, the movable fastener is driven to move relative to the sliding axle between a relaxed position and a locked position.

摘要翻译： 夹具包括具有相对的第一和第二腿部的主体，可移动紧固件，致动构件和滑动轴。 可移动紧固件具有限定在其中的保持孔，用于与保持模块和保持孔上方的细长狭槽接合。 致动构件包括弯曲槽，并且经由枢轴枢转地联接到可动紧固件。 滑动轴延伸穿过主体的第二腿部和可移动紧固件的细长槽以将它们联接在一起，并且滑动轴具有插入致动构件的弯曲槽中的一个部分。 当致动构件围绕枢轴旋转时，可移动紧固件被驱动以在松弛位置和锁定位置之间相对于滑动轴线移动。

公开(公告)号：US20060054307A1

公开(公告)日：2006-03-16

申请号：US11221285

申请日：2005-09-07

申请人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu

发明人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.

摘要翻译： 一种用于散热电子装置的散热器包括：基座，包括堆叠在一起的多个翅片的第一翅片组，包括多个翅片并与第一翅片组重叠的第二翅片组，以及连接到第一翅片组的弯曲热管 基础。 第一和第二翅片组分别在第一和第二翅片组的不同位置与热管接合两次。

公开(公告)号：US20060032617A1

公开(公告)日：2006-02-16

申请号：US11012958

申请日：2004-12-14

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Chi Liang ,  Meng Fu

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Chi Liang ,  Meng Fu

IPC分类号： F28D15/00

CPC分类号： H01L23/427 ,  F28D15/0275 ,  F28F3/02 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for electronic component includes a base, a first heat dissipation member coupled to the base, heat pipes embedded in the base and a second heat dissipation member coupled to the base. The base is made of a first metal material and includes a heat absorbing portion having a bottom surface for contacting with the electronic component and a heat conductive portion extending from a top surface of heat absorbing portion. The first heat dissipation member is made of a second metal material and coupled to the heat absorbing portion of the base. The second heat dissipation member is made of second metal material and coupled to the heat conductive portion of the base. The first metal material differs from and has higher heat conductivity than the second metal material.

摘要翻译： 一种用于电子部件的散热器包括基座，耦合到基座的第一散热构件，嵌入在基座中的热管和耦合到基座的第二散热构件。 基座由第一金属材料制成，并且包括具有用于与电子部件接触的底面的吸热部和从吸热部的顶面延伸的导热部。 第一散热构件由第二金属材料制成并且联接到基座的吸热部分。 第二散热构件由第二金属材料制成并且连接到基座的导热部分。 第一金属材料与第二金属材料不同并且具有比第二金属材料更高的热导率。

公开(公告)号：US08096136B2

公开(公告)日：2012-01-17

申请号：US12202404

申请日：2008-09-01

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： F25B21/02 ,  H05K7/20

CPC分类号： H01L23/38 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base, a fin group mounted on a top of the base, a fan mounted on a top of the fin group, a hollow fan duct mounted on the fan and a thermoelectric cooler secured on the fan duct. The thermoelectric cooler includes a cooling module having the Peltier effect and extending through a sidewall of the fan duct, and a heat sink enclosed by the fan duct and thermally contacting with the cooling module. The cooling module has a cold surface located at an inner side of the fan duct, and the heat sink thermally contacts with the cold surface of the cooling module. An airflow generated by the fan first flows through the heat sink and then reaches the fin group via the fan.

摘要翻译： 散热装置包括基座，安装在基座顶部的翅片组，安装在翼片组顶部的风扇，安装在风扇上的中空风扇导管和固定在风扇导管上的热电冷却器。 热电冷却器包括具有珀尔帖效应并延伸通过风扇管道的侧壁的冷却模块和由风扇管道封闭并与冷却模块热接触的散热器。 冷却模块具有位于风扇管道内侧的冷表面，并且散热器与冷却模块的冷表面热接触。 风扇产生的气流首先流过散热器，然后通过风扇到达散热片组。

公开(公告)号：US20090316358A1

公开(公告)日：2009-12-24

申请号：US12399027

申请日：2009-03-06

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink.

摘要翻译： 散热装置包括具有限定多个通道之间的多个翅片的散热器。 通道在散热器的前侧和后侧具有入口和出口。 两个调节构件安装在散热器的两个侧面。 风扇位于散热器通道的入口处，用于向散热器提供气流。 引导构件定位在散热器的通道的出口处，用于将气流引导到散热装置周围的电子部件。 引导构件与调节构件接合并且可相对于调节构件垂直移动，从而沿着散热器的高度调节引导构件的高度。

公开(公告)号：US07631850B2

公开(公告)日：2009-12-15

申请号：US11135745

申请日：2005-05-24

申请人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Ping-An Yang ,  Meng Fu

发明人： Hsieh-Kun Lee ,  Chun-Chi Chen ,  Shi-Wen Zhou ,  Ping-An Yang ,  Meng Fu

IPC分类号： H05K7/20

CPC分类号： H05K7/20172

摘要： An apparatus (1) for supporting a cooling device (30) thereon includes a bracket (10) and a saddle (20) carrying the cooling device (30) thereon. The bracket (10) defines two opposing rails (12), (13) and a washboard-like member (14) extending along a direction in which the rails (12), (13) extend. The saddle (20) includes a positioning member (26) engaged in the washboard-like member (14) to position the saddle (20) to the bracket (10) and two blocks (24) slidable on the rails (12), (13) of the bracket (10) under condition that the positioning member (26) is disengaged from the washboard-like member (14).

摘要翻译： 一种用于在其上支撑冷却装置（30）的装置（1）包括托架（10）和在其上承载冷却装置（30）的鞍座（20）。 支架（10）限定了两个相对的轨道（12），（13）和沿轨道（12），（13）延伸的方向延伸的洗衣板状构件（14）。 所述鞍座（20）包括定位构件（26），所述定位构件（26）接合在所述盥洗板状构件（14）中，以将所述鞍座（20）定位到所述支架（10）以及可在所述轨道（12）上滑动的两个块（24）， 在定位构件（26）与盥洗板状构件（14）分离的条件下，支架（10）的底面（13）是13。