公开(公告)号：US20200377363A1

公开(公告)日：2020-12-03

申请号：US16869075

申请日：2020-05-07

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Rkia ACHEHBOUNE ,  Roberto BRIOSCHI ,  Dimitris DROGOUDIS ,  David PATTEN

IPC: B81B7/00 ,  B81C1/00 ,  H04R19/04 ,  H04R31/00

Abstract: The Application describes a substrate design for a MEMS transducer package. The substrate is defined by a conductive layer which forms the upper and lower surfaces of the substrate. The substrate is also provided with a conductive portion which is electrically isolated from the rest of the conductive layer. The conductive portion is supported between a first plane defined by the upper surface of the substrate and a second plane defined by the lower surface of the substrate by an electrically insulating moulding substance.

公开(公告)号：US20180127265A1

公开(公告)日：2018-05-10

申请号：US15788499

申请日：2017-10-19

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Roberto BRIOSCHI ,  David PATTEN ,  Rkia ACHEHBOUNE

IPC: B81B7/00 ,  B81B3/00

CPC classification number: B81B7/0032 ,  B81B3/0064 ,  B81B7/0006 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/091 ,  B81B2207/095 ,  H01L2224/48137 ,  H01L2224/49109 ,  H01L2924/15151

Abstract: The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.