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公开(公告)号：US20180167742A1
公开(公告)日：2018-06-14
申请号：US15830447
申请日：2017-12-04
Inventor： Roberto BRIOSCHI , Rkia ACHEHBOUNE , Marek Sebastian PIECHOCINSKI
CPC classification number: H04R9/08 , B81B7/0061 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/03 , B81C1/00269 , B81C2203/0109 , H04R31/00 , H04R2201/003
Abstract: The applications describes lid designs for transducer packaging. The lid comprising at least one side wall which extends between a foot of the lid and an upper surface of the lid. One or more grooves are provided in a surface of the side wall which serve to resist the flow of molten solder on the surface of the lid.
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公开(公告)号：US20200369514A1
公开(公告)日：2020-11-26
申请号：US16874162
申请日：2020-05-14
Inventor： Roberto BRIOSCHI , Rkia ACHEHBOUNE , David PATTEN
Abstract: The application describes a moulded interposer member for a MEMS transducer package. The interposer member comprises a void region and at least one through hole or channel.
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公开(公告)号：US20200299127A1
公开(公告)日：2020-09-24
申请号：US16825593
申请日：2020-03-20
Inventor： Roberto BRIOSCHI , Rkia ACHEHBOUNE
Abstract: The application relates to structures, e.g. substrates for supporting semiconductor die. The substrate defines a frame which lateral surrounds one or more die and is provided in contact with at least one side surface of the die, wherein the frame defines upper and lower surfaces of the substrate.
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公开(公告)号：US20190158962A1
公开(公告)日：2019-05-23
申请号：US16179237
申请日：2018-11-02
Inventor： Rkia ACHEHBOUNE , Dimitris DROGOUDIS , Roberto BRIOSCHI , Aleksey Sergeyevich KHENKIN , David PATTEN
Abstract: A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.
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公开(公告)号：US20200304922A1
公开(公告)日：2020-09-24
申请号：US16823971
申请日：2020-03-19
Inventor： Roberto BRIOSCHI , Rkia ACHEHBOUNE
Abstract: The present application describes a MEMS transducer package having a substrate layer which defines a recess. The recess extends in the plane of the substrate layer and defines a channel for directing sound waves that are incident on a side surface of the package substrate.
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Patent Agency Ranking
公开(公告)号：US20200304921A1
公开(公告)日：2020-09-24
申请号：US16823588
申请日：2020-03-19
Inventor： Roberto BRIOSCHI , Rkia ACHEHBOUNE , David PATTEN
Abstract: The application relates to a MEMS transducer package comprising: a package substrate the package substrate comprising a substrate channel, the substrate channel comprising first and second channel portions, wherein the first portion extends in a first direction between a first channel opening in a side surface of the substrate and a junction between the first and second channel portions, and wherein the second portion extends in a second direction between said junction and a second channel opening at, or underlying, a substrate opening provided in an upper surface of the package substrate.
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公开(公告)号：US20210144482A1
公开(公告)日：2021-05-13
申请号：US16605155
申请日：2018-04-13
Inventor： Marek Sebastian PIECHOCINSKI , Roberto BRIOSCHI , Rkia ACHEHBOUNE
Abstract: The present disclosure describes techniques for altering the epoxy wettability of a surface of a MEMS device. Particularly applicable to flip-chip bonding arrangements in which a top surface of a MEMS device is adhered to a package substrate. A barrier region is provided on a top surface of the MEMs device, laterally outside a region which forms, or overlies, the backplate and/or the cavity in the transducer substrate. The barrier region comprises a plurality of discontinuities, e.g. dimples, which inhibit the flow of epoxy.
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公开(公告)号：US20200304923A1
公开(公告)日：2020-09-24
申请号：US16825549
申请日：2020-03-20
Inventor： Roberto BRIOSCHI , Rkia ACHEHBOUNE
Abstract: The application describes a package substrate for a MEMS transducer package having a recessed region formed in an upper surface of the package substrate. The recessed region extends only partially through the package substrate from an opening in the upper surface of the package substrate in a first direction towards the lower surface of the substrate. The recessed region extends only partially though the package substrate from an opening in a side surface of the package substrate in a second direction towards an opposite side surface.
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公开(公告)号：US20200304920A1
公开(公告)日：2020-09-24
申请号：US16822771
申请日：2020-03-18
Inventor： Rkia ACHEHBOUNE , Roberto BRIOSCHI
Abstract: The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.
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公开(公告)号：US20220060835A1
公开(公告)日：2022-02-24
申请号：US17520386
申请日：2021-11-05
Inventor： Rkia ACHEHBOUNE , Roberto BRIOSCHI
Abstract: The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.
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