公开(公告)号：US20210088722A1

公开(公告)日：2021-03-25

申请号：US16579330

申请日：2019-09-23

Applicant: Cisco Technology, Inc.

Inventor： Sandeep RAZDAN ,  Vipulkumar K. PATEL ,  Aparna R. PRASAD

IPC: G02B6/12 ,  G02B6/13 ,  H01L23/00 ,  B23K35/26

Abstract: Photonic devices include a photonic assembly and a substrate coupled to the photonic assembly. The photonic assembly includes a photonic die and an optical device coupled to the photonic die with an adhesive to form an optical connection between the optical device and the photonic die. The photonic assembly is coupled to the photonic assembly by reflowing a plurality of solder connections at temperature that is less than a cure temperature of the adhesive.

公开(公告)号：US20210055489A1

公开(公告)日：2021-02-25

申请号：US16544699

申请日：2019-08-19

Applicant: Cisco Technology, Inc.

Inventor： Ashley J. MAKER ,  Joyce J. M. PETERNEL ,  Sandeep RAZDAN ,  Matthew J. TRAVERSO ,  Aparna R. PRASAD

IPC: G02B6/42

Abstract: An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.