公开(公告)号：US10547156B1

公开(公告)日：2020-01-28

申请号：US16052441

申请日：2018-08-01

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington ,  Ashley J. Maker ,  Kumar Satya Harinadh Potluri

IPC: H01S5/022 ,  G02B6/42 ,  G02B6/12 ,  H01S5/02

Abstract: A submount assembly comprises a first substrate having a first surface and an opposing second surface, wherein a plurality of first grooves are formed into the first substrate from the first surface. Each first groove is dimensioned to receive a portion of a respective optical fiber of a plurality of optical fibers, and to arrange the optical fiber with a predetermined first height relative to the first surface. The submount assembly further comprises a plurality of first conductive traces on a side of the first substrate corresponding to the first surface, and a semiconductor laser contacted with the first conductive traces. The semiconductor laser has a predetermined second height relative to the first surface. The submount assembly further comprises a plurality of second conductive traces at the second surface and a plurality of first vias extending through the first substrate from the first conductive traces to the second conductive traces.

公开(公告)号：US11609389B2

公开(公告)日：2023-03-21

申请号：US17301407

申请日：2021-04-01

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar Patel ,  Kumar Satya Harinadh Potluri ,  Jock T. Bovington ,  Ashley J. Maker

IPC: G02B6/38 ,  G02B6/28 ,  G02B6/26 ,  H04B10/25 ,  B23K1/005 ,  B23K103/00

Abstract: A fiber array unit (FAU) includes a substrate, a plurality of optical fibers, and a lid. The substrate includes: an optical window extending through a layer of non-transparent material, a plurality of grooves, and an alignment protrusion configured to mate with an alignment receiver. The plurality of optical fibers are disposed in the plurality of grooves. The alignment protrusion is configured to align the plurality of optical fibers with an external device when mated with the alignment receiver. The plurality of optical fibers is disposed between the lid and the substrate.

公开(公告)号：US11043478B2

公开(公告)日：2021-06-22

申请号：US15961163

申请日：2018-04-24

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. Traverso ,  Sandeep Razdan ,  Ashley J. Maker

IPC: H01L23/00 ,  H01L25/16 ,  H01L31/02 ,  H01L23/498 ,  H01L21/48

Abstract: An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a mold compound; a photonic integrated circuit (PIC) embedded in the mold compound, that has a face exposed from the mold compound in a first plane; an interposer embedded in the mold compound, that has a face exposed from the mold compound in the first plane (i.e., co-planar with the exposed face of the PIC); and an electrical integrated circuit (EIC) coupled to the exposed face of the PIC and the exposed face of the interposer, that establishes bridging electrical connections between the PIC and the interposer.

公开(公告)号：US10746934B2

公开(公告)日：2020-08-18

申请号：US16058608

申请日：2018-08-08

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar Patel ,  Matthew J. Traverso ,  Ashley J. Maker ,  Jock T. Bovington

IPC: G02B6/30 ,  G02B6/12 ,  G02B6/10

Abstract: By determining an alignment point for a photonic element in a substrate of a given material; applying, via a laser aligned with the photonic element according to the alignment point, an etching pattern to the photonic element to produce a patterned region and an un-patterned region in the photonic element, wherein applying the etching pattern alters a chemical bond in the given material for the patterned region of the photonic element that increases a reactivity of the given material to an etchant relative to a reactivity of the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); and removing the patterned region from the photonic element via the etchant, various systems and methods may make use of laser patterning in optical components to enable alignment of optics to chips.

公开(公告)号：US10656339B2

公开(公告)日：2020-05-19

申请号：US16146311

申请日：2018-09-28

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar Patel ,  Ashley J. Maker ,  Anthony D. Kopinetz

IPC: G02B6/30 ,  G02B6/42 ,  G02B6/36

Abstract: An apparatus comprises a plurality of optical fibers and a lid member having one or more surfaces with grooves formed therein. The lid member defines a first plurality of grooves that are each dimensioned to partly receive an optical fiber of the plurality of optical fibers. The apparatus further comprises a substrate comprising a plurality of waveguides arranged at a predefined depth relative to a reference surface of the substrate, and a plurality of ribs extending from the reference surface. Each rib of the plurality of ribs is dimensioned to engage with a respective groove of a second plurality of grooves of the lid member. Engaging the plurality of ribs of the substrate with the second plurality of grooves of the lid member provides an optical alignment of the plurality of optical fibers with the plurality of waveguides.