METHOD AND SYSTEM FOR A VERTICAL JUNCTION HIGH-SPEED PHASE MODULATOR

    公开(公告)号:US20240004260A1

    公开(公告)日:2024-01-04

    申请号:US18466685

    申请日:2023-09-13

    Abstract: Methods and systems for a vertical junction high-speed phase modulator are disclosed and may include a semiconductor device having a semiconductor waveguide including a slab section, a rib section extending above the slab section, and raised ridges extending above the slab section on both sides of the rib section. The semiconductor device has a vertical pn junction with p-doped material and n-doped material arranged vertically with respect to each other in the rib and slab sections. The rib section may be either fully n-doped or p-doped in each cross-section along the semiconductor waveguide. Electrical connection to the p-doped and n-doped material may be enabled by forming contacts on the raised ridges, and electrical connection may be provided to the rib section from one of the contacts via periodically arranged sections of the semiconductor waveguide, where a cross-section of both the rib section and the slab section in the periodically arranged sections may be fully n-doped or fully p-doped.

    PHOTODETECTOR WITH SPLIT INPUTS
    12.
    发明公开

    公开(公告)号:US20240356656A1

    公开(公告)日:2024-10-24

    申请号:US18302360

    申请日:2023-04-18

    Abstract: The present disclosure describes photodetectors with multiple inputs and methods of operating photodetectors with multiple inputs. An apparatus includes a substrate, an optical absorber, and an optical device. The optical absorber is positioned on the substrate. The optical absorber includes a first portion and a second portion coupled to the first portion along a line. The optical device produces a first optical signal and a second optical signal based on a received optical signal and directs the first optical signal through the first portion of the optical absorber in a direction substantially parallel to the line. The optical device also directs the second optical signal through the second portion of the optical absorber in the direction substantially parallel to the line.

    PHOTODETECTOR WITH SEGMENTED ABSORBERS
    13.
    发明公开

    公开(公告)号:US20240038920A1

    公开(公告)日:2024-02-01

    申请号:US17816255

    申请日:2022-07-29

    CPC classification number: H01L31/1075

    Abstract: A photodetector includes a substrate, a first optical absorber, and a second optical absorber. The first optical absorber is disposed in the substrate along a direction of propagation of an optical signal through the substrate. The first optical absorber is offset in the substrate according to an offset of the optical signal in a direction orthogonal to the direction of propagation. The second optical absorber is disposed in the substrate along the direction of propagation of the optical signal. The second optical absorber is offset in the substrate according to the offset of the optical signal in the direction orthogonal to the direction of propagation.

    PHOTODETECTOR WITH VERTICAL ELECTRIC FIELD
    14.
    发明公开

    公开(公告)号:US20240038919A1

    公开(公告)日:2024-02-01

    申请号:US17815115

    申请日:2022-07-26

    CPC classification number: H01L31/105 H01L31/028

    Abstract: A photodetector includes a substrate, an optical absorber, a first doped region, a second doped region, and a third doped region. The optical absorber is disposed in the substrate and includes a first region and a second region. The first doped region is disposed in the substrate such that the first doped region contacts the second region of the optical absorber. The second doped region is disposed in the substrate such that the second doped region contacts the second region of the optical absorber. The second region of the optical absorber is positioned between the first doped region and the second doped region. The third doped region is disposed in the substrate and has an opposite doping relative to the first doped region and the second doped region. The first region of the optical absorber is positioned between the third doped region and the second region of the optical absorber.

    END-FACE COUPLING STUCTURES UNDERNEATH A PHOTONIC LAYER

    公开(公告)号:US20220244459A1

    公开(公告)日:2022-08-04

    申请号:US17248579

    申请日:2021-01-29

    Abstract: A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.

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