公开(公告)号：US11374655B1

公开(公告)日：2022-06-28

申请号：US17303934

申请日：2021-06-10

Applicant: Cisco Technology, Inc.

Inventor： Marco Mazzini ,  Alberto Cervasio ,  Jock T. Bovington

IPC: H04B10/40 ,  H01S5/50 ,  H04B10/2513 ,  H04B10/50 ,  H04B10/079 ,  H04B10/43 ,  H04B10/60 ,  H04B10/61 ,  H04B10/2507 ,  H04B10/25

Abstract: A link extender configured to extend a range of an optical transceiver module is provided. The link extender includes an array of semiconductor optical amplifiers (SOAs) configured to amplify an optical signal received from the optical transceiver module, a first plurality of variable optical attenuators (VOAs) configured to control a power output of the amplified optical signal output from the array of SOAs, and a plurality of dispersion compensation and filtering (DC&F) devices configured to compensate for chromatic dispersion of the optical signal.

公开(公告)号：US11226457B2

公开(公告)日：2022-01-18

申请号：US16885433

申请日：2020-05-28

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington

IPC: G02B6/42 ,  G02B6/12

Abstract: Embodiments herein describe optical assemblies that use a spacer element to attach and align a laser to a waveguide in a photonic chip. Once aligned, the laser can transfer optical signals into the photonic chip which can then perform an optical function such as modulation, filtering, amplification, and the like. In one embodiment, the spacer element is a separate part (e.g., a glass or semiconductor block) that is attached between the photonic chip and a submount on which the laser is mounted. The spacer establishes a separation distance between the photonic chip and the submount which in turn aligns the laser with the waveguide in the photonic chip. In another embodiment, rather than the spacer element being a separate part, the spacer element may be integrated into the submount.

公开(公告)号：US11199668B1

公开(公告)日：2021-12-14

申请号：US16940528

申请日：2020-07-28

Applicant: Cisco Technology, Inc.

Inventor： Norbert Schlepple ,  Jock T. Bovington

IPC: G02B6/42 ,  G02B6/02

Abstract: Aspects described herein include a method comprising arranging a laser die on a substrate. The laser die has multiple channels that are arranged with a first planar arrangement proximate to a facet of the laser die. The method further comprises aligning a single lens to the facet, and aligning a multicore optical fiber to the laser die through the single lens. The multicore optical fiber has a plurality of optical cores that are arranged with a second planar arrangement. Aligning the multicore optical fiber to the laser die comprises rotationally aligning the multicore optical fiber to align the second planar arrangement with the first planar arrangement.

公开(公告)号：US11978999B2

公开(公告)日：2024-05-07

申请号：US18158879

申请日：2023-01-24

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington ,  Norbert Schlepple

IPC: H01S5/024 ,  H01S3/067 ,  B23K101/14

CPC classification number: H01S5/02453 ,  H01S3/06704 ,  H01S5/02469 ,  B23K2101/14

Abstract: Aspects described herein include a method of fabricating an optical component, the optical component, and a method of operating the optical component. A method includes electrically coupling a first laser channel and a second laser channel of a laser die to different electrical leads and testing (i) a first optical coupling of the first laser channel and a second optical coupling of the second laser channel or (ii) a first spectral performance of the first laser channel and a second spectral performance of the second laser channel. The method also includes optically aligning an optical fiber with the first laser channel and designating the second laser channel as a heater element for the first laser channel based at least in part on (i) the first optical coupling being greater than the second optical coupling or (ii) the first spectral performance relative to the second spectral performance.

公开(公告)号：US11705692B2

公开(公告)日：2023-07-18

申请号：US16940659

申请日：2020-07-28

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington

IPC: H01S5/0683 ,  H01S5/02255 ,  H01S5/02253 ,  H01S5/02216 ,  H01S5/065 ,  H01S5/00 ,  H01S5/0687

CPC classification number: H01S5/0683 ,  H01S5/0085 ,  H01S5/02216 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/0653 ,  H01S5/0654 ,  H01S5/0687

Abstract: Laser Side Mode Suppression Ratio (SMSR) control is provided via a logic controller configured to measure an SMSR of a carrier wave upstream of a modulator and measure an Average Optical Power (AOP) of the carrier wave downstream of the modulator; transmit a bias voltage based on the SMSR and the AOP to a laser driver for a laser generating the carrier wave; and transmit an attenuation level based on the SMSR and the AOP to a Variable Optical Attenuator (VOA) upstream of the modulator. In various embodiments the attenuation level and bias voltage can rise or fall together, or one may rise and one may fall to ensure the output optical signal meets specified SMSR and AOP values.

公开(公告)号：US20220120974A1

公开(公告)日：2022-04-21

申请号：US17074539

申请日：2020-10-19

Applicant: Cisco Technology, Inc.

Inventor： Norbert Schlepple ,  Jock T. Bovington

IPC: G02B6/293 ,  G02B6/42 ,  H04J14/02

Abstract: Aspects described herein include an optical apparatus comprising a plurality of light-carrying media, a wavelength division multiplexing (WDM) device optically coupled with the plurality of light-carrying media, and a lens arranged between the WDM device and a multicore optical fiber. An arrangement of the plurality of light carrying media and the WDM device are selected to align each of the plurality of light-carrying media with a respective optical core of the multicore optical fiber.

公开(公告)号：US11300728B2

公开(公告)日：2022-04-12

申请号：US16787632

申请日：2020-02-11

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. Traverso ,  Jock T. Bovington ,  Ashley J. M. Erickson

IPC: G02B6/12 ,  G02B6/13 ,  G02B6/42 ,  G02B6/30

Abstract: Solder reflow compatible connections between optical components are provided by use of reflow compatible epoxies to bond optical components and remain bonded between the optical components at temperatures of at least 260 degrees Celsius for at least five minutes. In some embodiments, the reflow compatible epoxy is index matched to the optical channels in the optical components and is disposed in the light path therebetween. In some embodiments, a light path is defined between the optical channels through at least a portion of an air gap between the optical components.

公开(公告)号：US11081856B2

公开(公告)日：2021-08-03

申请号：US16234105

申请日：2018-12-27

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington ,  Vipulkumar K. Patel ,  Dominic F. Siriani

IPC: H01S5/02 ,  H01S5/042 ,  H01S5/343 ,  H01S5/40 ,  H01S5/34 ,  G02B6/42

Abstract: A laser integrated photonic platform to allow for independent fabrication and development of laser systems in silicon photonics. The photonic platform includes a silicon substrate with an upper surface, one or more through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate. The photonic platform includes a silicon substrate wafer with through silicon vias (TSVs) defined through the silicon substrate, and passive alignment features in the substrate for mating the photonic platform to a photonics integrated circuit. The photonic platform also includes a III-V semiconductor material structure wafer, where the III-V wafer is bonded to the upper surface of the silicon substrate and includes at least one active layer forming a light source for the photonic platform.

公开(公告)号：US11042049B2

公开(公告)日：2021-06-22

申请号：US16597682

申请日：2019-10-09

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington

IPC: G02F1/01 ,  G02B6/138 ,  G02B6/12

Abstract: Thermal isolation elements are provided in wafer-bonded silicon photonics that include a photonic platform, including a heating element and an optical waveguide that are disposed between a first surface and a second surface (opposite to the first surface) of the photonic platform; a substrate, including a third surface and a fourth surface (opposite to the third surface); wherein the first surface of the photonic platform is bonded to the third surface of the substrate; and wherein a cavity is defined by a trench in one or more of: the first surface and extending towards, but not reaching, the second surface, and the third surface and extending towards, but not reaching, the fourth surface; wherein the cavity is filled with a gas of a known composition at a predefined pressure; and wherein the cavity is aligned with the optical waveguide and the heating element.

公开(公告)号：US10782475B2

公开(公告)日：2020-09-22

申请号：US16433846

申请日：2019-06-06

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington ,  Kenneth J. Thomson ,  Dominic F. Siriani

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13

Abstract: Embodiments provide for a photonic platform, comprising: a silicon component; a III-V component; and a bonding layer contacting the silicon component on one side and the III-V component on the opposite side; wherein the silicon component comprises: a silicon substrate; a dielectric, contacting the silicon substrate on one face and the bonding layer on the opposite face; a silicon cores disposed in the dielectric; and wherein the III-V component comprises: a III-V cladding; a III-V contact, having a first side that contacts the bonding layer; and an active region, disposed on the III-V contact and separating the III-V contact from the III-V cladding, wherein the active region is located relative to the silicon cores to define an optical path that includes the active region and the silicon cores.