公开(公告)号：US11226450B2

公开(公告)日：2022-01-18

申请号：US17103735

申请日：2020-11-24

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. Traverso ,  Ashley J. Maker ,  Sandeep Razdan

IPC: G02B6/26 ,  G02B23/08

Abstract: The present disclosure provides for periscope optical assemblies within interposers that include a bulk material having a first side and a second side opposite to the first side; a first optic defined in the bulk material at a first height in the bulk material along an axis extending between the first second sides; a second optic defined in the bulk material at a second height in the bulk material, different than the first height, along the axis; a first waveguide defined in the bulk material, extending from the first side to the first optic; a second waveguide defined in the bulk material, extending from the second optic to the second side; and a third waveguide defined in the bulk material, extending from the first optic to the second optic.

公开(公告)号：US11181689B2

公开(公告)日：2021-11-23

申请号：US16579330

申请日：2019-09-23

Applicant: Cisco Technology, Inc.

Inventor： Sandeep Razdan ,  Vipulkumar K. Patel ,  Aparna R. Prasad

IPC: G02B6/12 ,  G02B6/13 ,  B23K35/26 ,  H01L23/00

Abstract: Photonic devices include a photonic assembly and a substrate coupled to the photonic assembly. The photonic assembly includes a photonic die and an optical device coupled to the photonic die with an adhesive to form an optical connection between the optical device and the photonic die. The photonic assembly is coupled to the photonic assembly by reflowing a plurality of solder connections at temperature that is less than a cure temperature of the adhesive.

公开(公告)号：US11029475B2

公开(公告)日：2021-06-08

申请号：US16522531

申请日：2019-07-25

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar K. Patel ,  Aparna R. Prasad ,  Sandeep Razdan

IPC: G02B6/42

Abstract: The present disclosure provides a frame lid assembly, which may be used in assembling an optical platform to provide isolated thermal conduction paths for various elements thereof. The frame lid assembly includes a first frame lid, including: a foot, disposed in a first plane; a roof, disposed in a second plane parallel to the first plane, the roof defining a port as a first through-hole that is perpendicular to the second plane; a wall, disposed obliquely to the first plane, separating the roof from the foot, the wall defining a slot as a second through-hole that is parallel to the first plane; a second frame lid connected to the first frame lid and thermally isolated from the first frame lid, the second frame lid including: a cap, connected to the roof via a thermal insulator; and a plug, extending perpendicularly from the cap through the port.

公开(公告)号：US10564352B1

公开(公告)日：2020-02-18

申请号：US16543441

申请日：2019-08-16

Applicant: Cisco Technology, Inc.

Inventor： Sandeep Razdan ,  Ashley J. Maker ,  Matthew J. Traverso ,  Mark A. Webster ,  Jock T. Bovington

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/42 ,  G02B6/30 ,  G02B6/43 ,  H01L23/538 ,  H01L23/00

Abstract: Aspects described herein include a method comprising forming an insulator layer above a silicon layer of a silicon-on-insulator (SOI) substrate. A first optical device is formed partly in the silicon layer and partly in the insulator layer. A first optical waveguide is formed in the insulator layer and optically coupled with the first optical device. The method further comprises forming conductive contacts extending partly through the insulator layer to the first optical device, bonding a first surface of an interposer with a top surface of the insulator layer, and forming, from a second surface of the interposer opposite the first surface, a plurality of first conductive vias extending at least partly through the interposer. The plurality of first conductive vias are coupled with the conductive contacts.

公开(公告)号：US10393959B1

公开(公告)日：2019-08-27

申请号：US16172702

申请日：2018-10-26

Applicant: Cisco Technology, Inc.

Inventor： Sandeep Razdan ,  Ashley J. Maker ,  Matthew J. Traverso ,  Mark A. Webster ,  Jock T. Bovington

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/42 ,  G02B6/30 ,  G02B6/43 ,  H01L23/538 ,  H01L23/00

Abstract: A method comprises bonding a first surface of an interposer wafer with a first exterior surface of a photonic wafer assembly. The photonic wafer assembly comprises one or more optical devices coupled with one or more metal layers and with one or more first optical waveguides. The method further comprises forming, from a second surface opposite the first surface, a plurality of first conductive vias extending at least partway through the interposer wafer and coupled with the one or more metal layers. The method further comprises forming, at the second surface, a plurality of first conductive pads coupled with the plurality of first conductive vias. The method further comprises forming one or more second conductive pads coupled with the one or more metal layers. The one or more second conductive pads are accessible at a second exterior surface of the photonic wafer assembly opposite the first exterior surface.