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公开(公告)号：US20190219890A1
公开(公告)日：2019-07-18
申请号：US15872176
申请日：2018-01-16
Applicant: Cisco Technology, Inc.
Inventor： Sean P. ANDERSON , Vipulkumar PATEL
IPC: G02F1/313
CPC classification number: G02F1/3136 , G02F1/0121 , G02F1/0147 , G02F1/025 , G02F1/225 , G02F2202/10 , G02F2203/15 , G02F2203/50
Abstract: An optical phase shifting arrangement and associated optical switching device and method are disclosed. The optical phase shifting arrangement comprises a first optical phase shifter configured to provide a first phase shift to an optical signal, and a second optical phase shifter configured to provide a second phase shift to the optical signal in addition to the first phase shift. During a predefined period, the first optical phase shifter and the second optical phase shifter are driven such that the second phase shift is substantially complementary to the first phase shift.
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公开(公告)号：US20180188450A1
公开(公告)日：2018-07-05
申请号：US15899255
申请日：2018-02-19
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar PATEL , Mark WEBSTER , Ravi TUMMIDI , Mary NADEAU
Abstract: Embodiments herein describe a photonic chip which includes a coupling interface for evanescently coupling the chip to a waveguide on an external substrate. In one embodiment, the photonic chip includes a tapered waveguide that aligns with a tapered waveguide on the external substrate. The respective tapers of the two waveguides are inverted such that as the width of the waveguide in the photonic chip decreases, the width of the waveguide on the external substrate increases. In one embodiment, these two waveguides form an adiabatic structure where the optical signal transfers between the waveguides with minimal or no coupling of the optical signal to other non-intended modes. Using the two waveguides, optical signals can be transmitted between the photonic chip and the external substrate.
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公开(公告)号：US20160170240A1
公开(公告)日：2016-06-16
申请号：US14248081
申请日：2014-04-08
Applicant: CISCO TECHNOLOGY , INC.
Inventor： Donald ADAMS , Prakash GOTHOSKAR , Vipulkumar PATEL , Mark WEBSTER
IPC: G02F1/025
CPC classification number: G02F1/025 , G02B6/132 , G02B6/136 , G02F1/011 , G02F1/2257 , G02F2001/0152
Abstract: An optical modulator may include a lower waveguide, an upper waveguide, and a dielectric layer disposed therebetween. When a voltage potential is created between the lower and upper waveguides, these layers form a silicon-insulator-silicon capacitor (also referred to as SISCAP) guide that provides efficient, high-speed optical modulation of an optical signal passing through the modulator. In one embodiment, at least one of the waveguides includes a respective ridge portion aligned at a charge modulation region which may aid in confining the optical mode laterally (e.g., in the width direction) in the optical modulator. In another embodiment, ridge portions may be formed on both the lower and the upper waveguides. These ridge portions may be aligned in a vertical direction (e.g., a thickness direction) so that ridges overlap which may further improve optical efficiency by centering an optical mode in the charge modulation region.
Abstract translation: 光调制器可以包括下波导，上波导和介于其间的电介质层。 当在下波导和上波导之间产生电压电位时，这些层形成硅 - 绝缘体 - 硅电容器（也称为SISCAP）引导件，其提供通过调制器的光信号的有效的高速光调制。 在一个实施例中，至少一个波导包括在电荷调制区域处对准的相应的脊部分，其可以有助于限制光学调制器中的光学模式（例如，在宽度方向上）。 在另一个实施例中，脊部可以形成在下波导和上波导两者上。 这些脊部可以在垂直方向（例如，厚度方向）上对准，使得脊重叠，这可以通过使电荷调制区域中的光学模式居中来进一步提高光学效率。
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公开(公告)号：US20150212344A1
公开(公告)日：2015-07-30
申请号：US14263389
申请日：2014-04-28
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar PATEL , Prakash GOTHOSKAR , Sean ANDERSON
CPC classification number: G02F1/025 , G02B6/132 , G02B6/136 , G02F1/011 , G02F1/2257 , G02F2001/0152
Abstract: An optical modulator may include a lower waveguide, an upper waveguide, and a dielectric layer disposed therebetween. In one embodiment, the lower waveguide may include a u-shaped region within an optical mode of the light passing through the optical modulator. By conforming the dielectric layer to the surfaces of the u-shaped region, the amount of area of the dielectric layer within a charge modulation region is increased relative to forming the dielectric layer on a single plane. Folding the dielectric layer in this manner may improve modulation efficiency. In one embodiment, the u-shaped region is formed by using ridge structures that extend from an upper surface of the lower waveguide towards the upper waveguide. To aid in lateral confinement of the optical mode, the dielectric layer may be deposited on one side surface of the ridge structures while a different dielectric material is deposited on the opposite side surface.
Abstract translation: 光调制器可以包括下波导，上波导和介于其间的电介质层。 在一个实施例中，下波导可以包括通过光调制器的光的光学模式内的u形区域。 通过使介电层与U形区域的表面相一致，相对于在单个平面上形成电介质层，电荷调制区域内的电介质层的面积增加。 以这种方式折叠介电层可以提高调制效率。 在一个实施例中，通过使用从下波导的上表面向上波导延伸的脊结构形成U形区域。 为了有助于光学模式的横向限制，介电层可以沉积在脊结构的一个侧表面上，而不同的电介质材料沉积在相对的侧表面上。
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公开(公告)号：US20150016784A1
公开(公告)日：2015-01-15
申请号：US14498669
申请日：2014-09-26
Applicant: Cisco Technology, Inc.
Inventor： Kalpendu SHASTRI , Soham PATHAK , Utpal CHAKRABARTI , Vipulkumar PATEL , Bipin DAMA , Ravinder KACHRU , Kishor DESAI
IPC: G02B6/42
CPC classification number: G02B6/4292 , B82Y20/00 , C03C15/00 , G02B6/136 , G02B6/4214 , G02B6/4246 , G02B6/4259 , Y10T29/4978
Abstract: An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.
Abstract translation: 一种用于在光电子基板和光纤阵列之间提供自对准光耦合的装置，其中基板由透明盖包围，使得相关联的光信号通过透明盖进入和离开布置。 该装置采取两部分连接的光纤阵列组件的形式，其中两个部件独特地配合以形成自对准配置。 在光信号通过的区域中，透明盖附着有板的形式的第一部分。 第一板包括具有围绕其周边的向内逐渐变细的侧壁的中心开口。 第二板也形成为包括中心开口并且具有下突起，其具有向内渐缩的侧壁，与第一板的向内渐缩的侧壁配合形成自对准的连接纤维阵列组件。 然后将纤维阵列以自对准的方式附接到第二板。
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Patent Agency Ranking
公开(公告)号：US20220082875A1
公开(公告)日：2022-03-17
申请号：US17456468
申请日：2021-11-24
Applicant: Cisco Technology, Inc.
Inventor： Donald ADAMS , Prakash B. GOTHOSKAR , Vipulkumar PATEL , Mark WEBSTER
Abstract: An optical modulator may include a lower waveguide, an upper waveguide, and a dielectric layer disposed therebetween. When a voltage potential is created between the lower and upper waveguides, these layers form a silicon-insulator-silicon capacitor (also referred to as SISCAP) guide that provides efficient, high-speed optical modulation of an optical signal passing through the modulator. In one embodiment, at least one of the waveguides includes a respective ridge portion aligned at a charge modulation region which may aid in confining the optical mode laterally (e.g., in the width direction) in the optical modulator. In another embodiment, ridge portions may be formed on both the lower and the upper waveguides. These ridge portions may be aligned in a vertical direction (e.g., a thickness direction) so that ridges overlap which may further improve optical efficiency by centering an optical mode in the charge modulation region.
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公开(公告)号：US20190310431A1
公开(公告)日：2019-10-10
申请号：US15946930
申请日：2018-04-06
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar PATEL , Kumar Satya Harinadh POTLURI , Jock T. BOVINGTON , Ashley J. MAKER
Abstract: Embodiments herein describe a fiber array unit (FAU) configured to optically couple a photonic chip with a plurality of optical fibers. Epoxy can be used to bond the FAU to the photonic chip. However, curing the epoxy between the FAU and the photonic chip is difficult. As such, the FAU can include one or more optical windows etched into or completely through a non-transparent layer that overlap the epoxy disposed on the photonic chip. UV radiation can be emitted through the optical windows to cure the underlying epoxy. In one example, the windows can also be used for dispensing epoxy. In addition to the optical windows, the FAU can include alignment protrusions (e.g., frustums) which mate or interlock with respective alignment receivers in the photonic chip. Doing so may facilitate passive alignment of the optical fibers in the FAU to an optical interface in the photonic chip.
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公开(公告)号：US20190273361A1
公开(公告)日：2019-09-05
申请号：US15910852
申请日：2018-03-02
Applicant: Cisco Technology, Inc.
Inventor： Dominic F. SIRIANI , Sean P. ANDERSON , Vipulkumar PATEL
Abstract: A method of creating a laser, comprising: bonding a III-V semiconductor material with a silicon substrate; removing excess III-V semiconductor material bonded with the substrate to leave a III-V semiconductor material base layer of a predetermined thickness bonded with the substrate; and after removing the excess III-V semiconductor material, epitaxially growing at least one layer on the III-V semiconductor material base layer, the at least one layer comprising a quantum dot layer.
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公开(公告)号：US20190265437A1
公开(公告)日：2019-08-29
申请号：US15904038
申请日：2018-02-23
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar PATEL , Sean P. ANDERSON , Weizhuo LI
Abstract: A system and related method and assembly are disclosed. The system comprises one or more optical fibers configured to propagate one or more optical signals. The system further comprises at least a first cylindrical lens element fixedly connected with the one or more optical fibers and configured to expand the one or more optical signals along a predefined dimension. The system further comprises at least a second cylindrical lens element optically coupled with the first cylindrical lens element and configured to condense the expanded one or more optical signals along the predefined dimension.
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公开(公告)号：US20160147087A1
公开(公告)日：2016-05-26
申请号：US15009483
申请日：2016-01-28
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar PATEL , Prakash GOTHOSKAR
CPC classification number: G02F1/025 , G02B6/132 , G02B6/136 , G02F1/011 , G02F1/2257 , G02F2001/0152
Abstract: An optical modulator may include a leftmost waveguide, a rightmost waveguide, and a dielectric layer disposed therebetween. In one embodiment, the waveguides may be disposed on the same plane. When a voltage potential is created between the rightmost and leftmost waveguides, these layers form a silicon-insulator-silicon capacitor (also referred to as SISCAP) structure that provides efficient, high-speed optical modulation of an optical signal passing through the modulator. As opposed to a horizontal SISCAP structure where the dielectric layer is disposed between upper and lower waveguides, arranging the dielectric layer between waveguides disposed on the same plane results in a vertical SISCAP structure. In one embodiment, the leftmost and rightmost waveguide are both made from crystalline silicon.
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