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    INTERPOSER CONFIGURATION WITH THERMALLY ISOLATED REGIONS FOR TEMPERATURE-SENSITIVE OPTO-ELECTRONIC COMPONENTS
    2.
    发明申请
    INTERPOSER CONFIGURATION WITH THERMALLY ISOLATED REGIONS FOR TEMPERATURE-SENSITIVE OPTO-ELECTRONIC COMPONENTS 有权
    具有温度敏感光电元件的热隔离区域的间隔器配置

    公开(公告)号：US20150023377A1

    公开(公告)日：2015-01-22

    申请号：US14510654

    申请日：2014-10-09

    Applicant: Cisco Technology, Inc.

    Inventor： Kalpendu SHASTRI ,  Soham PATHAK ,  Vipulkumar PATEL ,  Bipin DAMA ,  Kishor DESAI

    IPC: H01S5/024 ,  H01S5/022 ,  H01S5/40 ,  H01S5/00

    CPC classification number: H01S5/02415 ,  G02B6/42 ,  G02B6/4273 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/02248 ,  H01S5/024 ,  H01S5/02469 ,  H01S5/4025

    Abstract: An interposer (support substrate) for an opto-electronic assembly is formed to include a thermally-isolated region where temperature-sensitive devices (such as, for example, laser diodes) may be positioned and operate independent of temperature fluctuations in other areas of the assembly. The thermal isolation is achieved by forming a boundary of dielectric material through the thickness of the interposer, the periphery of the dielectric defining the boundary between the thermally isolated region and the remainder of the assembly. A thermo-electric cooler can be used in conjunction with the temperature-sensitive device(s) to stabilize the operation of these devices.

    Abstract translation: 形成用于光电组件的插入器（支撑衬底），以包括热隔离区域，其中可以将温度敏感器件（例如激光二极管）定位并独立于其中的温度波动 部件。 通过形成介电材料的边界通过插入件的厚度来实现热隔离，绝缘体的外围限定了热隔离区域和组件的其余部分之间的边界。 热电冷却器可与温度敏感设备结合使用，以稳定这些设备的运行。

    ALIGNING OPTICAL COMPONENTS IN A MULTICHANNEL RECEIVER OR TRANSMITTER PLATFORM
    3.
    发明申请
    ALIGNING OPTICAL COMPONENTS IN A MULTICHANNEL RECEIVER OR TRANSMITTER PLATFORM 有权
    在多通道接收机或发射机平台中对准光学部件

    公开(公告)号：US20160050019A1

    公开(公告)日：2016-02-18

    申请号：US14462239

    申请日：2014-08-18

    Applicant: Cisco Technology, Inc.

    Inventor： Prakash GOTHOSKAR ,  Vipulkumar PATEL ,  Kalpendu SHASTRI ,  Rao V. YELAMARTY

    IPC: H04B10/40

    CPC classification number: H04B10/40 ,  G02B6/4215 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4249

    Abstract: Embodiments described herein describe a sub-mount that is etched to include respective cavities with at least two adjacent sides that align optical filters and a mirror. Moreover, the cavities are arranged on the sub-mount such that when the filters and mirror are disposed in the cavities, they align in a manner that enables the performance of a multiplexing or demultiplexing function as part of, for example, a zigzag multiplexer/demultiplexer. In one embodiment, the filters and mirrors are aligned passively rather than actively. The sub-mount may then be placed on a substrate that includes other components of a ROSA or TOSA. In one embodiment, the substrate is also etched to include a cavity two adjacent sides to align the sub-mount so that sub-mount is passively aligned once disposed into the cavity.

    Abstract translation: 本文所述的实施例描述了一种子座，其被蚀刻以包括具有对准光学滤光器和反射镜的至少两个相邻侧的相应空腔。 此外，空腔被布置在子安装座上，使得当滤光器和反射镜设置在空腔中时，它们以使得能够执行复用或解复用功能作为例如锯齿形复用器/ 解复用器 在一个实施例中，滤波器和反射镜被动地而不是主动对准。 然后可以将该子安装件放置在包括ROSA或TOSA的其它部件的基板上。 在一个实施例中，衬底也被蚀刻以包括两个相邻侧面的空腔以对准子安装座，使得一旦设置在空腔中，子安装座被动地对准。

    ARRANGEMENT FOR PLACEMENT AND ALIGNMENT OF OPTO-ELECTRONIC COMPONENTS
    4.
    发明申请
    ARRANGEMENT FOR PLACEMENT AND ALIGNMENT OF OPTO-ELECTRONIC COMPONENTS 有权
    OPTO-ELECTRONIC COMPONENTS的布局和对齐方案

    公开(公告)号：US20160209606A1

    公开(公告)日：2016-07-21

    申请号：US14339921

    申请日：2014-07-24

    Applicant: CISCO TECHNOLOGY, INC.

    Inventor： Kalpendu SHASTRI ,  Ravinder KACHRU ,  Kishor DESAI

    IPC: G02B6/42 ,  G02B6/136 ,  G02B6/12

    CPC classification number: G02B6/423 ,  G01B11/14 ,  G02B6/4239 ,  G02B6/4249

    Abstract: An arrangement for providing passive alignment of optical components on a common substrate uses a set of reference cavities, where each optical device is positioned within a separate reference cavity. The reference cavities are formed to have a predetermined depth, with perimeters slightly larger than the footprint of their associated optical components. The reference cavity includes at least one right-angle corner that is used as a registration corner against which a right-angle corner of an associated optical component is positioned. The placement of each optical component in its own reference cavity allows for passive optical alignment to be achieved by placing each component against its predefined registration corner.

    Abstract translation: 用于在公共衬底上提供光学部件的被动对准的装置使用一组参考腔，其中每个光学装置定位在单独的参考腔内。 参考空腔形成为具有预定深度，其周长稍大于其相关联的光学部件的覆盖区。 参考腔包括至少一个直角角，其被用作相关联的光学部件的直角角位于其上的配准角。 每个光学部件在其自己的参考腔中的放置允许通过将每个部件放置在其预定义的配准角上来实现无源光学对准。

    WAFER SCALE PACKAGING PLATFORM FOR TRANSCEIVERS
    5.
    发明申请
    WAFER SCALE PACKAGING PLATFORM FOR TRANSCEIVERS 有权
    收货机的平均包装平台

    公开(公告)号：US20140248723A1

    公开(公告)日：2014-09-04

    申请号：US14276566

    申请日：2014-05-13

    Applicant: Cisco Technology, Inc.

    Inventor： Kalpendu SHASTRI ,  Vipulkumar PATEL ,  Mark WEBSTER ,  Prakash GOTHOSKAR ,  Ravinder KACHRU ,  Soham PATHAK ,  Rao V. YELAMARTY ,  Thomas DAUGHERTY ,  Bipin DAMA ,  Kaushik PATEL ,  Kishor DESAI

    IPC: H01L25/00 ,  H01L25/16

    CPC classification number: H01L25/50 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/426 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    Abstract: A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

    Abstract translation: 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作“平台”（插入器），在其上安装或集成多个收发器模块的所有组件，硅插入器的顶表面用作参考平面，用于定义 分离光学元件之间的光信号路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。

    SELF-ALIGNING CONNECTORIZED FIBER ARRAY ASSEMBLY
    7.
    发明申请
    SELF-ALIGNING CONNECTORIZED FIBER ARRAY ASSEMBLY 有权
    自耦连接光纤阵列总成

    公开(公告)号：US20150016784A1

    公开(公告)日：2015-01-15

    申请号：US14498669

    申请日：2014-09-26

    Applicant: Cisco Technology, Inc.

    Inventor： Kalpendu SHASTRI ,  Soham PATHAK ,  Utpal CHAKRABARTI ,  Vipulkumar PATEL ,  Bipin DAMA ,  Ravinder KACHRU ,  Kishor DESAI

    IPC: G02B6/42

    CPC classification number: G02B6/4292 ,  B82Y20/00 ,  C03C15/00 ,  G02B6/136 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4259 ,  Y10T29/4978

    Abstract: An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.

    Abstract translation: 一种用于在光电子基板和光纤阵列之间提供自对准光耦合的装置，其中基板由透明盖包围，使得相关联的光信号通过透明盖进入和离开布置。 该装置采取两部分连接的光纤阵列组件的形式，其中两个部件独特地配合以形成自对准配置。 在光信号通过的区域中，透明盖附着有板的形式的第一部分。 第一板包括具有围绕其周边的向内逐渐变细的侧壁的中心开口。 第二板也形成为包括中心开口并且具有下突起，其具有向内渐缩的侧壁，与第一板的向内渐缩的侧壁配合形成自对准的连接纤维阵列组件。 然后将纤维阵列以自对准的方式附接到第二板。

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