Abstract:
An image system configured to record a scanned image of an area. The system includes a single two-dimensional (2D) imager and a rotatable mirror. The 2D imager is formed of a two-dimensional (2D) array of light detectors. The 2D imager is operable in a line-scan mode effective to individually sequence an activated line of light detectors at a time. The rotatable mirror is configured to rotate about an axis parallel to a plane defined by the rotatable mirror. The rotation is effective to vary an angle of the rotatable mirror to pan a projected image of the area across the 2D imager. The angle of the rotatable mirror and the activated line of the 2D imager are synchronized such that the scanned image recorded by the 2D imager is inverted with respect to the projected image.
Abstract:
An illustrative example camera assembly includes a sensor. An infrared cut filter is situated to filter radiation as the radiation approaches the sensor. A plurality of lens elements is situated between the sensor and the infrared cut filter.
Abstract:
An illustrative example method of making a camera includes assembling a plurality of lens elements, a sensor, and a housing to establish an assembly with each of the lens elements and the sensor at least partially in the housing. The assembly is then situated adjacent a circuit board substrate. At least the sensor is secured to the circuit board substrate using surface mount technology (SMT) and the assembly becomes fixed relative to the circuit board substrate.
Abstract:
An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate is provided. The assembly includes a spacer between the device and the substrate. The spacer is configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls. The spacer includes one of solder mask, tape, and/or legend ink.