Via and method of via forming and method of via filling
    13.
    发明授权
    Via and method of via forming and method of via filling 有权
    通孔形成方法和通孔填充方法

    公开(公告)号:US08232626B2

    公开(公告)日:2012-07-31

    申请号:US12814938

    申请日:2010-06-14

    IPC分类号: H01L29/40 H01L21/44 H05K1/11

    摘要: An electronic or micromechanical device having first (11) and second (12) surfaces and a via extending through the device from the first surface to the second surface. The via comprises integrally formed first (84, 86), second (82) and third (88) portions. The first portion (84, 86) extends from the first surface (11) to the second surface (12). The second portion (82) extends over a part of the first surface (11) of the device. The third portion (88) extends over a part of the second surface (12) of the device. Preferably the first portion comprises first and second parts, the second part extending through an active region of the device and having a narrower width than the first part. A method of forming and filling the via is also disclosed.

    摘要翻译: 具有第一表面(11)和第二表面(12)的电子或微机械装置以及从第一表面延伸穿过该装置到第二表面的通孔。 通孔包括一体形成的第一(84,86),第二(82)和第三(88)部分。 第一部分(84,86)从第一表面(11)延伸到第二表面(12)。 第二部分(82)在装置的第一表面(11)的一部分上延伸。 第三部分(88)在装置的第二表面(12)的一部分上延伸。 优选地,第一部分包括第一部分和第二部分,第二部分延伸穿过装置的有源区域并且具有比第一部分更窄的宽度。 还公开了形成和填充通孔的方法。

    VIA AND METHOD OF VIA FORMING AND METHOD OF VIA FILLING
    14.
    发明申请
    VIA AND METHOD OF VIA FORMING AND METHOD OF VIA FILLING 有权
    通过形成的方法和方法以及通过填充的方法

    公开(公告)号:US20110304026A1

    公开(公告)日:2011-12-15

    申请号:US12814938

    申请日:2010-06-14

    摘要: An electronic or micromechanical device having first (11) and second (12) surfaces and a via extending through the device from the first surface to the second surface. The via comprises integrally formed first (84, 86), second (82) and third (88) portions. The first portion (84, 86) extends from the first surface (11) to the second surface (12). The second portion (82) extends over a part of the first surface (11) of the device. The third portion (88) extends over a part of the second surface (12) of the device. Preferably the first portion comprises first and second parts, the second part extending through an active region of the device and having a narrower width than the first part. A method of forming and filling the via is also disclosed.

    摘要翻译: 具有第一表面(11)和第二表面(12)的电子或微机械装置以及从第一表面延伸穿过该装置到第二表面的通孔。 通孔包括一体形成的第一(84,86),第二(82)和第三(88)部分。 第一部分(84,86)从第一表面(11)延伸到第二表面(12)。 第二部分(82)在装置的第一表面(11)的一部分上延伸。 第三部分(88)在装置的第二表面(12)的一部分上延伸。 优选地,第一部分包括第一部分和第二部分,第二部分延伸穿过设备的有源区域并且具有比第一部分更窄的宽度。 还公开了形成和填充通孔的方法。

    Optical transceiver amplifier
    15.
    发明授权
    Optical transceiver amplifier 有权
    光收发放大器

    公开(公告)号:US08055130B2

    公开(公告)日:2011-11-08

    申请号:US12003950

    申请日:2008-01-03

    申请人: Dan Yang

    发明人: Dan Yang

    IPC分类号: H04B10/08 H04B10/00

    CPC分类号: H04B10/2971 H04B10/40

    摘要: Systems and devices for use as optical transceivers and amplifiers in optical networks. An optical transceiver/amplifier has two optical signal circulators, each of which receives one incoming signal and transmits one outgoing optical signal. Each circulator combines its incoming and outgoing signals on to a bidirectional optical connection internal to the transceiver amplifier. Between the two circulators are a pump laser, an optical coupler to couple the pump laser's power into the bidirectional connection, and an amplifying medium for amplifying the bidirectional signals internal to the transceiver amplifier. The amplifying medium may be an Erbium doped fiber which would amplify any optical signal passing through it. In one embodiment, the transceiver amplifier is in a self-contained package that is pluggable into existing equipment using pre-existing ports and interfaces.

    摘要翻译: 用作光网络中的光收发器和放大器的系统和设备。 光收发器/放大器具有两个光信号循环器,每个光信号循环器接收一个输入信号并发送一个输出光信号。 每个循环器将其输入和输出信号组合到收发器放大器内部的双向光学连接。 两个循环器之间是泵浦激光器,将泵浦激光器的功率耦合到双向连接中的光耦合器,以及用于放大收发器放大器内部的双向信号的放大媒体。 放大介质可以是掺铒光纤,其将放大通过它的任何光信号。 在一个实施例中,收发器放大器是可以使用预先存在的端口和接口插入现有设备的独立包装。

    ANTIVIRAL COMPOUNDS AND METHODS OF MAKING AND USING THEREOF
    16.
    发明申请
    ANTIVIRAL COMPOUNDS AND METHODS OF MAKING AND USING THEREOF 有权
    抗病毒化合物及其制备和使用方法

    公开(公告)号:US20110212975A1

    公开(公告)日:2011-09-01

    申请号:US12850806

    申请日:2010-08-05

    CPC分类号: C07D413/06 A61K31/496

    摘要: Compounds which exhibit antiviral activity, particularly against influenza virus, and methods of making and using thereof are described herein. In one embodiment, the compounds are heterocyclic amides containing piperazine and isozazole rings and optionally substituted with one or more substituents. The compounds can be formulated with one or more pharmaceutically acceptable excipients to form compositions suitable for enteral or parenteral administration. The compounds are preferably used to treat or prevent Influenza A infections, such as H1N1, H2N2, H3N2, H5N1, H7N7, H1N2, H9N2, H7N2, H7N3, and H10N7.

    摘要翻译: 本文描述了显示抗病毒活性,特别是针对流感病毒的化合物及其制备和使用方法。 在一个实施方案中,化合物是含有哌嗪和异唑环并任选被一个或多个取代基取代的杂环酰胺。 可以将化合物与一种或多种药学上可接受的赋形剂配制以形成适于肠内或肠胃外给药的组合物。 该化合物优选用于治疗或预防甲型流感感染,如H1N1,H2N2,H3N2,H5N1,H7N7,H1N2,H9N2,H7N2,H7N3和H10N7。

    Method of Modulating Membrane Potential of a Cell
    17.
    发明申请
    Method of Modulating Membrane Potential of a Cell 有权
    调节细胞膜电位的方法

    公开(公告)号:US20090163595A1

    公开(公告)日:2009-06-25

    申请号:US12337642

    申请日:2008-12-18

    IPC分类号: A61K31/166 C12N5/06

    CPC分类号: A61K31/166

    摘要: Provided herein are methods of modulating membrane potential of a cell membrane using self-assembling compounds. Also provided herein are methods of regulating a natural voltage-dependent ion channel in a cell membrane using the self-assembling compounds disclosed herein. Further provided herein are methods of treating, preventing and/or managing a disease that is related to the abnormal membrane potential responses by using the self-assembling compounds disclosed herein.

    摘要翻译: 本文提供了使用自组装化合物调节细胞膜的膜电位的方法。 本文还提供了使用本文公开的自组装化合物来调节细胞膜中天然的依赖于电压的离子通道的方法。 本文还提供了通过使用本文公开的自组装化合物治疗,预防和/或控制与异常膜电位反应相关的疾病的方法。