Low cost backside illuminated CMOS image sensor package with high integration
    8.
    发明授权
    Low cost backside illuminated CMOS image sensor package with high integration 有权
    低成本背照式CMOS图像传感器封装,集成度高

    公开(公告)号:US08823126B2

    公开(公告)日:2014-09-02

    申请号:US13464939

    申请日:2012-05-04

    IPC分类号: H01L27/146

    摘要: This invention discloses a backside illuminated image sensor without the need to involve a mechanical grinding process or a chemical-mechanical planarization process in fabrication, and a fabricating method thereof. In one embodiment, an image sensor comprises a semiconductor substrate, a plurality of light sensing elements in the semiconductor substrate, and a cavity formed in the semiconductor substrate. The light sensing elements are arranged in a substantially planar manner. The cavity has a base surface overlying the light sensing elements. The presence of the cavity allows the image to reach the light sensing elements through the cavity base surface. The cavity can be fabricated by etching the semiconductor substrate. Agitation may also be used when carrying out the etching.

    摘要翻译: 本发明公开了一种背面照明图像传感器,其制造方法不需要涉及机械研磨工艺或化学机械平面化工艺。 在一个实施例中,图像传感器包括半导体衬底,半导体衬底中的多个感光元件和形成在半导体衬底中的空腔。 光感测元件以基本上平面的方式布置。 空腔具有覆盖光敏元件的基面。 空腔的存在允许图像通过空腔基面到达光感测元件。 可以通过蚀刻半导体衬底来制造空腔。 进行蚀刻时也可以使用搅拌。

    Via and method of via forming and method of via filling
    10.
    发明授权
    Via and method of via forming and method of via filling 有权
    通孔形成方法和通孔填充方法

    公开(公告)号:US08232626B2

    公开(公告)日:2012-07-31

    申请号:US12814938

    申请日:2010-06-14

    IPC分类号: H01L29/40 H01L21/44 H05K1/11

    摘要: An electronic or micromechanical device having first (11) and second (12) surfaces and a via extending through the device from the first surface to the second surface. The via comprises integrally formed first (84, 86), second (82) and third (88) portions. The first portion (84, 86) extends from the first surface (11) to the second surface (12). The second portion (82) extends over a part of the first surface (11) of the device. The third portion (88) extends over a part of the second surface (12) of the device. Preferably the first portion comprises first and second parts, the second part extending through an active region of the device and having a narrower width than the first part. A method of forming and filling the via is also disclosed.

    摘要翻译: 具有第一表面(11)和第二表面(12)的电子或微机械装置以及从第一表面延伸穿过该装置到第二表面的通孔。 通孔包括一体形成的第一(84,86),第二(82)和第三(88)部分。 第一部分(84,86)从第一表面(11)延伸到第二表面(12)。 第二部分(82)在装置的第一表面(11)的一部分上延伸。 第三部分(88)在装置的第二表面(12)的一部分上延伸。 优选地,第一部分包括第一部分和第二部分,第二部分延伸穿过装置的有源区域并且具有比第一部分更窄的宽度。 还公开了形成和填充通孔的方法。