公开(公告)号：US20080048306A1

公开(公告)日：2008-02-28

申请号：US11467232

申请日：2006-08-25

申请人： Nigel Stewart ,  Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

发明人： Nigel Stewart ,  Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

IPC分类号： H01L23/06

CPC分类号： H01L21/6719 ,  H01L21/67115 ,  H01L21/67126

摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The second electrode may move with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

摘要翻译： 用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第二电极可以与第二密封件一起移动。 光源将光照射到晶片的第一面上。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

公开(公告)号：US06428660B2

公开(公告)日：2002-08-06

申请号：US09811379

申请日：2001-03-15

申请人： Daniel J. Woodruff ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Kyle M. Hanson

IPC分类号： C28D1700

CPC分类号： C25D17/001 ,  C25D5/08 ,  C25D7/123 ,  C25D17/06

摘要： An improved anode, cup and conductor assembly for a reactor vessel includes an anode assembly supported within a cup which holds a supply of process fluid. The cup is supported around its perimeter within the reactor vessel. The anode assembly has an anode shield carrying an anode, the anode shield having upwardly extending brackets with radially extending members. A diffusion plate is supported above the anode by the anode brackets using first bayonet connections. The anode shield and the anode are supported from below by a delivery tube which also serves to deliver process fluid to the cup. A second bayonet connection is provided between a top portion of the delivery tube and the anode assembly. The fluid delivery tube has a fixed height within the vessel. The anode elevation is adjusted by the interposing of a spacer of desired thickness between the anode and the tube. An electrical conductor is connected to the anode, and passes through the tube to be electrically accessible outside the vessel. The conductor is connected to the anode with a plug-in connection which is completed when the tube is coupled to the anode by the second bayonet connection. A spring loaded bellows seal and a corrugated sleeve seal the electrical conductor from the anode, through the delivery tube, and to the outside electrical accessibility. The diffusion plate and the anode assembly are installable and removable from a top side of the reactor vessel using a tool which is lockable to the diffusion plate or to the anode. The tool provides a handle for manual engagement or disengagement of the first and second bayonet connections.

摘要翻译： 用于反应器容器的改进的阳极，杯和导体组件包括支撑在保持供给工艺流体的杯内的阳极组件。 杯子围绕反应堆容器内的周边支撑。 阳极组件具有承载阳极的阳极屏蔽件，阳极屏蔽件具有向上延伸的具有径向延伸构件的托架。 扩散板通过第一个卡口连接由阳极支架支撑在阳极的上方。 阳极护罩和阳极从下方被输送管支撑，输送管也用于将工艺流体输送到杯子。 在输送管的顶部和阳极组件之间设置第二卡口连接。 流体输送管在容器内具有固定的高度。 通过在阳极和管之间插入所需厚度的间隔物来调节阳极高度。 电导体连接到阳极，并且通过管以在电容器外部电可通达。 导体通过插入式连接方式连接到阳极，该插入式连接在管通过第二卡口连接与阳极连接时完成。 弹簧加载的波纹管密封件和波纹套筒将电导体从阳极密封，通过输送管和外部电气可接近性。 扩散板和阳极组件可以使用可被锁定到扩散板或阳极的工具从反应器容器的顶侧安装和移除。 该工具提供用于手动接合或解除第一和第二卡口连接的手柄。

公开(公告)号：US07357850B2

公开(公告)日：2008-04-15

申请号：US10234638

申请日：2002-09-03

申请人： Daniel J. Woodruff ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Kyle M. Hanson

IPC分类号： C25D17/12 ,  C25D17/00 ,  C25B9/00 ,  C25D3/38

CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001

摘要： An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

摘要翻译： 电镀设备包括反应器容器，其具有定位在其中的分段阳极阵列，用于实现诸如半导体晶片的相关工件的电镀。 阳极阵列包括多个环形阳极段，其优选地彼此以同心的，共面的关系定位。 阳极段可以独立地操作以产生与相关联的工件的变化的电势，以促进电镀金属在工件表面上的均匀沉积。

公开(公告)号：US06645356B1

公开(公告)日：2003-11-11

申请号：US09386558

申请日：1999-08-31

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Thomas H. Oberlitner ,  LinLin Chen ,  John M. Pedersen ,  Vladimir Zila

IPC分类号： C25D1700

CPC分类号： C25D17/001 ,  C25D7/123

摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.

公开(公告)号：US07935230B2

公开(公告)日：2011-05-03

申请号：US11608151

申请日：2006-12-07

申请人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Nigel Stewart ,  Erik Lund ,  Steven L. Peace

发明人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Nigel Stewart ,  Erik Lund ,  Steven L. Peace

IPC分类号： C25F7/00

CPC分类号： C25D17/001 ,  C25D17/004

摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first and/or second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal, and the second electrode may move along with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

摘要翻译： 用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第一和/或第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第一电极可以与第一密封件一起移动，并且第二电极可以与第二密封件一起移动。 光源将光照射到晶片的第一面上。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

公开(公告)号：US06849167B2

公开(公告)日：2005-02-01

申请号：US10338200

申请日：2003-01-07

申请人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Robert W. Batz, Jr. ,  James T. Kuechmann

发明人： Daniel J. Woodruff ,  Kyle M. Hanson ,  Robert W. Batz, Jr. ,  James T. Kuechmann

IPC分类号： C25D7/12 ,  H01L21/687 ,  C25B9/12 ,  C25D17/06

CPC分类号： H01L21/68728 ,  C25D17/001 ,  H01L21/68785

摘要： An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface. An actuator is provided for driving the workpiece support between a first position in which the at least one electrical contact of the workpiece and the at least one contact of the workpiece holding structure are disengaged from one another, and a second position in which the at least one surface clamps the workpiece in a position in which the at least one electrical contact of the workpiece holding structure electrically engages the at least one electrical contact of the workpiece.

摘要翻译： 公开了一种用于电镀工件的设备，其中该设备包括工件保持结构。 工件保持结构包括具有至少一个表面的工件支撑件，所述至少一个表面设置成与工件的前侧相接合，以及至少一个电触点，该电触点设置成用于与工件的背面上的至少一个对应的电触点接触。 所述工件包括在所述至少一个对应的电触点和所述工件的前侧之间的一个或多个导电路径，以便于所述前侧表面的电镀。 提供致动器，用于在第一位置和第二位置之间驱动工件支撑件，在第一位置，工件的至少一个电触点与工件保持结构的至少一个触点彼此脱离，第二位置至少 一个表面将工件夹紧在其中工件保持结构的至少一个电接触与工件的至少一个电接触电接合的位置。

公开(公告)号：US06497801B1

公开(公告)日：2002-12-24

申请号：US09113418

申请日：1998-07-10

申请人： Daniel J. Woodruff ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Kyle M. Hanson

IPC分类号： C25D550

CPC分类号： C25D17/12 ,  C25D7/123 ,  C25D17/001

摘要： An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

摘要翻译： 电镀设备包括反应器容器，其具有定位在其中的分段阳极阵列，用于实现诸如半导体晶片的相关工件的电镀。 阳极阵列包括多个环形阳极段，其优选地彼此以同心的，共面的关系定位。 阳极段可以独立地操作以产生与相关联的工件的变化的电势，以促进电镀金属在工件表面上的均匀沉积。

公开(公告)号：US06280582B1

公开(公告)日：2001-08-28

申请号：US09385781

申请日：1999-08-30

申请人： Daniel J. Woodruff ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Kyle M. Hanson

IPC分类号： C25D1702

CPC分类号： C25D17/001 ,  C25D5/08 ,  C25D7/123 ,  C25D17/06

摘要： An improved anode, cup and conductor assembly for a reactor vessel includes an anode assembly supported within a cup which holds a supply of process fluid. The anode assembly has an anode shield carrying an anode. The anode shield and the anode are supported from below by a delivery tube which also serves to deliver process fluid to the cup. A bayonet connection is provided between a top portion of the delivery tube and the anode assembly. The fluid delivery tube has a fixed height within the vessel. The anode elevation is adjusted by the interposing of a spacer of desired thickness between the anode and the tube. An electrical conductor is connected to the anode, and passes through the tube to be electrically accessible outside the vessel. The conductor is connected to the anode with a plug-in connection which is completed when the tube is coupled to the anode by the bayonet connection. A spring loaded bellos seal and a corrugated sleeve seal the electrical conductor from the anode, though the delivery tube, and to the outside electrical accessibility.

摘要翻译： 用于反应器容器的改进的阳极，杯和导体组件包括支撑在保持供给工艺流体的杯内的阳极组件。 阳极组件具有承载阳极的阳极屏蔽层。 阳极护罩和阳极从下方被输送管支撑，输送管也用于将工艺流体输送到杯子。 在输送管的顶部和阳极组件之间提供卡口连接。 流体输送管在容器内具有固定的高度。 通过在阳极和管之间插入所需厚度的间隔物来调节阳极高度。 电导体连接到阳极，并且通过管以在电容器外部电可通达。 导体通过插入式连接连接到阳极，当插管通过卡口连接将管连接到阳极时，该插件连接完成。 弹簧加载的贝氏体密封件和波纹套筒将电导体从阳极密封，尽管是输送管，并且与外部的电气可达性密封。

公开(公告)号：US06228232B1

公开(公告)日：2001-05-08

申请号：US09112300

申请日：1998-07-09

申请人： Daniel J. Woodruff ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Kyle M. Hanson

IPC分类号： C25B900

CPC分类号： C25D17/001 ,  C25D5/08 ,  C25D7/123 ,  C25D17/06

摘要： An improved anode, cup and conductor assembly for a reactor vessel includes an anode assembly supported within a cup which holds a supply of process fluid. The cup is supported around its perimeter within the reactor vessel. The anode assembly has an anode shield carrying an anode, the anode shield having upwardly extending brackets with radially extending members. A diffusion plate is supported above the anode by the anode brackets using first bayonet connections. The anode shield and the anode are supported from below by a delivery tube which also serves to deliver process fluid to the cup. A second bayonet connection is provided between a top portion of the delivery tube and the anode assembly. The fluid delivery tube has a fixed height within the vessel. The anode elevation is adjusted by the interposing of a spacer of desired thickness between the anode and the tube. An electrical conductor is connected to the anode, and passes through the tube to be electrically accessible outside the vessel. The conductor is connected to the anode with a plug-in connection which is completed when the tube is coupled to the anode by the second bayonet connection. A spring loaded bellows seal and a corrugated sleeve seal the electrical conductor from the anode, through the delivery tube, and to the outside electrical accessibility. The diffusion plate and the anode assembly are installable and removable from a top side of the reactor vessel using a tool which is lockable to the diffusion plate or to the anode. The tool provides a handle for manual engagement or disengagement of the first and second bayonet connections.

摘要翻译： 用于反应器容器的改进的阳极，杯和导体组件包括支撑在保持供给工艺流体的杯内的阳极组件。 杯子围绕反应堆容器内的周边支撑。 阳极组件具有承载阳极的阳极屏蔽件，阳极屏蔽件具有向上延伸的具有径向延伸构件的托架。 扩散板通过第一个卡口连接由阳极支架支撑在阳极的上方。 阳极护罩和阳极从下方被输送管支撑，输送管也用于将工艺流体输送到杯子。 在输送管的顶部和阳极组件之间设置第二卡口连接。 流体输送管在容器内具有固定的高度。 通过在阳极和管之间插入所需厚度的间隔物来调节阳极高度。 电导体连接到阳极，并且通过管以在电容器外部电可通达。 导体通过插入式连接方式连接到阳极，该插入式连接在管通过第二卡口连接与阳极连接时完成。 弹簧加载的波纹管密封件和波纹套筒将电导体从阳极密封，通过输送管和外部电气可接近性。 漫射板和阳极组件可以使用可被锁定到扩散板或阳极的工具从反应堆容器的顶侧安装和移除。 该工具提供用于手动接合或解除第一和第二卡口连接的手柄。

公开(公告)号：US06080291A

公开(公告)日：2000-06-27

申请号：US113723

申请日：1998-07-10

申请人： Daniel J. Woodruff ,  Kyle M. Hanson

发明人： Daniel J. Woodruff ,  Kyle M. Hanson

IPC分类号： C25D5/08 ,  C25D7/12 ,  C25D17/06 ,  C25D17/04

CPC分类号： C25D17/001 ,  C25D17/06 ,  C25D5/08 ,  C25D7/123

摘要： A plating apparatus, such as for electroplating of semiconductor wafers or like workpieces, includes a plating contact including an annular contact ring having an annular mounting portion, and an annular electrically-conductive contact portion extending inwardly of the mounting portion. The contact portion is configured for substantially continuous electrically-conductive contact with a peripheral region of the associated workpiece. The arrangement further includes an annular seal member mounted on the annular contact ring, with the seal member including a resiliently deformable annular seal lip portion adjacent to the contact portion of the contact ring. The seal lip is resiliently biased into continuous sealing engagement with the peripheral region of the workpiece when the workpiece is positioned in electrically-conductive contact with the contact ring. The apparatus includes a rotor assembly configured to receive the workpiece, and move the workpiece into operative contact with the annular contact ring and the annular seal member.

摘要翻译： 诸如用于电镀半导体晶片或类似工件的电镀设备包括电镀触点，其包括具有环形安装部分的环形接触环和从安装部分向内延伸的环形导电接触部分。 接触部分构造成与相关联的工件的周边区域基本上连续的导电接触。 该装置还包括安装在环形接触环上的环形密封件，密封件包括与接触环的接触部分相邻的可弹性变形的环形密封唇部分。 当工件定位成与接触环导电接触时，密封唇被弹性偏压成与工件的周边区域的连续密封接合。 该装置包括构造成接收工件并将工件移动到与环形接触环和环形密封构件有效接触的转子组件。