公开(公告)号：US20080048306A1

公开(公告)日：2008-02-28

申请号：US11467232

申请日：2006-08-25

申请人： Nigel Stewart ,  Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

发明人： Nigel Stewart ,  Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

IPC分类号： H01L23/06

CPC分类号： H01L21/6719 ,  H01L21/67115 ,  H01L21/67126

摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The second electrode may move with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

摘要翻译： 用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第二电极可以与第二密封件一起移动。 光源将光照射到晶片的第一面上。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

公开(公告)号：US07935230B2

公开(公告)日：2011-05-03

申请号：US11608151

申请日：2006-12-07

申请人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Nigel Stewart ,  Erik Lund ,  Steven L. Peace

发明人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Nigel Stewart ,  Erik Lund ,  Steven L. Peace

IPC分类号： C25F7/00

CPC分类号： C25D17/001 ,  C25D17/004

摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first and/or second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal, and the second electrode may move along with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

摘要翻译： 用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第一和/或第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第一电极可以与第一密封件一起移动，并且第二电极可以与第二密封件一起移动。 光源将光照射到晶片的第一面上。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

公开(公告)号：US07927469B2

公开(公告)日：2011-04-19

申请号：US11467232

申请日：2006-08-25

申请人： Nigel Stewart ,  Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

发明人： Nigel Stewart ,  Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

IPC分类号： C25F7/00

CPC分类号： H01L21/6719 ,  H01L21/67115 ,  H01L21/67126

摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The second electrode may move with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

摘要翻译： 用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第二电极可以与第二密封件一起移动。 光源将光照射到晶片的第一面上。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

公开(公告)号：US20080003781A1

公开(公告)日：2008-01-03

申请号：US11608151

申请日：2006-12-07

申请人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Nigel Stewart ,  Erik Lund ,  Steven L. Peace

发明人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Nigel Stewart ,  Erik Lund ,  Steven L. Peace

IPC分类号： H01L21/326

CPC分类号： C25D17/001 ,  C25D17/004

摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first and/or second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal, and the second electrode may move along with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

摘要翻译： 用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第一和/或第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第一电极可以与第一密封件一起移动，并且第二电极可以与第二密封件一起移动。 光源将光照射到晶片的第一面上。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

公开(公告)号：US07909967B2

公开(公告)日：2011-03-22

申请号：US11457192

申请日：2006-07-13

申请人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

发明人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

IPC分类号： C25F7/00

CPC分类号： C25F7/00

摘要： An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

摘要翻译： 用于制造多孔硅或处理其它衬底的电化学处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第一密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第一电极可以与第一密封件一起移动。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

公开(公告)号：US20100078334A1

公开(公告)日：2010-04-01

申请号：US11457192

申请日：2006-07-13

申请人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

发明人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

IPC分类号： C25F3/00 ,  C25F7/00 ,  C25B9/00 ,  C25D17/00 ,  C25C7/00

CPC分类号： C25F7/00

摘要： An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

摘要翻译： 用于制造多孔硅或处理其它衬底的电化学处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第一密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第一电极可以与第一密封件一起移动。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

公开(公告)号：US07102763B2

公开(公告)日：2006-09-05

申请号：US09902491

申请日：2001-07-09

申请人： Thomas L. Ritzdorf ,  Steve L. Eudy ,  Gregory J. Wilson ,  Paul R. McHugh ,  Robert A. Weaver ,  Brian Aegerter ,  Curt Dundas ,  Steven L. Peace

发明人： Thomas L. Ritzdorf ,  Steve L. Eudy ,  Gregory J. Wilson ,  Paul R. McHugh ,  Robert A. Weaver ,  Brian Aegerter ,  Curt Dundas ,  Steven L. Peace

IPC分类号： G01B11/28 ,  H01L21/306 ,  B05C11/00

CPC分类号： H01L21/67173 ,  H01L21/67103 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/6723 ,  H01L21/67751

摘要： A method and apparatus for processing a microelectronic workpiece using metrology. The apparatus can include one or more processing or transport units, a metrology unit, and a control unit coupled to the metrology unit and at least one of the processing or transport units. The control unit can modify a process recipe or a process sequence of the processing unit based on a feed forward or a feed back signal from the metrology unit. The control unit can also provide instructions to the transport unit to move the workpiece to a selected processing unit. The processing unit can include, inter alia, a seed layer deposition unit, a process layer electrochemical deposition unit, a seed layer enhancement unit, a chemical mechanical polishing unit, and/or an annealing chamber arranged for sequential processing of a workpiece. The processing units can be controlled as an integrated system using one or more metrology units, or a separate metrology unit can provide input to the processing units.

公开(公告)号：US07857958B2

公开(公告)日：2010-12-28

申请号：US11776918

申请日：2007-07-12

申请人： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson

发明人： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson

IPC分类号： C25D5/00 ,  C25D21/12

CPC分类号： C25D21/12 ,  C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D17/007 ,  C25D17/02 ,  C25D17/10 ,  C25D17/12 ,  H01L21/6723

摘要： A method and apparatus for processing a microfeature workpiece. In one embodiment, the apparatus includes a support member configured to carry a microfeature workpiece at a workpiece plane, and a vessel positioned at least proximate to the support member. The vessel has a vessel surface facing toward the support member and positioned to carry a processing liquid. The vessel surface is shaped to provide an at least approximately uniform current density at the workpiece plane. At least one electrode, such as a thieving electrode, is disposed within the vessel. In a further aspect of this embodiment, the thieving electrode can be easily removable along with conductive material it attracts from the processing liquid. The shape of the vessel surface, the current supplied to the thieving electrode and/or the diameter of an aperture upstream of the workpiece are changed dynamically in other embodiments.

摘要翻译： 一种用于处理微特征工件的方法和装置。 在一个实施例中，该装置包括构造成在工件平面处承载微特征工件的支撑构件和至少靠近支撑构件定位的容器。 容器具有面向支撑构件的容器表面并且定位成承载处理液体。 容器表面成形为在工件平面处提供至少近似均匀的电流密度。 至少一个电极，例如电极，设置在容器内。 在该实施例的另一方面，该窃电电极可以容易地从其从处理液体吸引的导电材料移除。 在其他实施例中，容器表面的形状，提供给电极的电流和/或工件上游的孔的直径被动态地改变。

公开(公告)号：US07247223B2

公开(公告)日：2007-07-24

申请号：US10426029

申请日：2003-04-28

申请人： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson

发明人： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson

IPC分类号： C25D17/02 ,  C25D7/12

CPC分类号： C25D21/12 ,  C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D17/007 ,  C25D17/02 ,  C25D17/10 ,  C25D17/12 ,  H01L21/6723

摘要： A method and apparatus for processing a microfeature workpiece. In one embodiment, the apparatus includes a support member configured to carry a microfeature workpiece at a workpiece plane, and a vessel positioned at least proximate to the support member. The vessel has a vessel surface facing toward the support member and positioned to carry a processing liquid. The vessel surface is shaped to provide an at least approximately uniform current density at the workpiece plane. At least one electrode, such as a thieving electrode, is disposed within the vessel. In a further aspect of this embodiment, the thieving electrode can be easily removable along with conductive material it attracts from the processing liquid. The shape of the vessel surface, the current supplied to the thieving electrode and/or the diameter of an aperture upstream of the workpiece are changed dynamically in other embodiments.

摘要翻译： 一种用于处理微特征工件的方法和装置。 在一个实施例中，该装置包括构造成在工件平面处承载微特征工件的支撑构件和至少靠近支撑构件定位的容器。 容器具有面向支撑构件的容器表面并且定位成承载处理液体。 容器表面成形为在工件平面处提供至少近似均匀的电流密度。 至少一个电极，例如电极，设置在容器内。 在该实施例的另一方面，该窃电电极可以容易地从其从处理液体吸引的导电材料移除。 在其他实施例中，容器表面的形状，提供给电极的电流和/或工件上游的孔的直径被动态地改变。

公开(公告)号：US06569297B2

公开(公告)日：2003-05-27

申请号：US09804696

申请日：2001-03-12

申请人： Gregory J. Wilson ,  Paul R. McHugh ,  Kyle M. Hanson

发明人： Gregory J. Wilson ,  Paul R. McHugh ,  Kyle M. Hanson

IPC分类号： C25D1700

CPC分类号： C25D17/02 ,  C25D5/08 ,  C25D17/001 ,  Y10S204/07

摘要： A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microelectronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (505) providing a flow of processing fluid to at least one surface of the workpiece and a plurality of nozzles (535) disposed to provide a flow of processing fluid to the principal fluid flow chamber. The plurality of nozzles are arranged and directed to provide vertical and radial fluid flow components that combine to generate a substantially uniform normal flow component radially across the surface of the workpiece. An exemplary apparatus using such a processing container is also set forth that is particularly adapted to carry out an electroplating process. In accordance with a further aspect of the present disclosure, an improved fluid removal path (640) is provided for removing fluid from a principal fluid flow chamber during immersion processing of a microelectronic workpiece.