Camera system with rotating mirror
    11.
    发明授权
    Camera system with rotating mirror 有权
    相机系统带旋转镜

    公开(公告)号:US09042717B2

    公开(公告)日:2015-05-26

    申请号:US13955725

    申请日:2013-07-31

    CPC classification number: G03B35/10 H04N3/08 H04N13/211 H04N13/236

    Abstract: An image system configured to record a scanned image of an area. The system includes a single two-dimensional (2D) imager and a rotatable mirror. The 2D imager is formed of a two-dimensional (2D) array of light detectors. The 2D imager is operable in a line-scan mode effective to individually sequence an activated line of light detectors at a time. The rotatable mirror is configured to rotate about an axis parallel to a plane defined by the rotatable mirror. The rotation is effective to vary an angle of the rotatable mirror to pan a projected image of the area across the 2D imager. The angle of the rotatable mirror and the activated line of the 2D imager are synchronized such that the scanned image recorded by the 2D imager is inverted with respect to the projected image.

    Abstract translation: 被配置为记录区域的扫描图像的图像系统。 该系统包括单个二维(2D)成像器和可旋转镜。 2D成像器由光检测器的二维(2D)阵列形成。 2D成像器可以在线扫描模式下操作,以有效地对激活的光检测器线一次进行排序。 可旋转镜被构造成围绕平行于由可旋转反射镜限定的平面的轴线旋转。 旋转有效地改变可旋转镜的角度以平移2D成像器上的区域的投影图像。 2D成像器的可旋转镜和激活线的角度被同步,使得由2D成像器记录的扫描图像相对于投影图像被反转。

    Ball grid array packaged camera device soldered to a substrate
    14.
    发明授权
    Ball grid array packaged camera device soldered to a substrate 有权
    焊接到基板的球栅阵列封装相机装置

    公开(公告)号:US09231124B2

    公开(公告)日:2016-01-05

    申请号:US14036017

    申请日:2013-09-25

    Abstract: An assembly that attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate is provided. The assembly includes a spacer between the device and the substrate. The spacer is configured to prevent excessive collapse of solder balls located between the device and the substrate during reflow of the solder balls. The spacer includes one of solder mask, tape, and/or legend ink.

    Abstract translation: 提供了一种将球栅阵列(BGA)封装的相机装置附接到印刷电路板(PCB)基板的组件。 组件包括在装置和基板之间的间隔件。 隔离件构造成防止在焊球回流期间位于装置和基板之间的焊球的过度塌陷。 间隔物包括焊接掩模,胶带和/或图例油墨之一。

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