Optical sub-assembly for opto-electronic modules
    13.
    发明申请
    Optical sub-assembly for opto-electronic modules 有权
    光电子模块的光学子组件

    公开(公告)号:US20050175297A1

    公开(公告)日:2005-08-11

    申请号:US11095637

    申请日:2005-03-30

    摘要: Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. In some embodiments the base substrate is formed from a ceramic material having the electrical traces formed thereon. In other implementations the substrate includes a backing block having a flexible printed circuit substrate adhered thereto.

    摘要翻译: 描述了用于方便地布置用于将电压和电流域的信号传导到红外辐射域的装置的概念。 具体地说,描述了光电子元件及其制造方法。 在一个方面,光电子部件包括具有一对成角度(或基本上垂直)的表面的基底基板,其间延伸有电迹线。 半导体芯片组件安装在基底基板的第一面上,并且光子器件安装在第二面上。 半导体芯片组件和光子器件都与基底衬底上的迹线电连接。 半导体芯片组件通常被布置成电连接到外部装置。 光子器件通常布置成与一根或多根光纤光学通信。 所描述的结构可以与各种各样的光子器件一起使用。 在一些实施例中,基底由具有形成在其上的电迹线的陶瓷材料形成。 在其它实施方式中,基板包括具有粘附到其上的柔性印刷电路基板的背衬块。