公开(公告)号：US20190217419A1

公开(公告)日：2019-07-18

申请号：US16248264

申请日：2019-01-15

Applicant: DISCO CORPORATION

Inventor： Naotoshi KIRIHARA ,  Noboru TAKEDA ,  Yukihiro KIRIBAYASHI ,  Hiroshi MORIKAZU ,  Taro ARAKAWA

IPC: B23K26/364 ,  H01L21/8258 ,  B23K26/53 ,  B23K26/0622 ,  H01L21/304

CPC classification number: B23K26/364 ,  B23K26/0622 ,  B23K26/402 ,  B23K26/53 ,  B23K2101/40 ,  H01L21/3043 ,  H01L21/8258

Abstract: A method of processing a plate-shaped work-piece with a laser beam so as to be divided along a plurality of projected dicing lines on the workpiece includes: forming a plurality of first shield tunnels, each including fine pores and an amorphous substance surrounding the fine pores, in the workpiece along the projected dicing lines by applying a pulsed laser beam having a wavelength transmittable through the workpiece to the workpiece along the projected dicing lines while positioning a converged zone of the pulsed laser beam within the workpiece; changing the converged zone of the pulsed laser beam to be applied to the workpiece to a position along thicknesswise directions of the workpiece; and, forming a plurality of second shield tunnels in the workpiece adjacent and parallel to the first shield tunnels along the direction in which the pulsed laser bream is applied.

公开(公告)号：US20250087489A1

公开(公告)日：2025-03-13

申请号：US18820909

申请日：2024-08-30

Applicant: DISCO CORPORATION

Inventor： Taro ARAKAWA

IPC: H01L21/268 ,  H01L21/78

Abstract: A chip manufacturing method for manufacturing a chip includes: forming shield tunnels each having a fine pore and an amorphous region surrounding the fine pore along the planned division line, by relatively moving the wafer and a focal point of a laser beam having a wavelength transmissive to the wafer in a condition in which the focal point is positioned inside the wafer; and dividing the wafer along the planned division line where the shield tunnels are formed by applying an external force to the wafer. Forming the shield tunnels includes: shaping the laser beam into a shape having a longitudinal direction and a transverse direction; and irradiating the wafer with the laser beam along the planned division line in a state where the longitudinal direction is set to intersect an extending direction of the planned division line.

公开(公告)号：US20210013100A1

公开(公告)日：2021-01-14

申请号：US16916408

申请日：2020-06-30

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L23/544 ,  H01L21/268 ,  H01L21/683

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet in each of the plurality of separate regions corresponding to each device chip, pushing up each device chip through the polyester sheet, then picking up each device chip from the polyester sheet.

公开(公告)号：US20200266102A1

公开(公告)日：2020-08-20

申请号：US16774689

申请日：2020-01-28

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/683

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form division grooves in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet in each region of the polyolefin sheet corresponding to each device chip, pushing up each device chip from the polyolefin sheet side to pick up each device chip from the polyolefin sheet.

公开(公告)号：US20200083104A1

公开(公告)日：2020-03-12

申请号：US16554928

申请日：2019-08-29

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  B23K26/364 ,  B23K26/40 ,  H01L21/304 ,  H01L21/683 ,  C09J7/25

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet, pushing up each device chip through the polyester sheet, and then picking up each device chip from the polyester sheet.

公开(公告)号：US20200013676A1

公开(公告)日：2020-01-09

申请号：US16453503

申请日：2019-06-26

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  B23K26/364 ,  B23K26/40 ,  H01L21/304 ,  H01L21/683 ,  C09J7/25

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and then picking up each device chip from the polyester sheet.

公开(公告)号：US20200013675A1

公开(公告)日：2020-01-09

申请号：US16453051

申请日：2019-06-26

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  B23K26/364 ,  B23K26/40 ,  H01L21/304 ,  H01L21/683 ,  C09J7/25

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of heating the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and then picking up each device chip from the polyolefin sheet.

公开(公告)号：US20210143064A1

公开(公告)日：2021-05-13

申请号：US17083552

申请日：2020-10-29

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/02 ,  H01L21/304 ,  H01L21/447 ,  H01L21/768 ,  B23K26/364 ,  B23K26/40 ,  C09J7/25 ,  C09J7/35

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet, pushing up each device chip through the polyester sheet, and picking up each device chip from the polyester sheet.

公开(公告)号：US20210143063A1

公开(公告)日：2021-05-13

申请号：US17083526

申请日：2020-10-29

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  B23K26/364 ,  B23K26/40 ,  C09J7/24

Abstract: A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and picking up each device chip from the polyolefin sheet.

公开(公告)号：US20210074589A1

公开(公告)日：2021-03-11

申请号：US17015360

申请日：2020-09-09

Applicant: DISCO CORPORATION

Inventor： Shigenori HARADA ,  Minoru MATSUZAWA ,  Hayato KIUCHI ,  Yoshiaki YODO ,  Taro ARAKAWA ,  Masamitsu AGARI ,  Emiko KAWAMURA ,  Yusuke FUJII ,  Toshiki MIYAI ,  Makiko OHMAE

IPC: H01L21/78 ,  H01L21/02 ,  H01L21/304 ,  H01L21/447 ,  H01L21/768 ,  B23K26/364 ,  B23K26/40 ,  C09J7/25

Abstract: A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form shield tunnels in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of blowing air to each device chip from the polyester sheet side to push up each device chip through the polyester sheet and picking up each device chip from the polyester sheet.