公开(公告)号：US5445172A

公开(公告)日：1995-08-29

申请号：US27863

申请日：1993-03-08

申请人： Raymon F. Thompson ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： G11B7/26 ,  H01L21/00 ,  H01L21/687 ,  B08D3/02

CPC分类号： H01L21/68728 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  G11B7/26 ,  Y10S134/902

摘要： A single wafer processing apparatus includes a portable processing head that can be a portable module or a movable unit mounted to a supporting machine frame. The processing head has movable fingers adapted to grip a wafer. The fingers protrude from a protective wafer plate. Indexing and rotation monitoring assemblies are provided for automation of the wafer processing steps. A complementary processing base includes an upwardly-open bowl that receives a wafer held by the portable processing head. It has a full-diameter movable bottom wall for rapid draining purposes. Liquid and/or gas jets and nozzles supply fluids required within the bowl for processing of wafers.

摘要翻译： 单个晶片处理装置包括便携式处理头，其可以是安装到支撑机架的便携式模块或可移动单元。 处理头具有适于夹紧晶片的活动指状物。 指状物从保护性晶片板突出。 提供分度和旋转监测组件用于晶片处理步骤的自动化。 补充处理基座包括接收由便携式处理头保持的晶片的向上开口的碗。 它具有用于快速排水的全直径可移动底壁。 液体和/或气体喷嘴和喷嘴提供碗内所需的流体用于处理晶片。

公开(公告)号：US5232328A

公开(公告)日：1993-08-03

申请号：US665766

申请日：1991-03-05

申请人： Aleksander Owczarz ,  Raymon F. Thompson

发明人： Aleksander Owczarz ,  Raymon F. Thompson

IPC分类号： H01L21/00

CPC分类号： H01L21/67028 ,  Y10S414/14

摘要： A processor for centrifugal processing of semiconductor wafers and similar units. The processor is specially constructed to provide an automatically extendible and retractable rotor head to allow automated loading and unloading of wafers. The processor includes a novel shaft assembly construction which includes an axially extendible shaft controlled using pressurized fluid. The pressurized fluid is supplied to the shaft assembly by a pressure supply which is controllably extendable and retractable for engagement with the shaft assembly when rotation is stopped. The shaft assembly also preferably incorporates an axial locking mechanism which holds the axially movable components of the shaft assembly in fixed axial position during rotation, while allowing release when rotation is stopped so that movable portions of the shaft assembly can be axially extended.

摘要翻译： 用于半导体晶片和类似单元的离心处理的处理器。 处理器是特别构造的，以提供可自动伸缩的转子头，以允许自动装载和卸载晶片。 该处理器包括新颖的轴组件结构，其包括使用加压流体控制的可轴向延伸的轴。 加压流体通过压力供应器供应到轴组件，该压力供应器可旋转地延伸和缩回以用于与轴组件接合。 轴组件还优选地包括轴向锁定机构，其将轴组件的可轴向移动的部件在旋转期间保持在固定的轴向位置，同时当旋转停止时允许释放，使得轴组件的可动部分可以轴向延伸。

公开(公告)号：US07898089B2

公开(公告)日：2011-03-01

申请号：US11977909

申请日：2007-10-26

申请人： Kert L. Dolechek ,  Raymon F. Thompson

发明人： Kert L. Dolechek ,  Raymon F. Thompson

IPC分类号： H01L29/40 ,  H01L21/461

CPC分类号： H01L21/6835 ,  H01L2924/3025

摘要： The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供一种用于处理半导体工件的装置和方法。 新的设备和方法允许生产更薄的工件，同时保持坚固。 特别地，提供一种卡盘，其包括主体，可移除地附接到主体的保持器和密封形成构件。 当将工件放置在卡盘主体上并且保持器与主体接合时，工件后侧的周边部分被保持器覆盖，同时工件后侧的内部区域被暴露。 然后将工件的暴露的背面进行湿化学蚀刻工艺以使工件变薄，并在工件的周边形成由半导体材料组成的相对较厚的边缘。 较厚的边缘或箍将其强度提升到其他脆弱的，变薄的半导体工件。 根据本发明制造的半导体工件提供了用于在常规自动化设备中处理薄化晶片的改进的结构。 这导致产量提高和工艺效率提高。

公开(公告)号：US07354649B2

公开(公告)日：2008-04-08

申请号：US10923132

申请日：2004-08-20

申请人： Kert L. Dolechek ,  Raymon F. Thompson

发明人： Kert L. Dolechek ,  Raymon F. Thompson

IPC分类号： B32B9/04

CPC分类号： H01L21/68721 ,  H01L21/67126 ,  Y10T428/12528 ,  Y10T428/21 ,  Y10T428/219

摘要： The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供一种用于处理半导体工件的装置和方法。 新的设备和方法允许生产更薄的工件，同时保持坚固。 特别地，提供一种卡盘，其包括主体，可移除地附接到主体的保持器和密封形成构件。 当将工件放置在卡盘主体上并且保持器与主体接合时，工件后侧的周边部分被保持器覆盖，同时工件后侧的内部区域被暴露。 然后将工件的暴露的背面进行湿化学蚀刻工艺以使工件变薄，并在工件的周边形成由半导体材料组成的相对较厚的边缘。 较厚的边缘或箍将其强度提升到其他脆弱的，变薄的半导体工件。 根据本发明制造的半导体工件提供了用于在常规自动化设备中处理薄化晶片的改进的结构。 这导致产量提高和工艺效率提高。

公开(公告)号：US06660104B2

公开(公告)日：2003-12-09

申请号：US10164164

申请日：2002-06-05

申请人： Raymon F. Thompson ,  Clif Neil

发明人： Raymon F. Thompson ,  Clif Neil

IPC分类号： B08B700

CPC分类号： H01L21/67313 ,  B08B3/02 ,  Y10S134/901 ,  Y10S134/902 ,  Y10S414/14

摘要： In a method for processing flat media, such as semiconductor wafers, first and second cassettes carrying wafers are loaded into a dual position rotor. The cassettes are restrained within the rotor by support tubes and hold down pins. Processing capacity is increased, as two cassettes are simultaneously processed.

公开(公告)号：US06334453B1

公开(公告)日：2002-01-01

申请号：US09503784

申请日：2000-02-14

申请人： Raymon F. Thompson ,  Scott Bruner

发明人： Raymon F. Thompson ,  Scott Bruner

IPC分类号： B08B1300

CPC分类号： H01L21/67126 ,  Y10S134/902

摘要： An apparatus for processing a microelectronic workpiece, such as a semiconductor wafer, is set forth. The apparatus comprises a processing bowl that defines a processing chamber. A seal is provided to assist in removing fluids, such as processing fluids, from the processing chamber that are in the proximity of the seal. Further, the seal is provided to assist in preventing the fluids from entering the motor. To this end, flow generating threads and expulsion threads are provided at an end of a shaft assembly that is connected to be driven by the motor. A member substantially surrounds at least a portion of the flow generating threads and at least a portion of the expulsion threads. Together, the member defines a chamber with the shaft assembly. Rotation of the shaft assembly results in corresponding rotation of the flow generating threads and expulsion threads to drive fluids proximate the shaft assembly to an exhaust while concurrently assisting in preventing such fluids from entering the motor.

摘要翻译： 阐述了一种用于处理诸如半导体晶片的微电子工件的装置。 该装置包括限定处理室的处理碗。 提供密封件以帮助从位于密封件附近的处理室中除去诸如处理流体的流体。 此外，设置密封件以帮助防止流体进入马达。 为此，在轴组件的端部设置有流动产生螺纹和排出螺纹，该组件的连接部由马达驱动。 构件基本上围绕流动产生螺纹的至少一​​部分和排出螺纹的至少一​​部分。 构件一起定义了具有轴组件的腔室。 轴组件的旋转导致流动产生螺纹和排出螺纹的相应旋转，以将靠近轴组件的流体驱动到排气，同时辅助防止这种流体进入马达。

公开(公告)号：US5377708A

公开(公告)日：1995-01-03

申请号：US53524

申请日：1993-04-26

申请人： Eric J. Bergman ,  Timothy J. Reardon ,  Raymon F. Thompson ,  Aleksander Owczarz

发明人： Eric J. Bergman ,  Timothy J. Reardon ,  Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： B01F3/08 ,  F04B9/105 ,  F04B43/08 ,  G11B7/26 ,  H01L21/00 ,  H01L21/687 ,  B08B3/10

CPC分类号： H01L21/68728 ,  B01F3/088 ,  F04B43/08 ,  F04B9/105 ,  H01L21/67023 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  G11B7/26 ,  Y10S134/902

摘要： Disclosed are apparatuses and methods for improved processing of semiconductor wafers and the like using vapor phase processing chemicals, particularly aqueous hydrofluoric acid etchants. Homogeneous vapor mixtures are generated from homogeneous liquid mixtures. Means for recirculating, mixing and agitating the liquid phase reactants are provided. In some embodiments the liquid phase is advantageously circulated through a chemical trench within the processing bowl. Exposure of wafers to vapors from the chemical trench can be controlled by a vapor control valve which is advantageously the bottom of the processing chamber. The wafer is rotated or otherwise moved within the processing chamber to provide uniform dispersion of the homogeneous reactant vapors across the wafer surface and to facilitate vapor circulation to the processed surface. A radiative volatilization processor can be utilized to volatilize reaction by-products which form under some conditions. The apparatuses provide efficient uniform etching with low particle count performance.

摘要翻译： 公开了使用气相处理化学品，特别是氢氟酸蚀刻剂改进半导体晶片等的处理的装置和方法。 均相蒸气混合物由均匀的液体混合物产生。 提供了用于液相反应物的再循环，混合和搅拌的方法。 在一些实施方案中，液相有利地循环通过加工碗内的化学沟槽。 可以通过蒸气控制阀来控制晶片从化学沟槽向蒸气的曝光，该蒸汽控制阀有利地是处理室的底部。 晶片在处理室内旋转或以其它方式移动，以提供均匀反应物蒸汽在晶片表面上的均匀分散，并促进蒸气循环到经处理的表面。 辐射挥发处理器可用于挥发在一些条件下形成的反应副产物。 这些装置提供了具有低粒度计数性能的有效的均匀蚀刻。

公开(公告)号：US5357991A

公开(公告)日：1994-10-25

申请号：US53523

申请日：1993-04-26

申请人： Eric J. Bergman ,  Timothy J. Reardon ,  Raymon F. Thompson ,  Aleksander Owczarz

发明人： Eric J. Bergman ,  Timothy J. Reardon ,  Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： B01F3/08 ,  F04B9/105 ,  F04B43/08 ,  G11B7/26 ,  H01L21/00 ,  H01L21/687 ,  B08B3/10

CPC分类号： B01F3/088 ,  F04B43/08 ,  F04B9/105 ,  H01L21/67023 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68728 ,  H01L21/68785 ,  G11B7/26 ,  Y10S134/902

摘要： Disclosed are apparatuses and methods for improved processing of semiconductor wafers and the like using vapor phase processing chemicals, particularly aqueous hydrofluoric acid etchants. Homogeneous vapor mixtures are generated from homogeneous liquid mixtures. Means for recirculating, mixing and agitating the liquid phase reactants are provided. In some embodiments the liquid phase is advantageously circulated through a chemical trench within the processing bowl. Exposure of wafers to vapors from the chemical trench can be controlled by a vapor control valve which is advantageously the bottom of the processing chamber. The wafer is rotated or otherwise moved within the processing chamber to provide uniform dispersion of the homogeneous reactant vapors across the wafer surface and to facilitate vapor circulation to the processed surface. A radiative volatilization processor can be utilized to volatilize reaction by-products which form under some conditions. The apparatuses provide efficient uniform etching with low particle count performance.

摘要翻译： 公开了使用气相处理化学品，特别是氢氟酸蚀刻剂改进半导体晶片等的处理的装置和方法。 均相蒸气混合物由均匀的液体混合物产生。 提供了用于液相反应物的再循环，混合和搅拌的方法。 在一些实施方案中，液相有利地循环通过加工碗内的化学沟槽。 可以通过蒸气控制阀来控制晶片从化学沟槽向蒸气的曝光，该蒸汽控制阀有利地是处理室的底部。 晶片在处理室内旋转或以其它方式移动，以提供均匀反应物蒸汽在晶片表面上的均匀分散，并促进蒸气循环到经处理的表面。 辐射挥发处理器可用于挥发在一些条件下形成的反应副产物。 这些装置提供了具有低粒度计数性能的有效的均匀蚀刻。

公开(公告)号：US5235995A

公开(公告)日：1993-08-17

申请号：US665942

申请日：1991-03-06

申请人： Eric J. Bergman ,  Timothy J. Reardon ,  Raymon F. Thompson ,  Aleksander Owczarz

发明人： Eric J. Bergman ,  Timothy J. Reardon ,  Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： B01F3/08 ,  F04B9/105 ,  F04B43/08 ,  G11B7/26 ,  H01L21/00 ,  H01L21/687

CPC分类号： H01L21/68728 ,  B01F3/088 ,  F04B43/08 ,  F04B9/105 ,  H01L21/67023 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  G11B7/26 ,  Y10S134/902

摘要： Disclosed are apparatuses and methods for improved processing of semiconductor wafers and the using vapor phase processing chemicals, particularly aqueous hydrofluoric acid etchants. Homogeneous vapor mixtures are generated from homogeneous liquid mixtures. Means for recirculating, mixing and agitating the liquid phase reactants are provided. In some embodiments the liquid phase is advantageously circulated through a chemical trench within the processing bowl. Exposure of wafers to vapors from the chemical trench can be controlled by a vapor control valve which is advantageously the bottom of the processing chamber. The wafer is rotated or otherwise moved within the processing chamber to provide uniform dispersion of the homogeneous reactant vapors across the wafer surface and to facilitate vapor circulation to the processed surface. A radiative volatilization processor can be utilized to volatilize reaction by-products which form under some conditions. The apparatuses provide efficient uniform etching with low particle count performance.

摘要翻译： 公开了用于改进半导体晶片处理和使用气相处理化学品，特别是氢氟酸蚀刻剂的设备和方法。 均相蒸气混合物由均匀的液体混合物产生。 提供了用于液相反应物的再循环，混合和搅拌的方法。 在一些实施方案中，液相有利地循环通过加工碗内的化学沟槽。 可以通过蒸气控制阀来控制晶片从化学沟槽向蒸气的曝光，该蒸汽控制阀有利地是处理室的底部。 晶片在处理室内旋转或以其它方式移动，以提供均匀反应物蒸汽在晶片表面上的均匀分散，并促进蒸气循环到经处理的表面。 辐射挥发处理器可用于挥发在一些条件下形成的反应副产物。 这些装置提供了具有低粒度计数性能的有效的均匀蚀刻。

公开(公告)号：US5224503A

公开(公告)日：1993-07-06

申请号：US901614

申请日：1992-06-15

申请人： Raymon F. Thompson ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： B08B3/02 ,  H01L21/00 ,  H01L21/304

CPC分类号： H01L21/67017 ,  B08B3/02 ,  H01L21/67028 ,  H01L21/67034 ,  Y10S134/902

摘要： Apparatus for cleaning carriers used to hold semiconductor wafers, substrates, data disks, flat panel displays and similar containers used in applications highly sensitive to contamination. The apparatus has a processing bowl with entrance and exit ports through which carriers are installed and removed from a processing chamber. A rotor rotates within the processing chamber. The rotor includes a rotor cage which mounts detachable wafer carrier supports. Filtered, heated air is passed through the process chamber for drying. Cleaning liquid and additional drying gas can be supplied through manifolds positioned inside and outside the rotor cage.

摘要翻译： 用于清洁用于保存半导体晶片，基板，数据盘，平板显示器和用于对污染高度敏感的应用中的类似容器的载体的装置。 该装置具有一个具有入口和出口的处理碗，载物从处理室中被安装和移出。 转子在处理室内旋转。 转子包括安装可拆卸的晶片载体支撑件的转子笼。 过滤的加热空气通过处理室进行干燥。 可以通过位于转子笼内部和外部的歧管提供清洁液体和附加的干燥气体。