公开(公告)号：US20190092630A1

公开(公告)日：2019-03-28

申请号：US16204136

申请日：2018-11-29

Applicant: DunAn Microstaq, Inc.

Inventor： Wayne C. Long ,  Joe A. Ojeda ,  Gengxun K. Gurley ,  Joseph L. Nguyen

IPC: B81C1/00 ,  B23K1/00 ,  B23K35/02 ,  B81C3/00 ,  B23K101/36

CPC classification number: B81C1/00301 ,  B23K1/0016 ,  B23K35/0222 ,  B23K2101/36 ,  B81C3/005 ,  B81C2203/035 ,  B81C2203/055

Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.

公开(公告)号：US20180127269A1

公开(公告)日：2018-05-10

申请号：US15686343

申请日：2017-08-25

Applicant: DunAn Microstaq, Inc.

Inventor： Wayne C. Long ,  Joe A. Ojeda ,  Gengxun K. Gurley ,  Joseph L. Nguyen

IPC: B81C1/00 ,  B23K35/02

CPC classification number: B81C1/00301 ,  B23K1/0016 ,  B23K35/0222 ,  B23K2101/36 ,  B81C3/005 ,  B81C2203/035 ,  B81C2203/055

Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.