公开(公告)号：US11331766B2

公开(公告)日：2022-05-17

申请号：US16182444

申请日：2018-11-06

Applicant: EBARA CORPORATION

Inventor： Masayuki Nakanishi ,  Kenji Kodera

IPC: B24B37/10 ,  B24B41/06 ,  B24B41/047 ,  B24B37/12 ,  B24B27/00 ,  B24B37/30 ,  B24B37/005 ,  B24B37/04

Abstract: One object is to improve the uniformity of polishing of a substrate.
The present application discloses, as one embodiment, a substrate polishing device for a quadrilateral-shaped substrate, the device including: a surface plate; a substrate support mechanism that is attached to the surface plate and that supports the substrate; a polishing head mechanism for attaching a polishing pad, the polishing head mechanism opposing the surface plate; and an orbital drive mechanism for orbitally driving the polishing head mechanism. The substrate support mechanism includes: a base plate; a plate flow passage provided to the base plate; and a plurality of substrate support chambers that are connected to the plate flow passage, wherein each substrate support chamber independently applies a vertical direction force to the substrate, and the vertical direction force applied to the substrate corresponds to an internal pressure of the substrate support chamber.

公开(公告)号：USD834075S1

公开(公告)日：2018-11-20

申请号：US29592889

申请日：2017-02-03

Applicant: EBARA CORPORATION

Designer： Kenji Kamimura ,  Masayuki Nakanishi ,  Satoru Yamamoto ,  Yasuyuki Miyasawa ,  Kenji Kodera