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    SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS
    4.
    发明申请
    SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS 有权

    公开(公告)号：US20220288650A1

    公开(公告)日：2022-09-15

    申请号：US17636299

    申请日：2020-07-13

    Applicant: EBARA CORPORATION

    Inventor： Kenji Kodera ,  Keisuke Uchiyama ,  Satoru Yamamoto ,  Hokuto Yamanobe

    IPC: B08B3/02 ,  B05B1/04 ,  B05B7/04

    Abstract: The present invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning a substrate, such as a wafer. The substrate cleaning method includes: holding a periphery of a substrate (W) with holding rollers (6); rotating the substrate (W) about its central axis by rotating the holding rollers (6) about their respective central axes; delivering a two-fluid jet from a two-fluid jet nozzle (2) to a surface of the substrate (W) while moving the two-fluid jet nozzle (2) in a radial direction of the substrate (W), the two-fluid jet (2) being composed of a mixture of a first liquid and a gas; and when the two-fluid jet is being delivered to the surface of the substrate (W), delivering a fan-shaped jet of a second liquid from a spray nozzle (3) to the surface of the substrate (W) to form a flow of the second liquid on the surface of the substrate (W). The fan-shaped jet is located away from the two-fluid jet.

    SUBSTRATE PROCESSING METHOD
    6.
    发明申请
    SUBSTRATE PROCESSING METHOD 审中-公开

    公开(公告)号：US20190385834A1

    公开(公告)日：2019-12-19

    申请号：US16432315

    申请日：2019-06-05

    Applicant: EBARA CORPORATION

    Inventor： Masayuki Nakanishi ,  Satoru Yamamoto ,  Kenji Kodera

    IPC: H01L21/02 ,  B24B9/06 ,  H01L21/304

    Abstract: A substrate processing method capable of preventing an adherence of a foreign matter to a substrate is disclosed. The substrate processing method comprises: a substrate rotating step of rotating a substrate W while holding the substrate W; a first-liquid upper supply step of supplying a first liquid onto an upper surface of the substrate W while rotating the substrate W; a polishing step of pressing a polishing tape 23 to the substrate W while supplying the first liquid in a state of rotating the substrate W; a second-liquid upper supply step of supplying a second liquid onto the upper surface of the substrate W while rotating the substrate W; and a cleaning step of pressing a cleaning tape 29 to the substrate W while supplying the second liquid in a state of rotating the substrate W and terminating after the polishing step is terminated. The second liquid is either of a conducting water, a surfactant solution, or ozone water.

    Substrate cleaning method and substrate cleaning apparatus
    8.
    发明授权
    Substrate cleaning method and substrate cleaning apparatus 有权

    公开(公告)号：US12030092B2

    公开(公告)日：2024-07-09

    申请号：US17636299

    申请日：2020-07-13

    Applicant: EBARA CORPORATION

    Inventor： Kenji Kodera ,  Keisuke Uchiyama ,  Satoru Yamamoto ,  Hokuto Yamanobe

    IPC: B08B3/02 ,  H01L21/67 ,  H01L21/687

    CPC classification number: B08B3/024 ,  B08B3/022 ,  H01L21/67051 ,  H01L21/68728

    Abstract: The present invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning a substrate, such as a wafer. The substrate cleaning method includes: holding a periphery of a substrate (W) with holding rollers (6); rotating the substrate (W) about its central axis by rotating the holding rollers (6) about their respective central axes; delivering a two-fluid jet from a two-fluid jet nozzle (2) to a surface of the substrate (W) while moving the two-fluid jet nozzle (2) in a radial direction of the substrate (W), the two-fluid jet (2) being composed of a mixture of a first liquid and a gas; and when the two-fluid jet is being delivered to the surface of the substrate (W), delivering a fan-shaped jet of a second liquid from a spray nozzle (3) to the surface of the substrate (W) to form a flow of the second liquid on the surface of the substrate (W). The fan-shaped jet is located away from the two-fluid jet.

    Substrate processing method and apparatus
    9.
    发明授权
    Substrate processing method and apparatus 有权

    公开(公告)号：US10811284B2

    公开(公告)日：2020-10-20

    申请号：US15933237

    申请日：2018-03-22

    Applicant: EBARA CORPORATION

    Inventor： Toshifumi Watanabe ,  Satoru Yamamoto ,  Yu Machida

    IPC: H01L21/67 ,  H01L21/66 ,  H01L21/02 ,  B24B37/00 ,  B24B21/00 ,  B24B9/06

    Abstract: A substrate processing method which can clean a peripheral portion of a substrate after polishing and can check the cleaning effect of the peripheral portion of the substrate is disclosed. The substrate processing method includes polishing a peripheral portion of the substrate by pressing a polishing tape having abrasive grains against the peripheral portion of the substrate with a first head, cleaning the peripheral portion of the substrate by supplying a cleaning liquid to the peripheral portion of the substrate after polishing, bringing a tape having no abrasive grains into contact with the peripheral portion of the substrate after cleaning by a second head, applying light to the tape and receiving reflected light from the tape by a sensor, and judging that the peripheral portion of the substrate is contaminated when an intensity of the received reflected light is lower than a predetermined value.

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