公开(公告)号：USD834075S1

公开(公告)日：2018-11-20

申请号：US29592889

申请日：2017-02-03

Applicant: EBARA CORPORATION

Designer： Kenji Kamimura ,  Masayuki Nakanishi ,  Satoru Yamamoto ,  Yasuyuki Miyasawa ,  Kenji Kodera

公开(公告)号：USD851142S1

公开(公告)日：2019-06-11

申请号：US29659981

申请日：2018-08-14

Applicant: EBARA CORPORATION

Designer： Kenji Kamimura ,  Masayuki Nakanishi ,  Satoru Yamamoto ,  Yasuyuki Miyasawa ,  Kenji Kodera

公开(公告)号：USD851141S1

公开(公告)日：2019-06-11

申请号：US29659970

申请日：2018-08-14

Applicant: EBARA CORPORATION

Designer： Kenji Kamimura ,  Masayuki Nakanishi ,  Satoru Yamamoto ,  Yasuyuki Miyasawa ,  Kenji Kodera

公开(公告)号：US11331769B2

公开(公告)日：2022-05-17

申请号：US15431062

申请日：2017-02-13

Applicant: EBARA CORPORATION

Inventor： Kenji Kamimura ,  Kenichi Kobayashi

IPC: B24B51/00 ,  B24B41/06 ,  B24B47/00

Abstract: A polishing apparatus and a polishing method capable of detecting whether a polishing tool has been brought into contact with a substrate, such as a wafer, and further capable of detecting a position of the polishing tool are disclosed. The polishing apparatus includes a substrate holder configured to hold a substrate, a pressing member configured to press a polishing tool against a surface of the substrate, an actuator configured to apply a pressing force to the pressing member, a motor-drive moving device configured to move the pressing member along the surface of the substrate, and a monitoring device configured to emit an alarm if a motor current supplied to the motor-drive moving device is smaller than a threshold value.

公开(公告)号：USD851140S1

公开(公告)日：2019-06-11

申请号：US29659963

申请日：2018-08-14

Applicant: EBARA CORPORATION

Designer： Kenji Kamimura ,  Masayuki Nakanishi ,  Satoru Yamamoto ,  Yasuyuki Miyasawa ,  Kenji Kodera

公开(公告)号：USRE45687E1

公开(公告)日：2015-09-29

申请号：US14272891

申请日：2014-05-08

Applicant: Ebara Corporation

Inventor： Nobutoshi Saito ,  Jumpei Fujikata ,  Tadaaki Yamamoto ,  Kenji Kamimura

IPC: C25D5/00 ,  C25D7/12 ,  C25D17/00 ,  C25D17/02 ,  C25D17/04 ,  C25D17/06 ,  C25D21/10 ,  C25D21/12

CPC classification number: C25D21/10 ,  C25D17/001 ,  C25D17/007 ,  C25D17/008 ,  C25D21/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.