公开(公告)号：US20190385834A1

公开(公告)日：2019-12-19

申请号：US16432315

申请日：2019-06-05

Applicant: EBARA CORPORATION

Inventor： Masayuki Nakanishi ,  Satoru Yamamoto ,  Kenji Kodera

IPC: H01L21/02 ,  B24B9/06 ,  H01L21/304

Abstract: A substrate processing method capable of preventing an adherence of a foreign matter to a substrate is disclosed. The substrate processing method comprises: a substrate rotating step of rotating a substrate W while holding the substrate W; a first-liquid upper supply step of supplying a first liquid onto an upper surface of the substrate W while rotating the substrate W; a polishing step of pressing a polishing tape 23 to the substrate W while supplying the first liquid in a state of rotating the substrate W; a second-liquid upper supply step of supplying a second liquid onto the upper surface of the substrate W while rotating the substrate W; and a cleaning step of pressing a cleaning tape 29 to the substrate W while supplying the second liquid in a state of rotating the substrate W and terminating after the polishing step is terminated. The second liquid is either of a conducting water, a surfactant solution, or ozone water.

公开(公告)号：USD851140S1

公开(公告)日：2019-06-11

申请号：US29659963

申请日：2018-08-14

Applicant: EBARA CORPORATION

Designer： Kenji Kamimura ,  Masayuki Nakanishi ,  Satoru Yamamoto ,  Yasuyuki Miyasawa ,  Kenji Kodera

公开(公告)号：USD859331S1

公开(公告)日：2019-09-10

申请号：US29611219

申请日：2017-07-19

Applicant: EBARA CORPORATION

Designer： Satoru Yamamoto ,  Masayuki Nakanishi ,  Kenji Kodera

公开(公告)号：US09666440B2

公开(公告)日：2017-05-30

申请号：US14142690

申请日：2013-12-27

Applicant: EBARA CORPORATION

Inventor： Masayuki Nakanishi ,  Kenji Kodera ,  Nobuhiro Yanaka

IPC: H01L21/304 ,  B24B9/06 ,  B24B57/02 ,  B24B37/02 ,  B24B9/08 ,  H01L21/02

CPC classification number: H01L21/304 ,  B24B9/065 ,  B24B9/08 ,  B24B37/02 ,  B24B57/02 ,  H01L21/02057 ,  H01L21/02087

Abstract: A polishing apparatus 100 includes a holding stage 4 that holds a central portion of a back surface of a substrate W, a motor M1 that rotates the holding stage 4, a front surface nozzle 36 that feeds a rinse liquid to a front surface of the substrate W, a back surface nozzle 37 that feeds the rinse liquid to a back surface of the substrate W, a rinse liquid control section 110 that feeds the rinse liquid through the back surface nozzle 37 after a preset time elapses since the start of feeding of the rinse liquid through the front surface nozzle 36 and a polishing head assembly 1A that polishes a peripheral portion of the substrate installed on the holding stage 4 after the rinse liquid control section 110 feeds the rinse liquid to the substrate W.

公开(公告)号：US20200023490A1

公开(公告)日：2020-01-23

申请号：US16455326

申请日：2019-06-27

Applicant: EBARA CORPORATION

Inventor： Masayuki Nakanishi ,  Kenji Kodera

IPC: B24B51/00 ,  B24B9/06

Abstract: A polishing apparatus capable of accurately detecting a polishing end point of a periphery of a substrate, such as a wafer, is disclosed. The polishing apparatus includes a polishing head configured to press a polishing tool against the periphery of the substrate on a substrate holding surface. The polishing head includes a pressing member configured to press the polishing tool against the periphery of the substrate, and a shear-force detection sensor configured to detect a shear force acting on the pressing member and output an index value indicating a magnitude of the shear force. An operation controller has a memory storing a program configured to determine a polishing end point at which the index value reaches a threshold value, and a processer configured to execute the program.

公开(公告)号：USD851142S1

公开(公告)日：2019-06-11

申请号：US29659981

申请日：2018-08-14

Applicant: EBARA CORPORATION

Designer： Kenji Kamimura ,  Masayuki Nakanishi ,  Satoru Yamamoto ,  Yasuyuki Miyasawa ,  Kenji Kodera

公开(公告)号：USD851141S1

公开(公告)日：2019-06-11

申请号：US29659970

申请日：2018-08-14

Applicant: EBARA CORPORATION

Designer： Kenji Kamimura ,  Masayuki Nakanishi ,  Satoru Yamamoto ,  Yasuyuki Miyasawa ,  Kenji Kodera

公开(公告)号：US20220288650A1

公开(公告)日：2022-09-15

申请号：US17636299

申请日：2020-07-13

Applicant: EBARA CORPORATION

Inventor： Kenji Kodera ,  Keisuke Uchiyama ,  Satoru Yamamoto ,  Hokuto Yamanobe

IPC: B08B3/02 ,  B05B1/04 ,  B05B7/04

Abstract: The present invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning a substrate, such as a wafer. The substrate cleaning method includes: holding a periphery of a substrate (W) with holding rollers (6); rotating the substrate (W) about its central axis by rotating the holding rollers (6) about their respective central axes; delivering a two-fluid jet from a two-fluid jet nozzle (2) to a surface of the substrate (W) while moving the two-fluid jet nozzle (2) in a radial direction of the substrate (W), the two-fluid jet (2) being composed of a mixture of a first liquid and a gas; and when the two-fluid jet is being delivered to the surface of the substrate (W), delivering a fan-shaped jet of a second liquid from a spray nozzle (3) to the surface of the substrate (W) to form a flow of the second liquid on the surface of the substrate (W). The fan-shaped jet is located away from the two-fluid jet.

公开(公告)号：US09492910B2

公开(公告)日：2016-11-15

申请号：US14823967

申请日：2015-08-11

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Hiroyuki Kawasaki ,  Masayuki Nakanishi ,  Kenya Ito ,  Kenji Kodera ,  Michiyoshi Yamashita

IPC: B24B9/00 ,  B24D11/00 ,  B24B21/00 ,  B24B21/08 ,  B24B21/18 ,  B24B27/00 ,  B24B49/12 ,  B24B9/06 ,  H01L21/304 ,  H01L21/3105

CPC classification number: B24D11/001 ,  B24B9/065 ,  B24B21/002 ,  B24B21/004 ,  B24B21/008 ,  B24B21/08 ,  B24B21/18 ,  B24B27/0076 ,  B24B49/12 ,  H01L21/304 ,  H01L21/3105

Abstract: There is disclosed a method of polishing a peripheral portion of a wafer having a hard film with use of an abrasive film while preventing damage to the abrasive film. The polishing method uses an abrasive film including a base film made of polyimide, a binder made of polyimide, and abrasive grains held by the binder. The polishing method includes: rotating a silicon substrate having a surface on which a silicon carbide film is formed; and removing the silicon carbide film from a peripheral portion of the silicon substrate by pressing the abrasive film at a low force against the silicon carbide film on the peripheral portion of the silicon substrate.

Abstract translation: 公开了一种利用磨料膜研磨具有硬质膜的晶片的周边部分的方法，同时防止对研磨膜的损伤。 抛光方法使用包括由聚酰亚胺制成的基膜，由聚酰亚胺制成的粘合剂和由粘合剂保持的磨粒的研磨膜。 抛光方法包括：旋转具有形成有碳化硅膜的表面的硅衬底; 并且通过以低的力将研磨膜压在硅衬底的周边部分上的碳化硅膜上，从硅衬底的周边部分去除碳化硅膜。

公开(公告)号：US12030092B2

公开(公告)日：2024-07-09

申请号：US17636299

申请日：2020-07-13

Applicant: EBARA CORPORATION

Inventor： Kenji Kodera ,  Keisuke Uchiyama ,  Satoru Yamamoto ,  Hokuto Yamanobe

IPC: B08B3/02 ,  H01L21/67 ,  H01L21/687

CPC classification number: B08B3/024 ,  B08B3/022 ,  H01L21/67051 ,  H01L21/68728

Abstract: The present invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning a substrate, such as a wafer. The substrate cleaning method includes: holding a periphery of a substrate (W) with holding rollers (6); rotating the substrate (W) about its central axis by rotating the holding rollers (6) about their respective central axes; delivering a two-fluid jet from a two-fluid jet nozzle (2) to a surface of the substrate (W) while moving the two-fluid jet nozzle (2) in a radial direction of the substrate (W), the two-fluid jet (2) being composed of a mixture of a first liquid and a gas; and when the two-fluid jet is being delivered to the surface of the substrate (W), delivering a fan-shaped jet of a second liquid from a spray nozzle (3) to the surface of the substrate (W) to form a flow of the second liquid on the surface of the substrate (W). The fan-shaped jet is located away from the two-fluid jet.