公开(公告)号：US20230390808A1

公开(公告)日：2023-12-07

申请号：US18205265

申请日：2023-06-02

Applicant: ENTEGRIS, INC.

Inventor： Subhash Guddati ,  Hyungjun Kim ,  Aravind Vasanthakumar ,  Thines Kumar Perumal ,  Montray Leavy

IPC: B08B1/00 ,  B24D3/00 ,  B24D18/00

CPC classification number: B08B1/002 ,  B24D3/00 ,  B24D18/0009

Abstract: A device for cleaning substrates. The device comprises a polymeric pad, a frame body, and a coupling member. The polymeric pad has a top surface and a bottom surface. At least a portion of the frame body extends between the top surface and the bottom surface of the polymeric paid. A coupling member extends upwards from at least a portion of the frame body.