中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

17 records (took 0.014 seconds)

    Polyvinyl alcohol pad
    1.
    外观设计
    Polyvinyl alcohol pad 有权

    公开(公告)号：USD1022365S1

    公开(公告)日：2024-04-09

    申请号：US29841226

    申请日：2022-06-03

    Applicant: ENTEGRIS, INC.

    Designer： Subhash Guddati ,  Hyungjun Kim ,  Aravind Vasanthakumar ,  Thines Kumar Perumal ,  Montray Leavy

    Abstract: FIG. 1 is a bottom perspective view of a first embodiment of a polyvinyl alcohol pad;
    FIG. 2 is a frontside view of the first embodiment of the polyvinyl alcohol pad;
    FIG. 3 is a backside view of the first embodiment of the polyvinyl alcohol pad;
    FIG. 4 is a left side view of the first embodiment of the polyvinyl alcohol pad;
    FIG. 5 is a right side view of the first embodiment of the polyvinyl alcohol pad;
    FIG. 6 is a top plan view of the first embodiment of the polyvinyl alcohol pad;
    FIG. 7 is a bottom side view first embodiment of the polyvinyl alcohol pad;
    FIG. 8 is a bottom perspective view of a second embodiment of the polyvinyl alcohol pad;
    FIG. 9 is a frontside view of the second embodiment of the polyvinyl alcohol pad;
    FIG. 10 is a backside view of the second embodiment of the polyvinyl alcohol pad;
    FIG. 11 is a left side view of the second embodiment of the polyvinyl alcohol pad;
    FIG. 12 is a right side view of the second embodiment of the polyvinyl alcohol pad;
    FIG. 13 is a top plan view of the second embodiment of the polyvinyl alcohol pad; and,
    FIG. 14 is a bottom side view second embodiment of the polyvinyl alcohol pad.
    The surface shading lines in the drawings depict the character or contour of the surfaces represented and form no part of the claimed design.
    The dash lines in the drawings depict the environment and boundaries and form no part of the claimed design.
    The dash-dot-dash lines in the drawings depict boundaries of the claimed design.

    Polyvinyl alcohol pad
    2.
    外观设计
    Polyvinyl alcohol pad 有权

    公开(公告)号：USD1027345S1

    公开(公告)日：2024-05-14

    申请号：US29841224

    申请日：2022-06-03

    Applicant: ENTEGRIS, INC.

    Designer： Subhash Guddati ,  Hyungjun Kim ,  Aravind Vasanthakumar ,  Thines Kumar Perumal ,  Montray Leavy

    Abstract: FIG. 1 is a bottom perspective view of a first embodiment of a polyvinyl alcohol pad;
    FIG. 2 is a frontside view of the first embodiment of the polyvinyl alcohol pad;
    FIG. 3 is a backside view of the first embodiment of the polyvinyl alcohol pad;
    FIG. 4 is a left side view of the first embodiment of the polyvinyl alcohol pad;
    FIG. 5 is a right side view of the first embodiment of the polyvinyl alcohol pad;
    FIG. 6 is a top plan view of the first embodiment of the polyvinyl alcohol pad;
    FIG. 7 is a bottom side view first embodiment of the polyvinyl alcohol pad;
    FIG. 8 is a bottom perspective view of a second embodiment of the polyvinyl alcohol pad;
    FIG. 9 is a frontside view of the second embodiment of the polyvinyl alcohol pad;
    FIG. 10 is a backside view of the second embodiment of the polyvinyl alcohol pad;
    FIG. 11 is a left side view of the second embodiment of the polyvinyl alcohol pad;
    FIG. 12 is a right side view of the second embodiment of the polyvinyl alcohol pad;
    FIG. 13 is a top plan view of the second embodiment of the polyvinyl alcohol pad; and,
    FIG. 14 is a bottom side view second embodiment of the polyvinyl alcohol pad.
    The surface shading lines in the drawings depict the character or contour of the surfaces represented and form no part of the claimed design.
    The dash lines in the drawings depict the environment and boundaries and form no part of the claimed design.
    The dash-dot-dash lines in the drawings depict boundaries of the claimed design.

    CLEANING BRUSH FOR SEMICONDUCTOR FABRICATION PROCESS
    5.
    发明公开
    CLEANING BRUSH FOR SEMICONDUCTOR FABRICATION PROCESS 审中-公开

    公开(公告)号：US20230386868A1

    公开(公告)日：2023-11-30

    申请号：US18204238

    申请日：2023-05-31

    Applicant: ENTEGRIS, INC.

    Inventor： Aravind Vasanthakumar ,  Thines Kumar Perumal ,  Subhash Guddati ,  Montray Leavy

    IPC: H01L21/67

    CPC classification number: H01L21/67046 ,  H01L21/02065

    Abstract: A cleaning brush for a semiconductor fabrication process is provided. The cleaning brush includes a core and a brush member. The core includes a circumferential portion and a closed end portion. The circumferential portion surrounds a rotation axis of the cleaning brush and defines an inlet opening for receiving a fluid. The closed end portion is connected to an end of the circumferential portion that is opposite to the inlet opening along the rotation axis. At least one elongated conduit is defined within the core and fluidly communicated with the inlet opening, and the circumferential portion includes a plurality of outlet channels passing therethrough to fluidly communicate with the elongated conduit, the outlet channels being tilted outwardly toward the closed end portion. The brush member is connected to an outer surface of the circumferential portion and covers all of the outlet channels.

    Multi-layer composites with varied layer thicknesses and related methods
    9.
    发明授权
    Multi-layer composites with varied layer thicknesses and related methods 有权

    公开(公告)号：US11911822B2

    公开(公告)日：2024-02-27

    申请号：US17541690

    申请日：2021-12-03

    Applicant: ENTEGRIS, INC.

    Inventor： Thines Kumar Perumal ,  Subhash Guddati ,  Montray Leavy ,  Virendra Warke ,  Devon N. Dion

    IPC: B22F10/16 ,  B33Y10/00 ,  B33Y70/10 ,  B22F10/28 ,  B33Y80/00

    CPC classification number: B22F10/16 ,  B22F10/28 ,  B33Y10/00 ,  B33Y70/10 ,  B33Y80/00

    Abstract: Three-dimensional multi-layer composite structures prepared by additive manufacturing techniques, as well as methods of preparing the structures by additive manufacturing techniques, wherein a multi-layer structure has layers of at least two different thicknesses and a precision thickness are disclosed herein. In some embodiments, a method includes forming a coarse feedstock layer having a coarse feedstock layer thickness, solidifying a portion of the coarse feedstock layer to form a solidified coarse feedstock layer having a solidified coarse feedstock layer thickness, before or after forming the solidified coarse feedstock layer, forming at least one fine feedstock layer having a fine feedstock layer thickness that is less than the coarse feedstock layer thickness, and solidifying a portion of the at least one fine feedstock layer to form the at least one solidified fine feedstock layer having a solidified fine feedstock layer thickness that is less than the solidified coarse feedstock layer thickness.

Patent Agency Ranking