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公开(公告)号：US20230042148A1
公开(公告)日：2023-02-09
申请号：US17867530
申请日：2022-07-18
Applicant: ENTEGRIS, INC.
Inventor： Yan Liu , Yuxuan Liu , Chandra Venkatraman , Carlo Waldfried
IPC: B05D3/06 , H01L21/683 , B05D3/02 , B05D1/02
Abstract: Described are techniques for applying a cured polymeric blanket coating onto a surface, specifically for applying a blanket-coated cured polymeric coating onto a surface of a substrate that is useful as an electrostatic chuck for processing semiconductor wafers.
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