公开(公告)号：US11772127B2

公开(公告)日：2023-10-03

申请号：US17867530

申请日：2022-07-18

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Yuxuan Liu ,  Chandra Venkatraman ,  Carlo Waldfried

IPC: B05D3/06 ,  B05D1/02 ,  B05D3/02 ,  H01L21/683

CPC classification number: B05D3/06 ,  B05D1/02 ,  B05D3/0254 ,  H01L21/6833

Abstract: Described are techniques for applying a cured polymeric blanket coating onto a surface, specifically for applying a blanket-coated cured polymeric coating onto a surface of a substrate that is useful as an electrostatic chuck for processing semiconductor wafers.

公开(公告)号：US12101920B2

公开(公告)日：2024-09-24

申请号：US18131208

申请日：2023-04-05

Applicant: ENTEGRIS, INC.

Inventor： Yuxuan Liu ,  Zhifeng Li ,  Carlo Waldfried ,  Yan Liu ,  Chandra Venkatraman ,  Pushkara Rao Varanasi

IPC: H05K9/00 ,  H01B1/00 ,  H01B1/12 ,  H01L21/683

CPC classification number: H05K9/0079 ,  H01B1/124 ,  H01L21/6833

Abstract: A conductive polymeric layer on an electrostatic chuck. The conductive polymeric layer comprises a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer promotes charge dissipation by the conductive polymeric layer, while the photosensitivity of the photosensitive polymer allows the surface of the conductive polymeric layer to be photopatterned. The extent to which the conductive polymeric layer is conductive and photosensitive may be modulated by varying the relative amounts of the conductive polymer and the photosensitive polymer.

公开(公告)号：US20230274967A1

公开(公告)日：2023-08-31

申请号：US18113941

申请日：2023-02-24

Applicant: ENTEGRIS, INC.

Inventor： Jakub Rybczynski ,  Steven Donnell ,  Yan Liu ,  Caleb Minsky ,  Chandra Venkatraman ,  Carlo Waldfried

IPC: H01L21/683

CPC classification number: H01L21/6833

Abstract: Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including a pattern of charge dissipation lines on an insulating layer, the lines having a first conductive layer and a second conductive layer and being arranged to define enclosed fields of the insulating layer between the lines.

公开(公告)号：US20230337407A1

公开(公告)日：2023-10-19

申请号：US18131208

申请日：2023-04-05

Applicant: ENTEGRIS, INC.

Inventor： Yuxuan Liu ,  Zhifeng Li ,  Carlo Waldfried ,  Yan Liu ,  Chandra Venkatraman ,  Pushkara Rao Varanasi

IPC: H05K9/00 ,  H01L21/683

CPC classification number: H05K9/0079 ,  H01L21/6833

Abstract: A conductive polymeric layer on an electrostatic chuck. The conductive polymeric layer comprises a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer promotes charge dissipation by the conductive polymeric layer, while the photosensitivity of the photosensitive polymer allows the surface of the conductive polymeric layer to be photopatterned. The extent to which the conductive polymeric layer is conductive and photosensitive may be modulated by varying the relative amounts of the conductive polymer and the photosensitive polymer.

公开(公告)号：US20220316056A1

公开(公告)日：2022-10-06

申请号：US17840367

申请日：2022-06-14

Applicant: ENTEGRIS, INC.

Inventor： I-Kuan Lin ,  Carlo Waldfried ,  Chandra Venkatraman

IPC: C23C16/40 ,  C23C16/455 ,  C23C16/44

Abstract: Described are multi-layer coatings, substrates (i.e., articles) coated with a multi-layer coating, and methods of preparing a multi-layer coating by atomic layer deposition, wherein the coating includes layers alumina and yttria.

公开(公告)号：US20230042148A1

公开(公告)日：2023-02-09

申请号：US17867530

申请日：2022-07-18

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Yuxuan Liu ,  Chandra Venkatraman ,  Carlo Waldfried

IPC: B05D3/06 ,  H01L21/683 ,  B05D3/02 ,  B05D1/02

Abstract: Described are techniques for applying a cured polymeric blanket coating onto a surface, specifically for applying a blanket-coated cured polymeric coating onto a surface of a substrate that is useful as an electrostatic chuck for processing semiconductor wafers.

公开(公告)号：US20160273095A1

公开(公告)日：2016-09-22

申请号：US14870981

申请日：2015-09-30

Applicant: Entegris, Inc.

Inventor： I-Kuan Lin ,  Nilesh Gunda ,  Dennis Radgowski ,  Chandra Venkatraman

IPC: C23C14/48 ,  C23C14/58

CPC classification number: C23C14/48 ,  C23C14/08 ,  C23C14/083 ,  C23C14/58 ,  C23C14/5806 ,  C23C14/5846 ,  H01J37/32467 ,  H01J37/32495

Abstract: Articles and methods relating to coatings having superior plasma etch-resistance and which can prolong the life of RIE components are provided. An article has a vacuum compatible substrate and a protective film overlying at least a portion of the substrate. The film comprises a fluorinated metal oxide containing yttrium.

Abstract translation: 提供了具有优异的等离子体耐蚀刻性并且可以延长RIE部件寿命的涂层的制品和方法。 一种制品具有真空兼容的衬底和覆盖至少一部分衬底的保护膜。 膜包含含有钇的氟化金属氧化物。

公开(公告)号：US10961617B2

公开(公告)日：2021-03-30

申请号：US14870981

申请日：2015-09-30

Applicant: Entegris, Inc.

Inventor： I-Kuan Lin ,  Nilesh Gunda ,  Dennis Radgowski ,  Chandra Venkatraman

IPC: C23C14/48 ,  C23C14/58 ,  C23C14/08 ,  H01J37/32

Abstract: Articles and methods relating to coatings having superior plasma etch-resistance and which can prolong the life of RIE components are provided. An article has a vacuum compatible substrate and a protective film overlying at least a portion of the substrate. The film comprises a fluorinated metal oxide containing yttrium.