公开(公告)号：US20200183279A1

公开(公告)日：2020-06-11

申请号：US16789634

申请日：2020-02-13

Applicant: FUJIFILM Corporation

Inventor： Kazuhiro MARUMO ,  Naohiro TANGO ,  Ryo NISHIO ,  Akira TAKADA

IPC: G03F7/039 ,  G03F7/004 ,  C08L33/14 ,  C07D277/66 ,  C07D277/68 ,  C07D263/57

Abstract: A photosensitive resin composition includes a resin having a constitutional unit having an acid-decomposable group, a photoacid generator, a solvent, and a compound represented by Formula D. In Formula D, XD represents an O atom or an S atom, R1D represents a hydrogen atom, a hydrocarbon group, an acyl group, an acyloxy group, or an alkoxycarbonyl group, R2D represents a substituent, nD represents an integer from 0 to 4, and two or more of R2D's may be bonded to each other to form a ring.

公开(公告)号：US20180364571A1

公开(公告)日：2018-12-20

申请号：US16110394

申请日：2018-08-23

Applicant: FUJIFILM Corporation

Inventor： Ryo NISHIO ,  Masafumi KOJIMA ,  Akiyoshi GOTO ,  Tomotaka TSUCHIMURA ,  Michihiro SHIRAKAWA ,  Keita KATO

IPC: G03F7/004 ,  G03F7/16 ,  G03F7/20 ,  G03F7/38 ,  G03F7/32 ,  G03F7/038 ,  G03F7/039 ,  C07C309/12 ,  C07C321/28 ,  C07D327/08 ,  C07D217/08 ,  C07D335/16 ,  C07C309/15 ,  C07C309/17 ,  C07D213/70 ,  C07D333/46 ,  C07J43/00

Abstract: The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition which is capable of forming a pattern having a low LWR and is further suppressed in the collapse of the formed pattern, a resist film, a pattern forming method, and a method for manufacturing an electronic device. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains a photoacid generator represented by General Formula (1) or a resin having a residue obtained by removing one hydrogen atom from the photoacid generator represented by General Formula (1).