Abstract:
A resin composition of the present invention includes a polymer compound (A) containing a repeating unit (Q) represented by the following general formula (1): wherein R1 represents a hydrogen atom, a methyl group, or a halogen atom; R2 and R3 represent a hydrogen atom, an alkyl group, or a cycloalkyl group; L represents a divalent linking group or a single bond; Y represents a substituent excluding a methylol group; Z represents a hydrogen atom or a substituent; m represents an integer of 0 to 4; n represents an integer of 1 to 5; and m+n is 5 or less.
Abstract:
Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (P) containing an acid-decomposable repeating unit (A), which resin when acted on by an acid, increases its solubility in an alkali developer, a compound (Q) that when exposed to actinic rays or radiation, generates an acid, and a compound (R) expressed by general formula (1) or (2) below.
Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition is an actinic ray-sensitive or radiation-sensitive resin composition including a compound that generates an acid upon irradiation with actinic rays or radiation and a resin capable of increasing polarity by the action of an acid, in which the resin includes a repeating unit represented by General Formula (B-1) and at least one halogen atom selected from the group consisting of a fluorine atom and an iodine atom.
Abstract:
A pattern forming method includes forming a film using an actinic ray-sensitive or radiation-sensitive resin composition, exposing the film with active light or radiation, and developing the exposed film using a developer including an organic solvent, in which the actinic ray-sensitive or radiation-sensitive resin composition contains a compound having a partial structure represented by General Formula (I).
Abstract:
Provided is a semiconductor element having a semiconductor layer and an insulating layer adjacent to the semiconductor layer, in which the insulating layer is formed of a crosslinked product of a polymer compound having a repeating unit (IA) represented by the following General Formula (IA) and a repeating unit (IB) represented by the following General Formula (IB). In General Formula (IA), R1a represents a hydrogen atom, a halogen atom, or an alkyl group. L1a and L2a each independently represent a single bond or a linking group. X represents a crosslinkable group. m2a represents an integer of 1 to 5, and in a case where m2a is 2 or more, m2a number of X's may be the same or different from each other, m1a represents an integer of 1 to 5, and in a case where m1a is 2 or more, m1a number of (-L2a-(X)m2a)'s may be the same or different from each other. In General Formula (IB), R1b represents a hydrogen atom, a halogen atom, or an alkyl group. L1b represents a single bond or a linking group, and Ar1b represents an aromatic ring, m1b represents an integer of 1 to 5.
Abstract:
There are provided A pattern formation method, including: (1) forming a film using an active light-sensitive or radiation-sensitive resin composition; (2) exposing the film to active light or radiation; and (3) developing the exposed film using a developer including an organic solvent, wherein the active light-sensitive or radiation-sensitive resin composition contains a resin (A) having specific 3 repeating units.
Abstract:
Provided is an active light sensitive or radiation sensitive resin composition which contains a compound (A) represented by General Formula (I) or (II): in the formulae, each of Y1 and Y2 represents a monovalent organic group; each of M1+ and M2+ represents an organic onium ion; each of X1 and X2 represents a group that is represented by —S—, —NH—, or —NR1—; R1 represents a monovalent organic group; each of n1 and n2 represents an integer of 1 or more; and R1 and Y1 or Y2 may bond with each other to form a ring.
Abstract:
Disclosed is a negative chemical amplification resist composition including (A) a polymer compound having a repeating unit (P) represented by the following formula (I) which is stable in acids and alkalis, and a repeating unit (Q) having a phenolic hydroxyl group; (B) a compound capable of generating an acid when irradiated with actinic rays or a radiation; and (C) a cross-linking agent: in which, in the formula (I), R1 represents a hydrogen atom or a methyl group; L1 represents an oxygen atom or —NH—; L2 represents a single bond or an alkylene group; and A represents a polycyclic hydrocarbon group.
Abstract:
A photosensitive composition for EUV light includes a predetermined resin and a photoacid generator, or includes a predetermined resin having a repeating unit having a photoacid generating group, and satisfies Conditions 1 and 2, Condition 1: The A value determined by Formula (1) is 0.14 or more, A=([H]×0.04+[C]×1.0+[N]×2.1+[O]×3.6+[F]×5.6+[S]×1.5+[I]×39.5)/([H]×1+[C]×12+[N]×14+[O]×16+[F]×19+[S]×32+[I]×127) Formula (1): Condition 2: The concentration of the solid content in the photosensitive composition for EUV light is 2.5% by mass or less.
Abstract:
An actinic ray sensitive or radiation sensitive resin composition contains a polymer compound (A) having a phenolic hydroxyl group and satisfying the following (a) and (b), a compound (B) capable of generating an acid upon irradiation with actinic rays or radiation, and a crosslinking agent (C) for crosslinking the polymer compound (A) by the action of an acid and having a glass transition temperature (Tg) of 200° C. or higher: (a) the weight-average molecular weight is 3,000 or more and 6,500 or less, and (b) the glass transition temperature (Tg) is 140° C. or higher.