公开(公告)号：US20230090620A1

公开(公告)日：2023-03-23

申请号：US17942344

申请日：2022-09-12

Applicant: FUJIMI INCORPORATED

Inventor： Ryota MAE

IPC: C09G1/02 ,  H01L21/306

Abstract: A polishing composition according to the present invention contains zirconia particles, a selectivity improver for improving a ratio of a polishing speed for an organic material (b) to a polishing speed for a material (a) having a metal-nitrogen bond, and a dispersing medium, wherein in a particle size distribution of the zirconia particles obtained by a laser diffraction/scattering method, a diameter (D50) of the particles when a cumulative volume of the particles from a fine particle side reaches 50% of a total volume of the particles is 5 nm or more and 150 nm or less, and a pH of the polishing composition is less than 7.

公开(公告)号：US20210292599A1

公开(公告)日：2021-09-23

申请号：US17191988

申请日：2021-03-04

Applicant: FUJIMI INCORPORATED

Inventor： Ryota MAE

IPC: C09G1/02 ,  C09K3/14 ,  B24B7/22 ,  H01L21/3105

Abstract: A polishing composition according to the present invention contains abrasive grains, a basic inorganic compound, an anionic water-soluble polymer, and a dispersing medium, in which a zeta potential of the abrasive grains is negative, an aspect ratio of the abrasive grains is 1.1 or less, in a particle size distribution of the abrasive grains obtained by a laser diffraction/scattering method, a ratio D90/D50 of a particle diameter D90 when an integrated particle mass reaches 90% of a total particle mass from a fine particle side to a particle diameter D50 when the integrated particle mass reaches 50% of the total particle mass from the fine particle side is more than 1.3, and the basic inorganic compound is an alkali metal salt.