公开(公告)号：US20200020458A1

公开(公告)日：2020-01-16

申请号：US16031767

申请日：2018-07-10

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Erik R. Hosler ,  Sheldon J. Meyers

IPC: G21K1/04 ,  H05G2/00 ,  G21K1/06 ,  G03F7/20

Abstract: A method includes identifying a contamination region of a collector in a light source, positioning a subset of a plurality of movable light-blocking elements around a periphery of a circular aperture of the light source to compensate for the contamination region, and transmitting light from the light source through the circular aperture.

公开(公告)号：US09704807B2

公开(公告)日：2017-07-11

申请号：US14939251

申请日：2015-11-12

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Deniz E. Civay ,  Erik R. Hosler

IPC: H01L23/535 ,  H01L21/768 ,  H01L23/532

CPC classification number: H01L23/535 ,  H01L21/76802 ,  H01L21/76843 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/53238 ,  H01L23/5328 ,  H01L23/53295

Abstract: A method includes forming a first conductive feature positioned in a first dielectric layer. A conductive polymer layer is formed above the first dielectric layer and the first conductive feature. The conductive polymer layer has a conductive path length. A second dielectric layer is formed above the first dielectric layer. A first via opening is formed in the second dielectric layer and the conductive polymer layer to expose the first conductive feature. A conductive via is formed in the first via opening. The conductive via contacts the first conductive feature and the conductive polymer layer.