公开(公告)号：US20230228940A1

公开(公告)日：2023-07-20

申请号：US17577162

申请日：2022-01-17

Applicant: GlobalFoundries U.S. Inc.

Inventor： Ian Melville ,  Nicholas Polomoff ,  Thomas Houghton ,  Koushik Ramachandran ,  Pallabi Das

IPC: G02B6/122 ,  G02B6/13

CPC classification number: G02B6/1228 ,  G02B6/13 ,  G02B2006/12061

Abstract: Structures for a cavity included in a photonics chip and methods of fabricating a structure for a cavity included in a photonics chip. The structure includes a substrate, a back-end-of-line stack having interlayer dielectric layers on the substrate, and a cavity penetrating through the back-end-of-line stack and into the substrate. The cavity includes first sidewalls and second sidewalls, and the second sidewalls have an alternating arrangement with the first sidewalls to define non-right-angle corners.

公开(公告)号：US11502400B2

公开(公告)日：2022-11-15

申请号：US17319451

申请日：2021-05-13

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Selaka B. Bulumulla ,  Koushik Ramachandran ,  Benjamin V. Fasano

IPC: H01Q1/42 ,  H01Q1/50 ,  H01Q21/06

Abstract: Disclosed are embodiments of a microelectronics package that includes: first and second substrates (each having first and second sides); a chip; and a multi-element antenna connected to the chip. The chip is mounted on the first side of the first substrate. A first antenna element of the antenna is on the second side of the first substrate and electrically connected to the chip. The first side of the second substrate is adhered to the second side of the first substrate (i.e., covering the first antenna element). A second antenna element of the antenna is on the second side of the second substrate overlaying the first antenna element and physically separated therefrom by at least one ultra-low-K dielectric region within the first side of the second substrate and/or the second side of the first substrate. Optionally, the package includes multiple chips and/or multiple antennas. Also disclosed are associated method embodiments.

公开(公告)号：US20210273323A1

公开(公告)日：2021-09-02

申请号：US17319451

申请日：2021-05-13

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Selaka B. Bulumulla ,  Koushik Ramachandran ,  Benjamin V. Fasano

IPC: H01Q1/42 ,  H01Q1/50

Abstract: Disclosed are embodiments of a microelectronics package that includes: first and second substrates (each having first and second sides); a chip; and a multi-element antenna connected to the chip. The chip is mounted on the first side of the first substrate. A first antenna element of the antenna is on the second side of the first substrate and electrically connected to the chip. The first side of the second substrate is adhered to the second side of the first substrate (i.e., covering the first antenna element). A second antenna element of the antenna is on the second side of the second substrate overlaying the first antenna element and physically separated therefrom by at least one ultra-low-K dielectric region within the first side of the second substrate and/or the second side of the first substrate. Optionally, the package includes multiple chips and/or multiple antennas. Also disclosed are associated method embodiments.