公开(公告)号：US11719895B1

公开(公告)日：2023-08-08

申请号：US17679188

申请日：2022-02-24

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian ,  Nicholas Polomoff ,  Keith Donegan ,  Qizhi Liu ,  Steven M. Shank

IPC: G02B6/42 ,  H01S5/02251 ,  G02B1/00

CPC classification number: G02B6/4212 ,  G02B6/421 ,  G02B6/4245 ,  H01S5/02251 ,  G02B1/002

Abstract: Structures including an edge coupler, and methods of fabricating a structure that includes an edge coupler. The structure includes an edge coupler having a waveguide core with an end surface and a longitudinal axis. The end surface defines a plane tilted in a first direction at a first acute angle relative to the longitudinal axis and tilted in a second direction at a second acute angle relative to the longitudinal axis. The second direction differs from the first direction.

公开(公告)号：US11828983B2

公开(公告)日：2023-11-28

申请号：US17577162

申请日：2022-01-17

Applicant: GlobalFoundries U.S. Inc.

Inventor： Ian Melville ,  Nicholas Polomoff ,  Thomas Houghton ,  Koushik Ramachandran ,  Pallabi Das

IPC: G02B6/12 ,  G02B6/10 ,  G02B6/122 ,  G02B6/13

CPC classification number: G02B6/1228 ,  G02B6/13 ,  G02B2006/12061

Abstract: Structures for a cavity included in a photonics chip and methods of fabricating a structure for a cavity included in a photonics chip. The structure includes a substrate, a back-end-of-line stack having interlayer dielectric layers on the substrate, and a cavity penetrating through the back-end-of-line stack and into the substrate. The cavity includes first sidewalls and second sidewalls, and the second sidewalls have an alternating arrangement with the first sidewalls to define non-right-angle corners.

公开(公告)号：US11774689B2

公开(公告)日：2023-10-03

申请号：US17510329

申请日：2021-10-25

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Bartlomiej Jan Pawlak ,  Nicholas Polomoff

IPC: G02B6/42

CPC classification number: G02B6/4243

Abstract: The disclosed subject matter relates generally to photonic integrated circuit chips, semiconductor assemblies or packagings, and a method of forming the same. More particularly, the present disclosure relates to placement of optical fibers on a photonics chip, and a semiconductor assembly including the photonics chip.

公开(公告)号：US20230266544A1

公开(公告)日：2023-08-24

申请号：US17679188

申请日：2022-02-24

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian ,  Nicholas Polomoff ,  Keith Donegan ,  Qizhi Liu ,  Steven M. Shank

IPC: G02B6/42 ,  H01S5/02251

CPC classification number: G02B6/4212 ,  G02B6/421 ,  G02B6/4245 ,  H01S5/02251 ,  G02B1/002

Abstract: Structures including an edge coupler, and methods of fabricating a structure that includes an edge coupler. The structure includes an edge coupler having a waveguide core with an end surface and a longitudinal axis. The end surface defines a plane tilted in a first direction at a first acute angle relative to the longitudinal axis and tilted in a second direction at a second acute angle relative to the longitudinal axis. The second direction differs from the first direction.

公开(公告)号：US20230228940A1

公开(公告)日：2023-07-20

申请号：US17577162

申请日：2022-01-17

Applicant: GlobalFoundries U.S. Inc.

Inventor： Ian Melville ,  Nicholas Polomoff ,  Thomas Houghton ,  Koushik Ramachandran ,  Pallabi Das

IPC: G02B6/122 ,  G02B6/13

CPC classification number: G02B6/1228 ,  G02B6/13 ,  G02B2006/12061

Abstract: Structures for a cavity included in a photonics chip and methods of fabricating a structure for a cavity included in a photonics chip. The structure includes a substrate, a back-end-of-line stack having interlayer dielectric layers on the substrate, and a cavity penetrating through the back-end-of-line stack and into the substrate. The cavity includes first sidewalls and second sidewalls, and the second sidewalls have an alternating arrangement with the first sidewalls to define non-right-angle corners.