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    PHOTONIC INTEGRATED CIRCUIT STRUCTURE WITH POLARIZATION DEVICE FOR HIGH POWER APPLICATIONS
    11.
    发明公开
    PHOTONIC INTEGRATED CIRCUIT STRUCTURE WITH POLARIZATION DEVICE FOR HIGH POWER APPLICATIONS 审中-公开

    公开(公告)号：US20230417989A1

    公开(公告)日：2023-12-28

    申请号：US17808168

    申请日：2022-06-22

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Yusheng Bian

    IPC: G02B6/122 ,  G02B6/126

    CPC classification number: G02B6/1228 ,  G02B6/126

    Abstract: Disclosed is a structure including a polarization device with first and second waveguides. The first waveguide includes a core (e.g., a silicon nitride (SiN) core) suitable for high-power applications. The second waveguide includes: a primary core (e.g., another SiN core), which is positioned laterally adjacent to the core of the first waveguide and suitable for high-power applications, and secondary core(s) stacked vertically with the primary core to steer the optical mode and ensure that mode matching occurs between adjacent first and second coupling sections of the first and second waveguides, respectively, in order to achieve high-power splitter and/or combiner functions. Optionally, the primary and secondary cores of the second waveguide can be tapered at least within the second coupling section to increase the likelihood of mode matching.

    PHOTONICS CHIPS WITH RETICLE STITCHING BY SIDE-BY-SIDE TAPERED SECTIONS
    12.
    发明公开
    PHOTONICS CHIPS WITH RETICLE STITCHING BY SIDE-BY-SIDE TAPERED SECTIONS 审中-公开

    公开(公告)号：US20230400633A1

    公开(公告)日：2023-12-14

    申请号：US17835513

    申请日：2022-06-08

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Yusheng Bian

    IPC: G02B6/122 ,  G02B6/13

    CPC classification number: G02B6/1228 ,  G02B6/13 ,  G02B2006/12061

    Abstract: Structures including a waveguide core and methods of fabricating a structure including a waveguide core. The structure comprises a photonics chip including a first chip region, a first waveguide core in the first chip region, a second chip region, and a second waveguide core in the second chip region. The first chip region adjoins the second chip region along a boundary, the first waveguide core includes a first tapered section and the second waveguide core includes a second tapered section adjacent to the first tapered section. The first tapered section has a first longitudinal axis aligned substantially parallel to the boundary, and the second tapered section has a second longitudinal axis aligned substantially parallel to the boundary.

    Thermal management of an optical component for temperature control
    14.
    发明授权
    Thermal management of an optical component for temperature control 有权

    公开(公告)号：US11828984B2

    公开(公告)日：2023-11-28

    申请号：US17679431

    申请日：2022-02-24

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Theodore Letavic ,  Yusheng Bian ,  Hemant Dixit

    IPC: G02B6/122 ,  G02B6/12

    CPC classification number: G02B6/1228 ,  G02B2006/12135

    Abstract: Structures including an optical component and methods of fabricating a structure including an optical component. The structure includes a substrate, an optical component including a waveguide core, and a back-end-of-line stack including a heat spreader layer. The optical component is positioned in a vertical direction between the substrate and the back-end-of-line stack. The waveguide core contains a first material having a first thermal conductivity, and the heat spreader layer contains a second material having a second thermal conductivity that is greater than the first thermal conductivity of the first material.

    Optical device with low-loss thermally tunable closed-curve optical waveguide
    15.
    发明授权
    Optical device with low-loss thermally tunable closed-curve optical waveguide 有权

    公开(公告)号：US11803012B2

    公开(公告)日：2023-10-31

    申请号：US18055576

    申请日：2022-11-15

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Michal Rakowski ,  Petar I. Todorov ,  Yusheng Bian ,  Won Suk Lee ,  Asif J. Chowdhury ,  Kenneth J. Giewont

    IPC: G02B6/125 ,  G02F1/01 ,  G02B6/136 ,  G02B6/12

    CPC classification number: G02B6/125 ,  G02F1/0147 ,  G02B6/136 ,  G02B2006/12061 ,  G02B2006/12147

    Abstract: Disclosed is a photonic structure and associated method. The structure includes a closed-curve waveguide having a first height, as measured from the top surface of an insulator layer, and an outer curved sidewall that extends essentially vertically the full first height (e.g., to minimize signal loss). The structure includes a closed-curve thermal coupler and a heating element. The closed-curve thermal coupler is thermally coupled to and laterally surrounded by the closed-curve waveguide and has a second height that is less than the first height. In some embodiments, the closed-curve waveguide and the closed-curve thermal coupler are continuous portions of the same semiconductor layer having different thicknesses. The heating element is thermally coupled to the closed-curve thermal coupler and thereby indirectly thermally coupled to the closed-curve waveguide. Thus, the heating element is usable for thermally tuning the closed-curve waveguide via the closed-curve thermal coupler to minimize any temperature-dependent resonance shift (TDRS).

    Optical fiber coupler having hybrid tapered waveguide segments and metamaterial segments
    17.
    发明授权
    Optical fiber coupler having hybrid tapered waveguide segments and metamaterial segments 有权

    公开(公告)号：US11782214B2

    公开(公告)日：2023-10-10

    申请号：US17816804

    申请日：2022-08-02

    Applicant: GlobalFoundries U.S. Inc.

    Inventor： Bo Peng ,  Ajey Poovannummoottil Jacob ,  Yusheng Bian

    IPC: G02B6/26

    CPC classification number: G02B6/26

    Abstract: Optical coupler structures include a waveguide having waveguide metamaterial segments aligned along a first line. A second insulator is on the first insulator and the waveguide metamaterial segments. A coupler structure is in the second insulator and has coupler metamaterial segments aligned along a second line. The first line and the second line are parallel and within a plane. A portion of the waveguide overlaps a portion of the coupler structure. The waveguide metamaterial segments intersect the plane and have first widths perpendicular to the plane, and the first widths have a first taper along the first line. The coupler metamaterial segments intersect the plane and have second widths in the direction perpendicular to the plane. The second widths have a second taper along the second line that is different from the first taper of the first widths where the waveguide overlaps the coupler structure.

    Photonic integrated circuit structure with supplemental waveguide-enhanced optical coupling between primary waveguides
    19.
    发明授权
    Photonic integrated circuit structure with supplemental waveguide-enhanced optical coupling between primary waveguides 有权

    公开(公告)号：US11747559B2

    公开(公告)日：2023-09-05

    申请号：US17411106

    申请日：2021-08-25

    Applicant: GLOBALFOUNDRIES U.S. Inc.

    Inventor： Yusheng Bian

    IPC: G02B6/12 ,  G02B6/122

    CPC classification number: G02B6/1228 ,  G02B2006/12061 ,  G02B2006/12097

    Abstract: Disclosed is a photonic integrated circuit (PIC) structure including: a first primary waveguide, which has a first main body and a first end portion that is tapered; at least one supplemental waveguide positioned laterally adjacent to and extending beyond the first end portion of the first primary waveguide; and a second primary waveguide, which has a second main body and a second end portion that at least partially underlays/overlays the first end portion of the first primary waveguide and the supplemental waveguide(s). The arrangement the end portions of the primary waveguides and the supplemental waveguide(s) allows for mode matching conditions to be met at multiple locations at the interface between the primary waveguides, thereby creating multiple signal paths between the primary waveguides and effectively reducing the light signal power density in any one path to prevent or at least minimize any power-induced damage.

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