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公开(公告)号：US20210141298A1
公开(公告)日：2021-05-13
申请号：US16475758
申请日：2017-01-09
Applicant: GOERTEK, INC
Inventor： Peixuan CHEN , Quanbo ZOU , Xiangxu FENG
Abstract: A projection module and an electronics apparatus are provided. The projection module comprises: a projection chip, having micro semiconductor light emitting devices thereon; and a projection lens unit, wherein the micro semiconductor light emitting devices produce projection light to create a projection image, and the projection lens unit receives the projection image and projects it to a projection surface.
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公开(公告)号：US20200241407A1
公开(公告)日：2020-07-30
申请号：US16483156
申请日：2017-02-06
Applicant: GOERTEK INC.
Inventor： Zhe WANG , Quanbo ZOU , Qinglin SONG , Jialiang YAN , Yujing LIN , Xiaoyang ZHANG
Abstract: A micro laser diode projector comprises: an MEMS scanning device, which rotates around a first axis and a second axis that are orthogonal to each other; and a micro laser diode light source including at least one micro laser diode, wherein the micro laser diode light source is mounted on the MEMS scanning device and rotates around the first and second axes with the MEMS scanning device to project light to a projection screen. An electronics apparatus including the micro laser diode projector is also discussed.
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公开(公告)号：US20190079110A1
公开(公告)日：2019-03-14
申请号：US16078213
申请日：2016-06-02
Applicant: GOERTEK INC.
Inventor： Quanbo ZOU
IPC: G01P15/093 , G01P3/36 , B81C1/00
Abstract: The present invention discloses a MEMS device and electronic apparatus. The MEMS device comprises: a micro-LED; and a movable member, wherein the micro-LED is mounted on the movable member and is configured for moving with the movable member. According to an embodiment of this invention, the signal detection of a MEMS device can be simplified and/or the contents of signals produced by the MEMS device can be enriched.
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公开(公告)号：US20190049367A1
公开(公告)日：2019-02-14
申请号：US16078197
申请日：2016-06-02
Applicant: GOERTEK INC.
Inventor： Quanbo ZOU
CPC classification number: G01N21/255 , G01N21/05 , G01N21/64 , G01N21/7703 , G01N2021/0346 , G01N2201/062 , G01N2201/0626
Abstract: The present invention discloses a monolithic integration device and micro Total Analysis System. The monolithic integration device for sensing comprises: a micro-LED; an optical detector; and a sensing channel, wherein the micro-LED is coupled with the sensing channel and is configured for emitting light into the sensing channel, and the optical detector is coupled with the sensing channel and is configured for sensing the light which is emitted by the micro-LED and travels through at least one part of the sensing channel. An embodiment of this invention proposes a new monolithic integration device for sensing with built-in light source and optical detection system.
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公开(公告)号：US20180139542A1
公开(公告)日：2018-05-17
申请号：US15569078
申请日：2015-04-29
Applicant: GOERTEK INC.
Inventor： Quanbo ZOU , Zhe WANG
CPC classification number: H04R31/00 , H04R7/06 , H04R17/00 , H04R17/10 , H04R31/003 , H04R31/006 , H04R2307/023 , H04R2400/11 , Y10T29/42 , Y10T29/49005
Abstract: A piezoelectric speaker and a method for forming the piezoelectric speaker are provided. The method includes: providing a piezoelectric actuator which includes a piezoelectric layer, a bottom electrode and a top electrode, wherein the bottom electrode and the top electrode are on two opposite surfaces of the piezoelectric layer; providing a speaker frame which includes a base and a bump structure on the base; forming a solder layer on a top surface of the bump structure; and combining the bottom electrode of the piezoelectric actuator with the speaker frame through the solder layer.
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Patent Agency Ranking
公开(公告)号：US20200219855A1
公开(公告)日：2020-07-09
申请号：US16643307
申请日：2017-07-24
Applicant: GOERTEK INC.
Inventor： Peixuan CHEN , Quanbo ZOU , Xiangxu FENG , Tao GAN , Xiaoyang ZHANG
IPC: H01L25/075 , H01L21/78 , H01L33/48 , G09F9/33 , H01L33/00 , H01L21/683
Abstract: A micro-LED display device and a manufacturing method thereof are disclosed. The method comprises: forming micro-LEDs (202) on a carrier substrate (201), wherein the carrier substrate (201) is transparent for a laser which is used in laser lifting-off; filling trenches between the micro-LEDs (202) on the carrier substrate (201) with a holding material (209); performing a laser lifting-off on selected ones of the micro-LEDs (202) to lift off them from the carrier substrate (201), wherein the selected micro-LEDs (202) are held on the carrier substrate (201) through the holding material (209); bonding the selected micro-LEDs (202) onto a receiving substrate (207) of the micro-LED display device; separating the selected micro-LEDs (202) from the carrier substrate (201) to transfer them to the receiving substrate (207).
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公开(公告)号：US20200083197A1
公开(公告)日：2020-03-12
申请号：US16465770
申请日：2016-12-12
Applicant: Goertek, Inc.
Inventor： Quanbo ZOU
IPC: H01L25/075 , H01L21/66 , H01L33/00 , H01L33/38
Abstract: A display device manufacturing method, display device and electronics apparatus. The display device manufacturing method comprises: forming the vertical micro-LEDs (200) on a growth substrate (201) (S1100); forming a first electrode (207) on top of each of the vertical micro-LEDs (200) (S1200); forming a second electrode (208) on side surface of each of the vertical micro-LEDs (200) (S1300); and transferring the vertical micro-LEDs (200) from the growth substrate (201) to a display substrate (301) of a display device (S1400). Can reduce the back-end fabrication process on a display substrate after transferring.
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公开(公告)号：US20190115151A1
公开(公告)日：2019-04-18
申请号：US15739950
申请日：2017-10-18
Applicant: Goertek Inc.
Inventor： Quanbo ZOU
IPC: H01F41/074 , H02J50/10 , H01F5/00
Abstract: A flat coil, a manufacturing method thereof and an electronic apparatus are disclosed. The manufacturing method comprises: rolling a metal foil lamination onto a carrier roller to form a foil rod, wherein the metal foil lamination includes at least one layer of metal foil; sliding the foil rod from the carrier roller; slicing the foil rod into thin disks; and processing the thin disks to form at least one flat coil. According to this disclosure, a new solution for a flat coil is proposed.
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公开(公告)号：US20190058956A1
公开(公告)日：2019-02-21
申请号：US16077638
申请日：2016-08-22
Applicant: GOERTEK INC.
Inventor： Quanbo ZOU
Abstract: The present invention discloses a capacitive MEMS microphone and an electronic apparatus. The capacitive MEMS microphone comprises: a diaphragm; and a substrate, wherein a cavity is formed between the diaphragm and the substrate, and the cavity is filed with an elastic body. According to an embodiment of this invention, an elastic body is adopted in a capacitive MEMS microphone to replace the air gap of the prior art such that the SNR of the microphone is increased.
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公开(公告)号：US20170265013A1
公开(公告)日：2017-09-14
申请号：US15127002
申请日：2014-08-26
Applicant: GOERTEK INC.
Inventor： Quanbo ZOU
Abstract: Provided is a PCB speaker and a method for micromachining the speaker diaphragm on PCB substrate, the method for micromachining the speaker diaphragm on PCB substrate comprises: providing metal paths and at least one through hole on the PCB substrate; providing a patterned sacrificial layer on the PCB substrate, the sacrificial layer covering all the through holes on the PCB substrate; providing a diaphragm layer on the sacrificial layer through depositing, mounting or laminating, the diaphragm layer covering the sacrificial layer and electrically connected with the metal paths on the PCB substrate, thereby forming a diaphragm layer; and releasing the sacrificial layer and the diaphragm layer remains. With the micromachining method for the above PCB substrate and the diaphragm, the production cost of the speaker can be lowered, and the reliability of the product can be improved at the same time.
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